Predicted protein targets (top 7)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | TPSAB1 | Q15661 | 17/20 | 0.47 |
| ▸ | TPSD1 | Q9BZJ3 | 17/20 | 0.47 |
| ▸ | TPSG1 | Q9NRR2 | 17/20 | 0.47 |
| ▸ | PRSS1 | P07477 | 4/20 | 0.45 |
| ▸ | F2 | P00734 | 2/20 | 0.45 |
| ▸ | HSD11B1 | P28845 | 1/20 | 0.44 |
| ▸ | BCHE | P06276 | 1/20 | 0.41 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL12791455 | 0.98 | HSD11B1 (0.47) | TPSAB1TPSD1TPSG1PRSS1F2 | |
| SCHEMBL16467967 | 0.95 | HSD11B1 (0.48) | TPSAB1TPSD1TPSG1PRSS1F2 | |
| SCHEMBL13016393 | 0.93 | HSD11B1 (0.52) | TPSAB1TPSD1TPSG1PRSS1F2 | |
| SCHEMBL12991729 | 0.93 | HSD11B1 (0.52) | TPSAB1TPSD1TPSG1PRSS1F2 | |
| SCHEMBL8275268 | 0.91 | TPSAB1 (0.51) | TPSAB1TPSD1TPSG1PRSS1F2 | |
| SCHEMBL18855837 | 0.85 | TPSAB1 (0.47) | TPSAB1TPSD1TPSG1PRSS1F2 | |
| SCHEMBL772357 | 0.84 | TPSAB1 (0.47) | TPSAB1TPSD1TPSG1PRSS1F2 | |
| SCHEMBL771109 | 0.84 | TPSAB1 (0.43) | TPSAB1TPSD1TPSG1PRSS1F2 | |
| SCHEMBL12936787 | 0.84 | TPSAB1 (0.43) | TPSAB1TPSD1TPSG1PRSS1F2 | |
| SCHEMBL21428432 | 0.84 | LMNA (0.47) | TPSAB1TPSD1TPSG1PRSS1F2 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 14 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-119955091-A | Polymer, positive-type negative-type photosensitive resin composition, pattern forming method, cured film forming method, interlayer insulating film, surface protective film, and electronic component | 信越化学工业株式会社 | 2025-05-09 | — | — | CN | disclosed |
| CN-118210199-A | Photosensitive resin composition, cured film pattern, and method for producing same | 奇美实业股份有限公司 | 2024-06-18 | — | — | CN | disclosed |
| CN-115113484-A | Positive photosensitive resin composition, positive photosensitive dry film, method for producing the same, and method for forming pattern | 信越化学工业株式会社 | 2022-09-27 | — | — | CN | disclosed |
| CN-107561863-B | Positive photosensitive resin composition and application thereof | 奇美实业股份有限公司 | 2022-09-16 | — | — | CN | disclosed |
| CN-114253069-A | Photosensitive resin composition, pattern forming method, cured film forming method, interlayer insulating film, and surface protective film | 信越化学工业株式会社 | 2022-03-29 | — | — | CN | disclosed |
| CN-104950580-B | Photosensitive polysiloxane composition and application thereof | 奇美实业股份有限公司 | 2020-01-03 | — | — | CN | disclosed |
| US-10162260-B2 | Photosensitive resin composition, protective film, and liquid crystal display element | CHI MEI CORPORATION (TW) | 2018-12-25 | — | — | US | disclosed |
| CN-107561863-A | Positive photosensitive resin composition and application thereof | 奇美实业股份有限公司 | 2018-01-09 | — | — | CN | disclosed |
| CN-106909028-A | Photosensitive resin composition, protective film and liquid crystal display element | 奇美实业股份有限公司 | 2017-06-30 | — | — | CN | disclosed |
| US-20170168390-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PROTECTIVE FILM, AND LIQUID CRYSTAL DISPLAY ELEMENT | CHI MEI CORPORATION (TW) | 2017-06-15 | — | — | US | disclosed |
| US-20150293449-A1 | PHOTOSENSITIVE POLYSILOXANE COMPOSITION AND USES THEREOF | CHI MEI CORPORATION (TW) | 2015-10-15 | — | — | US | disclosed |
| CN-104950580-A | Photosensitive polysiloxane composition and application thereof | CHI MEI CORP | 2015-09-30 | — | — | CN | disclosed |
| CN-104375381-A | Photosensitive polysiloxane composition, film formed by photosensitive polysiloxane composition and device comprising film | CHI MEI CORP | 2015-02-25 | — | — | CN | disclosed |
| US-20150050596-A1 | PHOTOSENSITIVE POLYSILOXANE COMPOSITION AND USES THEREOF | CHI MEI CORPORATION (TW) | 2015-02-19 | — | — | US | disclosed |