SCHEMBL1643003

SCHEMBL1643003

CC[PH](=O)Oc1ccccc1

nearest known ligand 0.42

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
L3MBTL1 Q9Y468 2/20 0.42
LTA4H P09960 3/20 0.39
CA4 P22748 1/20 0.39
LMNA P02545 1/20 0.38
HTT P42858 1/20 0.38
ALDH1A1 P00352 1/20 0.37
TSHR P16473 1/20 0.36
NPC1 O15118 1/20 0.36
HPGD P15428 1/20 0.36
CRHBP P24387 1/20 0.36
RAB9A P51151 1/20 0.36
CRHR2 Q13324 1/20 0.36
KCNA3 P22001 1/20 0.36
TDP1 Q9NUW8 1/20 0.35
ALOX15 P16050 1/20 0.35
CHRNB2 P17787 1/20 0.35
CHRNB4 P30926 1/20 0.35
CHRNA3 P32297 1/20 0.35
CHRNA7 P36544 1/20 0.35
CHRNA4 P43681 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL25331556 0.98 L3MBTL1 (0.41) L3MBTL1LTA4HCA4LMNAHTT
SCHEMBL28037544 0.98 L3MBTL1 (0.41) L3MBTL1LTA4HCA4LMNAHTT
SCHEMBL28037893 0.98 L3MBTL1 (0.41) L3MBTL1LTA4HCA4LMNAHTT
SCHEMBL28037545 0.98 L3MBTL1 (0.41) L3MBTL1LTA4HCA4LMNAHTT
SCHEMBL28037922 0.98 L3MBTL1 (0.41) L3MBTL1LTA4HCA4LMNAHTT
Pyrimidine SCHEMBL28866480 0.87 L3MBTL1 (0.35) L3MBTL1LTA4HLMNAHTTALDH1A1
SCHEMBL1727050 0.83 LTA4H (0.38) L3MBTL1LTA4HCA4LMNATSHR
SCHEMBL4242692 0.80 ACHE (0.41) L3MBTL1LMNAHTTTSHRTDP1
SCHEMBL1726009 0.79 LTA4H (0.44) LTA4H
SCHEMBL4250545 0.78 SMN1; SMN2 (0.44) LMNAALDH1A1NPC1HPGDRAB9A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 111 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-114478624-B Telomer of diethyl aluminum phosphinate and preparation method thereof 兰州瑞朴科技有限公司 2024-07-02 CN claimed
CN-117836384-A Single layer adhesive film and related articles 3M创新有限公司 2024-04-05 CN claimed
CN-113402775-B Antimony-based composite flame retardant and preparation method thereof 湖南娄底华星锑业有限公司 2022-05-20 CN claimed
CN-114478624-A Telomer of aluminum diethylphosphinate and preparation method thereof 兰州瑞朴科技有限公司 2022-05-13 CN claimed
CN-113402775-A Antimony-based composite flame retardant and preparation method thereof 湖南娄底华星锑业有限公司 2021-09-17 CN claimed
CN-105017311-B Rare earth phenylethyl phosphinate, and synthesis method and application thereof 广东华南精细化工研究院有限公司 2017-04-19 CN claimed
US-8633127-B2 Selective hydrogenation catalyst and methods of making and using same CHEVRON PHILLIPS CHEMICAL COMPANY LP (US) 2014-01-21 US claimed
US-12516149-B2 Flame retardant epoxy resin composition TORAY INDUSTRIES, INC. (JP) 2026-01-06 US disclosed
US-12296304-B2 Membrane for water filtration AQUAPORIN A/S (DK) 2025-05-13 US disclosed
EP-4277731-B1 PROCESS FOR PREPARING A MEMBRANE AQUAPORIN AS (DK) 2024-10-09 EP disclosed
US-20240253338-A1 TRANSPARENT LAMINATE FOR RADIATIVE COOLING AND RADIATIVE COOLING MATERIAL INCLUDING THE SAME HYUNDAI MOTOR COMPANY (KR) 2024-08-01 US disclosed
CN-115109310-B Flame retardant and corresponding flame-retardant plastic product 兰州瑞朴科技有限公司 2024-07-02 CN disclosed
CN-114478624-B Telomer of diethyl aluminum phosphinate and preparation method thereof 兰州瑞朴科技有限公司 2024-07-02 CN disclosed
WO-2001078882-A2 COMPOSITE MEMBRANE AND METHOD FOR MAKING THE SAME DOW GLOBAL TECHNOLOGIES INC. (US) 2001-10-25 WO disclosed
US-5648171-A Epoxy resin mixtures containing phosphorus acid/epoxy resin adducts SIEMENS AKTIENGESELLSCHAFT (DE) 1997-07-15 US disclosed
US-5191000-A FLAMEPROOFED, NON-DRIPPING POLYALKYLENE TEREPHTHALATE MOLDING COMPOUNDS BAYER AKTIENGESELLSCHAFT (DE) 1993-03-02 US disclosed
EP-0120981-B1 RESIN ENCAPSULATION TYPE SEMICONDUCTOR DEVICE KABUSHIKI KAISHA TOSHIBA (JP) 1988-10-12 EP disclosed
US-4617584-A GOOD HUMIDITY RESISTANCE, CORROSION RESITANCE; CURED NOVOLAC TYPE EPOXY RESIN, NOVOLAC PHENOLIC RESIN AND ORGANIC PHOSPHOROUS COMPOUND TOKYO SHIBAURA DENKI KABUSHIKI KAISHA (JP) 1986-10-14 US disclosed
EP-0039155-B1 POLYESTER MOLDING COMPOSITION, PRODUCTION THEREOF AND MOLDED ARTICLES PRODUCED THEREFROM Asahi Kasei Kogyo Kabushiki Kaisha (JP) 1985-10-09 EP disclosed
EP-0120981-A1 Resin encapsulation type semiconductor device KABUSHIKI KAISHA TOSHIBA (JP) 1984-10-10 EP disclosed