Predicted protein targets (top 2)
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL1487502 | 1.00 | TRPA1 (0.42) | TRPA1TSHR | |
| SCHEMBL11071930 | 0.86 | — | — | |
| SCHEMBL11688232 | 0.83 | TSHR (0.37) | TRPA1TSHR | |
| SCHEMBL8520993 | 0.81 | — | — | |
| SCHEMBL8521162 | 0.81 | — | — | |
| SCHEMBL11691790 | 0.78 | TRPA1 (0.31) | TRPA1 | |
| SCHEMBL14653823 | 0.78 | — | — | |
| SCHEMBL9885752 | 0.78 | — | — | |
| SCHEMBL4476401 | 0.76 | TSHR (0.39) | TRPA1TSHR | |
| SCHEMBL19219045 | 0.76 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 169 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-11664214-B2 | Methods for producing high-density, nitrogen-doped carbon films for hardmasks and other patterning applications | APPLIED MATERIALS, INC. (US) | 2023-05-30 | — | — | US | claimed |
| CN-116075920-A | Method for producing high density, nitrogen doped carbon films for hard mask and other patterning applications | 应用材料公司 | 2023-05-05 | — | — | CN | claimed |
| WO-2022005703-A1 | METHODS FOR PRODUCING HIGH-DENSITY, NITROGEN-DOPED CARBON FILMS FOR HARDMASKS AND OTHER PATTERNING APPLICATIONS | APPLIED MATERIALS, INC. (US) | 2022-01-06 | — | — | WO | claimed |
| US-20210407791-A1 | METHODS FOR PRODUCING HIGH-DENSITY, NITROGEN-DOPED CARBON FILMS FOR HARDMASKS AND OTHER PATTERNING APPLICATIONS | APPLIED MATERIALS, INC. | 2021-12-30 | — | — | US | claimed |
| US-8324095-B2 | Integration of ALD tantalum nitride for copper metallization | APPLIED MATERIALS, INC. (US) | 2012-12-04 | — | — | US | claimed |
| JP-4711624-B2 | — | — | 2011-06-29 | — | — | JP | claimed |
| WO-2010054075-A2 | PLASMA AND THERMAL ANNEAL TREATMENT TO IMPROVE OXIDATION RESISTANCE OF METAL-CONTAINING FILMS | APPLIED MATERIALS, INC. (US) | 2010-05-14 | — | — | WO | claimed |
| US-20100120245-A1 | PLASMA AND THERMAL ANNEAL TREATMENT TO IMPROVE OXIDATION RESISTANCE OF METAL-CONTAINING FILMS | APPLIED MATERIALS, INC. | 2010-05-13 | — | — | US | claimed |
| US-20100075494-A1 | INTEGRATION OF ALD TANTALUM NITRIDE FOR COPPER METALLIZATION | APPLIED MATERIALS, INC. | 2010-03-25 | — | — | US | claimed |
| US-7211508-B2 | Atomic layer deposition of tantalum based barrier materials | APPLIED MATERIALS, INC. (US) | 2007-05-01 | — | — | US | claimed |
| US-7049226-B2 | Integration of ALD tantalum nitride for copper metallization | APPLIED MATERIALS, INC. (US) | 2006-05-23 | — | — | US | claimed |
| US-20050106865-A1 | Integration of ALD tantalum nitride for copper metallization | APPLIED MATERIALS, INC. | 2005-05-19 | — | — | US | claimed |
| US-20050009325-A1 | Atomic layer deposition of barrier materials | APPLIED MATERIALS, INC. | 2005-01-13 | — | — | US | claimed |
| WO-2004113585-A2 | ATOMIC LAYER DEPOSITION OF BARRIER MATERIALS | APPLIED MATERIALS, INC. (US) | 2004-12-29 | — | — | WO | claimed |
| US-20030124262-A1 | Integration of ALD tantalum nitride and alpha-phase tantalum for copper metallization application | APPLIED MATERIALS INC. | 2003-07-03 | — | — | US | claimed |
| WO-2003038892-A2 | ATOMIC-LAYER-DEPOSITED TANTALUM NITRIDE AND ALPHA-PHASE TANTALUM AS BARRIER LAYERS FOR COPPER METALLIZATION | APPLIED MATERIALS, INC. (US) | 2003-05-08 | — | — | WO | claimed |
| US-20030082307-A1 | Integration of ALD tantalum nitride and alpha-phase tantalum for copper metallization application | APPLIED MATERIALS, INC. | 2003-05-01 | — | — | US | claimed |
| US-20030082301-A1 | Enhanced copper growth with ultrathin barrier layer for high performance interconnects | APPLIED MATERIALS, INC. | 2003-05-01 | — | — | US | claimed |
| EP-0809646-A1 | A METHOD FOR MANUFACTURING ORGANOSILANES | E.I. DU PONT DE NEMOURS AND COMPANY (US) | 1997-12-03 | — | — | EP | claimed |
| WO-1996025419-A1 | A METHOD FOR MANUFACTURING ORGANOSILANES | E.I. DU PONT DE NEMOURS AND COMPANY (US) | 1996-08-22 | — | — | WO | claimed |