⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL11226080 | 0.78 | CA5A (0.33) | — | |
| SCHEMBL3277141 | 0.73 | — | — | |
| SCHEMBL15204059 | 0.71 | — | — | |
| SCHEMBL4352167 | 0.69 | — | — | |
| SCHEMBL313192 | 0.67 | — | — | |
| SCHEMBL126328 | 0.67 | — | — | |
| SCHEMBL5354 | 0.66 | — | — | |
| Trifluoromethanesulfonic Acid SCHEMBL542816 | 0.65 | ALDH1A1 (0.33) | — | |
| SCHEMBL220969 | 0.65 | — | — | |
| SCHEMBL1644994 | 0.65 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 14 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-3178968-B1 | COPPER-NICKEL ALLOY ELECTROPLATING BATH | DIPSOL CHEM (JP) | 2019-09-04 | — | — | EP | disclosed |
| EP-3208364-B1 | COPPER-NICKEL ALLOY ELECTROPLATING DEVICE | DIPSOL CHEM (JP) | 2019-08-07 | — | — | EP | disclosed |
| US-10316421-B2 | Copper-nickel alloy electroplating bath | DIPSOL CHEMICALS CO., LTD. (JP) | 2019-06-11 | — | — | US | disclosed |
| US-9828686-B2 | Copper-nickel alloy electroplating bath and plating method | DIPSOL CHEMICALS CO., LTD. (JP) | 2017-11-28 | — | — | US | disclosed |
| US-20170241040-A1 | COPPER-NICKEL ALLOY ELECTROPLATING DEVICE | DIPSOL CHEMICALS CO., LTD. (JP) | 2017-08-24 | — | — | US | disclosed |
| US-20170241031-A1 | COPPER-NICKEL ALLOY ELECTROPLATING BATH | DIPSOL CHEMICALS CO., LTD. (JP) | 2017-08-24 | — | — | US | disclosed |
| EP-3208364-A1 | COPPER-NICKEL ALLOY ELECTROPLATING DEVICE | Dipsol Chemicals Co., Ltd. (JP) | 2017-08-23 | — | — | EP | disclosed |
| EP-3178968-A1 | COPPER-NICKEL ALLOY ELECTROPLATING BATH | Dipsol Chemicals Co., Ltd. (JP) | 2017-06-14 | — | — | EP | disclosed |
| CN-104321470-B | The electroplate liquid and coating method of corronil | 迪普索尔化学株式会社 | 2017-03-15 | — | — | CN | disclosed |
| EP-2840169-B1 | COPPER-NICKEL ALLOY ELECTROPLATING BATH AND PLATING METHOD | DIPSOL CHEM (JP) | 2017-03-01 | — | — | EP | disclosed |
| CN-104726902-A | Reaction products of guanidine compounds or salts thereof, polyepoxides and polyhalides | ROHM & HAAS ELECT MAT | 2015-06-24 | — | — | CN | disclosed |
| US-20150090600-A1 | COPPER-NICKEL ALLOY ELECTROPLATING BATH AND PLATING METHOD | DIPSOL CHEMICALS CO., LTD. (JP) | 2015-04-02 | — | — | US | disclosed |
| EP-2840169-A1 | COPPER-NICKEL ALLOY ELECTROPLATING BATH AND PLATING METHOD | Dipsol Chemicals Co., Ltd. (JP) | 2015-02-25 | — | — | EP | disclosed |
| CN-104321470-A | Copper-nickel alloy electroplating bath and plating method | DIPSOL CHEM | 2015-01-28 | — | — | CN | disclosed |