SCHEMBL2230626

SCHEMBL2230626

[C]1[CH]CCCCCCC1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1673036 1.00
SCHEMBL1673263 1.00
SCHEMBL2231137 1.00
SCHEMBL1673265 1.00
SCHEMBL2232076 1.00
SCHEMBL1672487 1.00
SCHEMBL180754 0.97
SCHEMBL312936 0.86
SCHEMBL17385702 0.69
SCHEMBL19180789 0.69

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 57 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-6309796-B1 PHOTORESISTS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2001-10-30 US claimed
US-12044094-B2 Plug, downhole tool, and well treatment method KUREHA CORPORATION (JP) 2024-07-23 US disclosed
WO-2024043083-A1 RESIN COMPOSITION, PREPREG, FILM WITH RESIN, METAL FOIL WITH RESIN, METAL-CLAD LAMINATED PLATE, AND WIRING BOARD パナソニックIPマネジメント株式会社 2024-02-29 WO disclosed
WO-2024043084-A1 RESIN COMPOSITION, PREPREG, FILM WITH RESIN, METAL FOIL WITH RESIN, METAL-CLAD LAMINATE, AND WIRING BOARD パナソニックIPマネジメント株式会社 2024-02-29 WO disclosed
US-20230374880-A1 PLUG, DOWNHOLE TOOL, AND WELL TREATMENT METHOD KUREHA CORPORATION (JP) 2023-11-23 US disclosed
EP-4227355-A1 PLUG, DOWNHOLE TOOL, AND WELL TREATING METHOD Kureha Corporation (JP) 2023-08-16 EP disclosed
US-11702504-B2 Resin composition for printed wiring board, prepreg, laminate, metal foil-clad laminate, printed wiring board, and multilayer printed wiring board MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2023-07-18 US disclosed
US-20230192989-A1 POLYAMIDE RESIN COMPOSITION, MOLDED POLYAMIDE RESIN ARTICLE, AND PRODUCTION METHOD THEREFOR KUREHA CORPORATION (JP) 2023-06-22 US disclosed
EP-4163321-A1 POLYAMIDE RESIN COMPOSITION, MOLDED POLYAMIDE RESIN ARTICLE, AND PRODUCTION METHOD THEREFOR Kureha Corporation (JP) 2023-04-12 EP disclosed
WO-2023053955-A1 RESIN COMPOSITION, DOWNHOLE TOOL OR MEMBER THEREOF, PLUG, AND WELL TREATMENT METHOD 株式会社クレハ 2023-04-06 WO disclosed
EP-2360208-A1 RESIN COMPOSITION CONTAINING CYCLIC CARBODIMIDE Teijin Limited (JP) 2011-08-24 EP disclosed
US-6730453-B2 POLYSILSESQUIOXANE POLYMERS CONTAINING CARBOXY OR HYDROXY GROUPS, AND A PHOTOACID GENERATOR SHIN ETSU CHEMICAL CO., LTD. (JP) 2004-05-04 US disclosed
US-20020058205-A1 High molecular weight silicone compounds, resist compositions, and patterning method NAKASHIMA MUTSUO (JP) 2002-05-16 US disclosed
EP-0915865-B1 COVALENTLY IMMOBILISED FLUOROIONOPHORES FOR OPTICAL ION SENSORS NOVARTIS AG (CH) 2002-02-20 EP disclosed
US-6309796-B1 PHOTORESISTS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2001-10-30 US disclosed
US-6294390-B1 COMPOUND CONSISTING OF IONOPHORE, FLUOROPHORE, AND A FUNCTIONAL GROUP BOUND TOGETHER THROUGH A TRIVALENT ORGANIC RADICAL; SENSORS HAVING LONG USABLE LIFE AND A HIGH DEGREE OF SENSITIVITY NOVARTIS AG (CH) 2001-09-25 US disclosed
WO-1998003497-A9 COVALENTLY IMMOBILISED FLUOROIONOPHORES FOR OPTICAL ION SENSORS NOVARTIS AG (CH) 1999-10-28 WO disclosed
US-5972560-A A CROSSLINKED POLYSILOXANE PHOTOACID GENERATOR HAVING HIGH TRANSPARENCY, HIGH RESOLUTION, IMPROVED LATITUDE OF EXPOSURE, PROCESS ADAPTABILITY, AND FOR PRECISE MICRO-PROCESSING SHIN-ETSU CHEMICAL CO., LTD. (JP) 1999-10-26 US disclosed
EP-0915865-A1 COVALENTLY IMMOBILISED FLUOROIONOPHORES FOR OPTICAL ION SENSORS Novartis AG (CH) 1999-05-19 EP disclosed
WO-1998003497-A1 COVALENTLY IMMOBILISED FLUOROIONOPHORES FOR OPTICAL ION SENSORS NOVARTIS AG (CH) 1998-01-29 WO disclosed