SCHEMBL1667314

SCHEMBL1667314

CSc1ccccc1CC(C)(C)S(=O)(=O)c1ccc(C)cc1

nearest known ligand 0.41

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MEN1 O00255 3/20 0.40
KMT2A Q03164 3/20 0.40
BCHE P06276 1/20 0.39
ACHE P22303 1/20 0.39
ALDH1A1 P00352 7/20 0.39
CYP3A4 P08684 3/20 0.39
CYP2C9 P11712 2/20 0.39
CYP2C19 P33261 2/20 0.39
CA12 O43570 1/20 0.38
CA1 P00915 1/20 0.38
CA2 P00918 1/20 0.38
CA9 Q16790 1/20 0.38
ALOX12 P18054 2/20 0.38
MAPT P10636 1/20 0.38
POLB P06746 1/20 0.38
TSHR P16473 1/20 0.38
CYP2D6 P10635 2/20 0.37
LMNA P02545 1/20 0.37
MAPK1 P28482 1/20 0.37
THPO P40225 1/20 0.37

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4453723 0.76 CYP3A4 (0.51) MEN1KMT2ABCHEACHEALDH1A1
SCHEMBL13402025 0.73 CHRM2 (0.46) MEN1KMT2AALDH1A1MAPTLMNA
SCHEMBL18243551 0.72 KMT2A (0.42) MEN1KMT2AALDH1A1MAPTPOLB
SCHEMBL12143763 0.71 ALDH1A1 (0.50) MEN1KMT2ABCHEACHEALDH1A1
SCHEMBL8481321 0.70 CHRM2 (0.50) MEN1KMT2AACHEALDH1A1MAPT
SCHEMBL12143762 0.70 ALDH1A1 (0.53) MEN1KMT2AALDH1A1CYP3A4CYP2C9
SCHEMBL24590166 0.68 ALDH1A1 (0.47) MEN1KMT2ABCHEACHEALDH1A1
SCHEMBL10615538 0.68 GAA (0.45) MEN1KMT2ABCHEACHEALDH1A1
Chloromethane SCHEMBL10447535 0.68 HSD11B1 (0.60) MEN1KMT2AALDH1A1GAAKDM4E
SCHEMBL23862419 0.68 ALDH1A1 (0.37) MEN1KMT2ABCHEACHEALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 73 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-110515270-B Photosensitive resin composition, pattern forming method, and method for manufacturing optical semiconductor device 信越化学工业株式会社 2024-07-12 CN disclosed
US-20240210831-A1 PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN FILM, PHOTOSENSITIVE DRY FILM, AND PATTERN FORMATION METHOD SHIN-ETSU CHEMICAL CO., LTD. (JP) 2024-06-27 US disclosed
EP-4386037-A1 SILPHENYLENE-SKELETON-CONTAINING POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMATION METHOD, AND METHOD FOR MANUFACTURING OPTICAL SEMICONDUCTOR DEVICE SHIN-ETSU CHEMICAL CO., LTD. (JP) 2024-06-19 EP disclosed
US-20240184206-A1 LAMINATE, METHOD FOR MANUFACTURING LAMINATE, AND METHOD FOR PATTERNING SHIN-ETSU CHEMICAL CO., LTD. (JP) 2024-06-06 US disclosed
CN-118103774-A Photosensitive resin composition, photosensitive resin coating, photosensitive dry film, and pattern forming method 信越化学工业株式会社 2024-05-28 CN disclosed
WO-2024101182-A1 PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN FILM, PHOTOSENSITIVE DRY FILM, PATTERN FORMING METHOD, AND LIGHT-EMITTING ELEMENT 信越化学工業株式会社 2024-05-16 WO disclosed
EP-4365679-A1 LAYERED BODY, METHOD FOR MANUFACTURING LAYERED BODY, AND METHOD FOR FORMING PATTERN SHIN-ETSU CHEMICAL CO., LTD. (JP) 2024-05-08 EP disclosed
WO-2024075585-A1 PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN MEMBRANE, PHOTOSENSITIVE DRY FILM, PATTERN FORMATION METHOD, AND LIGHT-EMITTING ELEMENT 信越化学工業株式会社 2024-04-11 WO disclosed
WO-2024075581-A1 PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN COATING, PHOTOSENSITIVE DRY FILM, PATTERN FORMING METHOD, AND LIGHT-EMITTING ELEMENT 信越化学工業株式会社 2024-04-11 WO disclosed
EP-3656803-B1 POLYSILOXANE SKELETON POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMING PROCESS, AND FABRICATION OF OPTO-SEMICONDUCTOR DEVICE SHINETSU CHEMICAL CO (JP) 2024-04-10 EP disclosed
EP-2364847-B1 PHOTOCURABLE DRY FILM, METHOD FOR PREPARING SAME, PATTERNING METHOD AND FILM FOR PROTECTING ELECTRIC AND ELECTRONIC PARTS SHINETSU CHEMICAL CO (JP) 2015-07-22 EP disclosed
US-8729148-B2 Photocurable dry film, method for preparing same, patterning method and film for protecting electric and electronic parts SHIN-ETSU CHEMICAL CO., LTD. (JP) 2014-05-20 US disclosed
US-8048611-B2 Polyorganosiloxane, resin composition, and patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2011-11-01 US disclosed
EP-2364847-A1 Photocurable dry film, method for preparing same, patterning method and film for protecting electric and electronic parts Shin-Etsu Chemical Co., Ltd. (JP) 2011-09-14 EP disclosed
US-20110143092-A1 PHOTOCURABLE DRY FILM, METHOD FOR PREPARING SAME, PATTERNING METHOD AND FILM FOR PROTECTING ELECTRIC AND ELECTRONIC PARTS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2011-06-16 US disclosed
EP-2112188-B1 Polyorganosiloxane, resin composition, and patterning process SHINETSU CHEMICAL CO (JP) 2011-04-27 EP disclosed
US-7785766-B2 Silphenylene-bearing polymer, photo-curable resin composition, patterning process, and substrate circuit protective film SHIN-ETSU CHEMICAL CO., LTD. (JP) 2010-08-31 US disclosed
US-20090269697-A1 POLYORGANOSILOXANE, RESIN COMPOSITION, AND PATTERNING PROCESS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2009-10-29 US disclosed
EP-2112188-A1 Polyorganosiloxane, resin composition, and patterning process Shin-Etsu Chemical Co., Ltd. (JP) 2009-10-28 EP disclosed
US-20080182087-A1 SILPHENYLENE-BEARING POLYMER, PHOTO-CURABLE RESIN COMPOSITION, PATTERNING PROCESS, AND SUBSTRATE CIRCUIT PROTECTIVE FILM SHIN-ETSU CHEMICAL CO., LTD. (JP) 2008-07-31 US disclosed