SCHEMBL1673265

SCHEMBL1673265

[C]1[CH]CCCCCCCC1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2230626 1.00
SCHEMBL1673036 1.00
SCHEMBL1673263 1.00
SCHEMBL2231137 1.00
SCHEMBL2232076 1.00
SCHEMBL1672487 1.00
SCHEMBL180754 0.97
SCHEMBL312936 0.86
SCHEMBL17385702 0.69
SCHEMBL19180789 0.69

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 54 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-6309796-B1 PHOTORESISTS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2001-10-30 US claimed
US-12044094-B2 Plug, downhole tool, and well treatment method KUREHA CORPORATION (JP) 2024-07-23 US disclosed
US-20230374880-A1 PLUG, DOWNHOLE TOOL, AND WELL TREATMENT METHOD KUREHA CORPORATION (JP) 2023-11-23 US disclosed
EP-4227355-A1 PLUG, DOWNHOLE TOOL, AND WELL TREATING METHOD Kureha Corporation (JP) 2023-08-16 EP disclosed
US-11702504-B2 Resin composition for printed wiring board, prepreg, laminate, metal foil-clad laminate, printed wiring board, and multilayer printed wiring board MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2023-07-18 US disclosed
US-20230192989-A1 POLYAMIDE RESIN COMPOSITION, MOLDED POLYAMIDE RESIN ARTICLE, AND PRODUCTION METHOD THEREFOR KUREHA CORPORATION (JP) 2023-06-22 US disclosed
US-20230113512-A1 RESIST COMPOSITION AND METHOD FOR PRODUCING RESIST PATTERN SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2023-04-13 US disclosed
EP-4163321-A1 POLYAMIDE RESIN COMPOSITION, MOLDED POLYAMIDE RESIN ARTICLE, AND PRODUCTION METHOD THEREFOR Kureha Corporation (JP) 2023-04-12 EP disclosed
WO-2023013717-A1 CURABLE COMPOSITION, PREPREG, METAL FOIL-CLAD LAMINATE AND PRINTED WIRING BOARD 三菱瓦斯化学株式会社 2023-02-09 WO disclosed
CN-115551947-A Polyamide resin composition, polyamide resin molded article, and method for producing same 株式会社吴羽 2022-12-30 CN disclosed
US-20110237755-A1 METHOD OF USING A CYCLIC CARBODIIMIDE TEIJIN LIMITED (JP) 2011-09-29 US disclosed
US-20110224385-A1 RESIN COMPOSITION COMPRISING A CYCLIC CARBODIIMIDE TEIJIN LIMITED (JP) 2011-09-15 US disclosed
EP-2360208-A1 RESIN COMPOSITION CONTAINING CYCLIC CARBODIMIDE Teijin Limited (JP) 2011-08-24 EP disclosed
EP-1930382-B1 COATING MATERIALS CONSISTING OF LOW- OR MEDIUM-MOLECULAR ORGANIC COMPOUNDS CENTRAL GLASS CO LTD (JP) 2011-07-27 EP disclosed
US-7919224-B2 Coating materials consisting of low- or medium-molecular organic compounds CENTRAL GLASS COMPANY, LIMITED (JP) 2011-04-05 US disclosed
US-20090272295-A1 Coating Materials Consisting of Low- or Medium-Molecular Organic Compounds CENTRAL GLASS COMPANY, LIMITED (JP) 2009-11-05 US disclosed
EP-1930382-A1 COATING MATERIALS CONSISTING OF LOW- OR MEDIUM-MOLECULAR ORGANIC COMPOUNDS Central Glass Company, Limited (JP) 2008-06-11 EP disclosed
US-6730453-B2 POLYSILSESQUIOXANE POLYMERS CONTAINING CARBOXY OR HYDROXY GROUPS, AND A PHOTOACID GENERATOR SHIN ETSU CHEMICAL CO., LTD. (JP) 2004-05-04 US disclosed
US-6309796-B1 PHOTORESISTS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2001-10-30 US disclosed
US-5972560-A A CROSSLINKED POLYSILOXANE PHOTOACID GENERATOR HAVING HIGH TRANSPARENCY, HIGH RESOLUTION, IMPROVED LATITUDE OF EXPOSURE, PROCESS ADAPTABILITY, AND FOR PRECISE MICRO-PROCESSING SHIN-ETSU CHEMICAL CO., LTD. (JP) 1999-10-26 US disclosed