⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL4830263 | 0.70 | HPRT1 (0.32) | — | |
| SCHEMBL20300628 | 0.70 | CYP1A2 (0.42) | — | |
| SCHEMBL15987523 | 0.69 | GPR3 (0.48) | — | |
| SCHEMBL15987660 | 0.69 | KDM4E (0.42) | — | |
| SCHEMBL1666285 | 0.65 | KDM4E (0.48) | — | |
| SCHEMBL1666094 | 0.64 | ALDH1A1 (0.48) | — | |
| SCHEMBL2409866 | 0.62 | — | — | |
| Triphenylene SCHEMBL25597 | 0.62 | HPRT1 (0.57) | — | |
| Triphenylene SCHEMBL311118 | 0.62 | HPRT1 (0.57) | — | |
| SCHEMBL1006251 | 0.62 | HPRT1 (0.57) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 13 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20240122065-A1 | METAL PATTERNING MATERIAL, AMINE COMPOUND, ELECTRONIC DEVICE, AND METHOD FOR FORMING METAL PATTERN | TOSOH CORPORATION (JP) | 2024-04-11 | — | — | US | claimed |
| EP-4198163-A1 | METAL PATTERNING MATERIAL, AMINE COMPOUND, ELECTRONIC DEVICE, AND METHOD FOR FORMING METAL PATTERN | Tosoh Corporation (JP) | 2023-06-21 | — | — | EP | claimed |
| US-20240122065-A1 | METAL PATTERNING MATERIAL, AMINE COMPOUND, ELECTRONIC DEVICE, AND METHOD FOR FORMING METAL PATTERN | TOSOH CORPORATION (JP) | 2024-04-11 | — | — | US | disclosed |
| EP-4198163-A1 | METAL PATTERNING MATERIAL, AMINE COMPOUND, ELECTRONIC DEVICE, AND METHOD FOR FORMING METAL PATTERN | Tosoh Corporation (JP) | 2023-06-21 | — | — | EP | disclosed |
| WO-2023013697-A1 | MATERIAL FOR METAL PATTERNING, FLUORO COMPOUND, THIN FILM FOR METAL PATTERNING, ORGANIC ELECTROLUMINESCENCE DEVICE, ELECTRONIC DEVICE, AND METHOD FOR FORMING METAL PATTERN | 東ソー株式会社 | 2023-02-09 | — | — | WO | disclosed |
| EP-2767407-B1 | Ink-jet recording method and device | FUJIFILM CORP (JP) | 2015-12-02 | — | — | EP | disclosed |
| US-8888246-B2 | Inkjet recording method and inkjet recording device | FUJIFILM CORPORATION (JP) | 2014-11-18 | — | — | US | disclosed |
| EP-2311918-B1 | Ink composition, and inkjet recording method | FUJIFILM CORP (JP) | 2014-10-22 | — | — | EP | disclosed |
| US-20140232790-A1 | INKJET RECORDING METHOD AND INKJET RECORDING DEVICE | FUJIFILM CORPORATION (JP) | 2014-08-21 | — | — | US | disclosed |
| EP-2767407-A1 | Ink-jet recording method and device | FUJIFILM Corporation (JP) | 2014-08-20 | — | — | EP | disclosed |
| US-8211508-B2 | radiation curing ink cures with high sensitivity to form a high quality, durable image resistant to cracking, peeling and has excellent impact resistance, flexibility, and adhesion; cyclic monofunctional acrylic or N-vinyl monomers | FUJIFILM CORPORATION (JP) | 2012-07-03 | — | — | US | disclosed |
| EP-2311918-A1 | Ink composition, and inkjet recording method | FUJIFILM Corporation (JP) | 2011-04-20 | — | — | EP | disclosed |
| US-20080075882-A1 | PROCESS FOR PRODUCING MOLDED PRINTED MATERIAL, AND MOLDED PRINTED MATERIAL | FUJIFILM CORPORATION (JP) | 2008-03-27 | — | — | US | disclosed |