Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | MEN1 | O00255 | 4/20 | 0.35 |
| ▸ | KMT2A | Q03164 | 4/20 | 0.35 |
| ▸ | NPSR1 | Q6W5P4 | 4/20 | 0.35 |
| ▸ | MAPT | P10636 | 2/20 | 0.35 |
| ▸ | ATM | Q13315 | 1/20 | 0.35 |
| ▸ | POLB | P06746 | 1/20 | 0.33 |
| ▸ | HTT | P42858 | 1/20 | 0.31 |
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.31 |
| ▸ | GMNN | O75496 | 1/20 | 0.31 |
| ▸ | PPM1B | O75688 | 1/20 | 0.31 |
| ▸ | LMNA | P02545 | 1/20 | 0.31 |
| ▸ | PPP1CC | P36873 | 1/20 | 0.31 |
| ▸ | TFPI2 | P48307 | 1/20 | 0.31 |
| ▸ | RAB9A | P51151 | 1/20 | 0.31 |
| ▸ | PPP5C | P53041 | 1/20 | 0.31 |
| ▸ | PPP1CA | P62136 | 1/20 | 0.31 |
| ▸ | PMP22 | Q01453 | 1/20 | 0.31 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.31 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.31 |
| ▸ | TP53 | P04637 | 1/20 | 0.31 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL7202230 | 0.87 | — | — | |
| SCHEMBL7202059 | 0.84 | TP53 (0.34) | MEN1KMT2AHTTTP53NFKB1 | |
| SCHEMBL10343798 | 0.77 | KDM4E (0.33) | MEN1KMT2AKDM4EGMNNPPM1B | |
| SCHEMBL15466 | 0.77 | KDM4E (0.33) | MEN1KMT2AKDM4EGMNNPPM1B | |
| SCHEMBL1666472 | 0.76 | — | — | |
| Methane SCHEMBL28278679 | 0.75 | KDM4E (0.32) | KDM4EGMNNPPM1BLMNAPPP1CC | |
| SCHEMBL10813414 | 0.73 | KDM4E (0.33) | KDM4EGMNNPPM1BLMNAPPP1CC | |
| SCHEMBL9516207 | 0.73 | KDM4E (0.33) | KDM4EGMNNPPM1BLMNAPPP1CC | |
| SCHEMBL10432287 | 0.72 | CYP3A4 (0.35) | MAPTKDM4EGMNNPPM1BLMNA | |
| SCHEMBL10385193 | 0.71 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 207 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-106233205-B | Photosensitive element, laminate, permanent mask resist, method for producing same, and method for producing semiconductor package | 日立化成株式会社 | 2020-06-23 | — | — | CN | claimed |
| US-8716413-B2 | Photocurable composition | HUNTSMAN ADVANCED MATERIALS AMERICAS LLC (US) | 2014-05-06 | — | — | US | claimed |
| US-20110200950-A1 | PHOTOCURABLE COMPOSITION | HUNTSMAN INTERNATIONAL LLC (US) | 2011-08-18 | — | — | US | claimed |
| EP-2331599-A1 | PHOTOCURABLE COMPOSITION | Huntsman Advanced Materials (Switzerland) GmbH (CH) | 2011-06-15 | — | — | EP | claimed |
| WO-2010034531-A1 | PHOTOCURABLE COMPOSITION | HUNTSMAN ADVANCED MATERIALS (SWITZERLAND) GMBH (CH) | 2010-04-01 | — | — | WO | claimed |
| EP-2168994-A1 | Photocurable composition | Huntsman Advanced Materials (Switzerland) GmbH (CH) | 2010-03-31 | — | — | EP | claimed |
| US-5100767-A | Epoxy resins | TAMURA KAKEN CO., LTD. (JP) | 1992-03-31 | — | — | US | claimed |
| US-12606662-B2 | Photosensitive resin composition, photosensitive resin film, multilayered printed wiring board, semiconductor package, and method for producing multilayered printed wiring board | RESONAC CORPORATION (JP) | 2026-04-21 | — | — | US | disclosed |
| EP-4692934-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN FILM, PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE | Resonac Corporation (JP) | 2026-02-11 | — | — | EP | disclosed |
| US-12498636-B2 | Photosensitive resin composition, photosensitive resin film, multilayered printed wiring board, semiconductor package, and method for producing multilayered printed wiring board | RESONAC CORPORATION (JP) | 2025-12-16 | — | — | US | disclosed |
| EP-3978544-B1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN FILM, PRINTED WIRING BOARD, SEMICONDUCTOR PACKAGE, AND METHOD FOR PRODUCING PRINTED WIRING BOARD | RESONAC CORP (JP) | 2025-10-08 | — | — | EP | disclosed |
| US-20250306465-A1 | PHOTOSENSITIVE MULTILAYER RESIN FILM, PRINTED WIRING BOARD, SEMICONDUCTOR PACKAGE, AND METHOD FOR PRODUCING PRINTED WIRING BOARD | RESONAC CORP (JP) | 2025-10-02 | — | — | US | disclosed |
| US-20250297129-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN FILM, PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE | RESONAC CORPORATION (JP) | 2025-09-25 | — | — | US | disclosed |
| US-5034493-A | Comprising the reaction product obtained by heating a mixture of a zinc carboxylate, a carboxylic anhydride aknd a phenol or glycidyl ether or ester; colorless; storage stability; fast c uring; optics | NEW JAPAN CHEMICAL CO., LTD. (JP) | 1991-07-23 | — | — | US | disclosed |
| EP-0032745-B1 | ETHER IMIDES AND PROCESS FOR PRODUCING THE SAME | Hitachi, Ltd. (JP) | 1987-01-07 | — | — | EP | disclosed |
| US-4460783-A | AMIDATION, CYCLIZATION, DEHYDRATION | HITACHI, LTD. (JP) | 1984-07-17 | — | — | US | disclosed |
| EP-0032745-A2 | Ether imides and process for producing the same | Hitachi, Ltd. (JP) | 1981-07-29 | — | — | EP | disclosed |
| EP-0028419-A2 | Imides and process for producing the same | Hitachi, Ltd. (JP) | 1981-05-13 | — | — | EP | disclosed |
| US-4097423-A | POLYISOCYANATE, ALKALI METAL SILICATE, CONSTRUCTION MATERIALS | BAYER AKTIENGESELLSCHAFT (DT) | 1978-06-27 | — | — | US | disclosed |
| US-3959348-A | OR CARBOXYLATE GROUPSINORGANIC-ORGANIC PLASTICS | BAYER AKTIENGESELLSCHAFT (DT) | 1976-05-25 | — | — | US | disclosed |
Patent text — is the patent's own abstract consistent with the prediction?
For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.
| Patent | Title | Text reads most about | Predicted target · text-rank |
|---|---|---|---|
| US-12606662-B2 | Photosensitive resin composition, photosensitive resin film, multilayered printed wiring board, semiconductor package, and method for producing multilayered printed wiring board | MMAB, ELOB, RARB | MEN1 1583/4885KMT2A 1867/4885NPSR1 4789/4885 |
“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.