Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | MEN1 | O00255 | 3/20 | 0.41 |
| ▸ | KMT2A | Q03164 | 3/20 | 0.41 |
| ▸ | MAPK1 | P28482 | 2/20 | 0.38 |
| ▸ | ALDH1A1 | P00352 | 3/20 | 0.35 |
| ▸ | ALOX15 | P16050 | 1/20 | 0.35 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.35 |
| ▸ | TSHR | P16473 | 3/20 | 0.33 |
| ▸ | CYP2B6 | P20813 | 1/20 | 0.32 |
| ▸ | TAAR1 | Q96RJ0 | 1/20 | 0.31 |
| ▸ | TP53 | P04637 | 2/20 | 0.31 |
| ▸ | MAPT | P10636 | 2/20 | 0.31 |
| ▸ | HPGD | P15428 | 2/20 | 0.31 |
| ▸ | CYP1A2 | P05177 | 1/20 | 0.31 |
| ▸ | PPARG | P37231 | 1/20 | 0.31 |
| ▸ | HIF1A | Q16665 | 1/20 | 0.31 |
| ▸ | CYP3A4 | P08684 | 2/20 | 0.31 |
| ▸ | ESR1 | P03372 | 2/20 | 0.31 |
| ▸ | ESR2 | Q92731 | 2/20 | 0.31 |
| ▸ | CHRM3 | P20309 | 1/20 | 0.30 |
| ▸ | LMNA | P02545 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL28629123 | 0.87 | MEN1 (0.43) | MEN1KMT2AMAPK1ALDH1A1ALOX15 | |
| SCHEMBL3474878 | 0.77 | MEN1 (0.42) | MEN1KMT2AMAPK1ALDH1A1ALOX15 | |
| SCHEMBL10773125 | 0.74 | MEN1 (0.41) | MEN1KMT2AMAPK1ALDH1A1ALOX15 | |
| SCHEMBL7161862 | 0.72 | TSHR (0.38) | MEN1KMT2AMAPK1ALDH1A1ALOX15 | |
| SCHEMBL14003863 | 0.72 | MAPK1 (0.42) | MEN1KMT2AMAPK1ALDH1A1ALOX15 | |
| SCHEMBL17711596 | 0.72 | TSHR (0.38) | MEN1KMT2AMAPK1ALDH1A1ALOX15 | |
| SCHEMBL20261897 | 0.72 | KMT2A (0.41) | MEN1KMT2AMAPK1ALDH1A1ALOX15 | |
| SCHEMBL10613864 | 0.71 | TSHR (0.37) | MEN1KMT2AMAPK1ALDH1A1ALOX15 | |
| SCHEMBL4439738 | 0.70 | TDP1 (0.39) | MEN1KMT2AMAPK1ALDH1A1ALOX15 | |
| SCHEMBL133959 | 0.69 | TSHR (0.39) | MEN1KMT2AMAPK1ALDH1A1TDP1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 193 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-4347685-A1 | HYDROGENATED POLYETHER-MODIFIED AMINO-FUNCTIONAL POLYBUTADIENES AND PROCESS FOR THEIR PREPARATION | Evonik Operations GmbH (DE) | 2024-04-10 | — | — | EP | claimed |
| EP-4294853-A1 | AMINOFUNCTIONAL POLYBUTADIENE WITH LATERAL POLYETHER RADICALS AND METHOD FOR PRODUCING SAME | Evonik Operations GmbH (DE) | 2023-12-27 | — | — | EP | claimed |
| WO-2022248267-A1 | HYDROGENATED POLYETHER-MODIFIED AMINO-FUNCTIONAL POLYBUTADIENES AND PROCESS FOR THEIR PREPARATION | EVONIK OPERATIONS GMBH (DE) | 2022-12-01 | — | — | WO | claimed |
| WO-2022175140-A1 | AMINOFUNCTIONAL POLYBUTADIENE WITH LATERAL POLYETHER RADICALS AND METHOD FOR PRODUCING SAME | EVONIK OPERATIONS GMBH (DE) | 2022-08-25 | — | — | WO | claimed |
| US-10759982-B2 | Refrigerator oil | JXTG NIPPON OIL & ENERGY CORPORATION (JP) | 2020-09-01 | — | — | US | claimed |
| WO-2026100491-A1 | EPOXY RESIN COMPOSITION, CURED OBJECT, UNDERFILL MATERIAL, ADHESIVE, AND SEMICONDUCTOR PACKAGE AND PRODUCTION METHOD THEREFOR | 旭化成株式会社 | 2026-05-15 | — | — | WO | disclosed |
| WO-2026100487-A1 | UNDERFILL MATERIAL, CURED PRODUCT, SEMICONDUCTOR PACKAGE, AND METHOD FOR MANUFACTURING SAME | 旭化成株式会社 | 2026-05-15 | — | — | WO | disclosed |
| EP-4660215-A1 | ONE-COMPONENT THERMOSETTING EPOXY ADHESIVE WITH IMPROVED ADHESION AND IMPACT PEEL STRENGTH | Sika Technology AG (CH) | 2025-12-10 | — | — | EP | disclosed |
| EP-4636033-A1 | HEAT-CURING EPOXY RESIN COMPOSITIONS WITH IMPROVED IMPACT PEEL VALUES | Sika Technology AG (CH) | 2025-10-22 | — | — | EP | disclosed |
| EP-4631998-A1 | USE OF EGGSHELL OR SEASHELL PARTICLES TO IMPROVE PROPERTIES OF HEAT-CURING EPOXY RESIN COMPOSITIONS | Sika Technology AG (CH) | 2025-10-15 | — | — | EP | disclosed |
| EP-4588976-A1 | HEAT-CURING EPOXY RESIN COMPOSITION WITH HIGH CORROSION RESISTANCE | Sika Technology AG (CH) | 2025-07-23 | — | — | EP | disclosed |
| EP-4556503-A1 | HEAT-CURING EPOXY RESIN COMPOSITION SUITABLE FOR PRE-CURING PROCESSES WITHOUT ADDITIONAL METAL JOINING TECHNIQUES | Sika Technology AG (CH) | 2025-05-21 | — | — | EP | disclosed |
| US-5286834-A | Condensing bisphenol A and biphenol with a carbonate diester | GE PLASTICS JAPAN, LTD. (JP) | 1994-02-15 | — | — | US | disclosed |
| US-5276109-A | Molding materials with transparency | GENERAL ELECTRIC COMPANY (US) | 1994-01-04 | — | — | US | disclosed |
| EP-0544407-A1 | Copolymeric polycarbonates | GE PLASTICS JAPAN LIMITED (JP) | 1993-06-02 | — | — | EP | disclosed |
| EP-0520806-A2 | Optical polycarbonate compositions | GE PLASTICS JAPAN LIMITED (JP) | 1992-12-30 | — | — | EP | disclosed |
| EP-0520805-A2 | Polycarbonate production method | GE PLASTICS JAPAN LIMITED (JP) | 1992-12-30 | — | — | EP | disclosed |
| EP-0520804-A2 | Copolymeric polycarbonate production method | GE PLASTICS JAPAN LIMITED (JP) | 1992-12-30 | — | — | EP | disclosed |
| EP-0435124-A2 | Processes for preparing aromatic polycarbonates | GE PLASTICS JAPAN LIMITED (JP) | 1991-07-03 | — | — | EP | disclosed |
| US-4940647-A | Photopolymerizable compositions a leuco dye and a leuco dye stabilizer | HOECHST AKTIENGESELLSCHAFT (DE) | 1990-07-10 | — | — | US | disclosed |