SCHEMBL1666472

SCHEMBL1666472

CCC=CC1CC=CC2C(=O)OC(=O)C12

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL10385193 0.77
SCHEMBL2297002 0.76 KDM4E (0.31)
SCHEMBL284839 0.76 MEN1 (0.35)
SCHEMBL7202230 0.71
SCHEMBL15466 0.71 KDM4E (0.33)
SCHEMBL10343798 0.71 KDM4E (0.33)
SCHEMBL7202059 0.69 TP53 (0.34)
SCHEMBL9516207 0.67 KDM4E (0.33)
SCHEMBL10813414 0.67 KDM4E (0.33)
SCHEMBL10432287 0.67 CYP3A4 (0.35)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 25 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1214191-B1 LAMINATE COMPRISING TREATED COPPER FOIL AND PROCESS FOR MAKING IT NIKKO MATERIALS USA INC (US) 2011-04-06 EP disclosed
EP-1214191-A4 TREATED COPPER FOIL AND PROCESS FOR MAKING TREATED COPPER FOIL NIKKO MATERIALS USA INC (US) 2006-11-08 EP disclosed
US-6894116-B2 S,S′-bis-(α, α′—disubstituted—α″—acetic acid)—trithiocarbonates and polymers thereof for toughening thermosetting resins NOVEON IP HOLDINGS CORP. (US) 2005-05-17 US disclosed
EP-1218178-B1 AN ADHESION PROMOTING LAYER FOR USE WITH EPOXY PREPREGS GA TEK INC (US) 2004-01-07 EP disclosed
US-20030187138-A1 S,s' -bis-(alpha, alpha' - disubstituted - alpha\" - acetic acid) - trithiocarbonates and polymers thereof for toughening thermosetting resins LUBRIZOL ADVANCED MATERIALS, INC. 2003-10-02 US disclosed
EP-1218178-A4 AN ADHESION PROMOTING LAYER FOR USE WITH EPOXY PREPREGS GA TEK INC (US) 2003-01-08 EP disclosed
US-6426146-B1 OVERCOATED WITH ZINC OXIDE GA-TEK INC. 2002-07-30 US disclosed
EP-1218178-A1 AN ADHESION PROMOTING LAYER FOR USE WITH EPOXY PREPREGS Ga-Tek Inc. (US) 2002-07-03 EP disclosed
EP-1214191-A1 TREATED COPPER FOIL AND PROCESS FOR MAKING TREATED COPPER FOIL Ga-Tek Inc. (US) 2002-06-19 EP disclosed
WO-2001019607-A1 AN ADHESION PROMOTING LAYER FOR USE WITH EPOXY PREPREGS GA-TEK INC. (US) 2001-03-22 WO disclosed
US-5650477-A Liquid reactive thermosetting compositions and process for their cross-linking ENICHEM S.P.A. (IT) 1997-07-22 US disclosed
EP-0720995-A2 Liquid reactive thermosetting compositions and process for their crosslinking ENICHEM S.p.A. (IT) 1996-07-10 EP disclosed
US-5280068-A Containing carboxy, amine, or epoxy terminated polymer THE B.F. GOODRICH COMPANY (US) 1994-01-18 US disclosed
EP-0526575-A1 EPOXY RESIN SYSTEMS MODIFIED WITH LOW VISCOSITY STATISTICAL MONOFUNCTIONAL REACTIVE POLYMERS THE B.F. GOODRICH COMPANY (US) 1993-02-10 EP disclosed
US-5157077-A Carboxyl, amine or epoxy-terminated reactive polymers THE B. F. GOODRICH COMPANY (US) 1992-10-20 US disclosed
US-5140068-A Toughness, adhesion, elongation THE B. F. GOODRICH COMPANY (US) 1992-08-18 US disclosed
WO-1991017213-A1 EPOXY RESIN SYSTEMS MODIFIED WITH LOW VISCOSITY STATISTICAL MONOFUNCTIONAL REACTIVE POLYMERS THE B.F. GOODRICH COMPANY (US) 1991-11-14 WO disclosed
US-4923908-A FILLERS. ENCAPSULATION, LOW DISSIPATION FACTOR ZENITH ELECTRONICS CORPORATION (US) 1990-05-08 US disclosed
US-4091048-A Powder coating compositions containing glycidyl ester copolymers and organic carboxylic acid anhydride crosslinking agent FORD MOTOR COMPANY (US) 1978-05-23 US disclosed
US-3970608-A Epoxidized acetylene-conjugated diene random copolymer and the curable composition comprising the same BRIDGESTONE TIRE COMPANY LIMITED (JA) 1976-07-20 US disclosed