⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL2230626 | 1.00 | — | — | |
| SCHEMBL1673036 | 1.00 | — | — | |
| SCHEMBL1673263 | 1.00 | — | — | |
| SCHEMBL2231137 | 1.00 | — | — | |
| SCHEMBL1673265 | 1.00 | — | — | |
| SCHEMBL1672487 | 1.00 | — | — | |
| SCHEMBL180754 | 0.97 | — | — | |
| SCHEMBL312936 | 0.86 | — | — | |
| SCHEMBL17385702 | 0.69 | — | — | |
| SCHEMBL19180789 | 0.69 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 69 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-12044094-B2 | Plug, downhole tool, and well treatment method | KUREHA CORPORATION (JP) | 2024-07-23 | — | — | US | disclosed |
| US-20240117101-A1 | COMPOSITION FOR FILM FORMATION, RESIST COMPOSITION, RADIATION-SENSITIVE COMPOSITION, METHOD FOR PRODUCING AMORPHOUS FILM, RESIST PATTERN FORMATION METHOD, COMPOSITION FOR UNDERLAYER FILM FORMATION FOR LITHOGRAPHY, METHOD FOR PRODUCING UNDERLAYER FILM FOR LITHOGRAPHY, CIRCUIT PATTERN FORMATION METHOD, COMPOSITION FOR OPTICAL MEMBER FORMATION, RESIN FOR UNDERLAYER FILM FORMATION, RESIST RESIN, RADIATION-SENSITIVE RESIN, AND RESIN FOR UNDERLAYER FILM FORMATION FOR LITHOGRAPHY | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2024-04-11 | — | — | US | disclosed |
| US-20240117102-A1 | POLYMER, COMPOSITION, METHOD FOR PRODUCING POLYMER, COMPOSITION FOR FILM FORMATION, RESIST COMPOSITION, RESIST PATTERN FORMATION METHOD, RADIATION-SENSITIVE COMPOSITION, COMPOSITION FOR UNDERLAYER FILM FORMATION FOR LITHOGRAPHY, METHOD FOR PRODUCING UNDERLAYER FILM FOR LITHOGRAPHY, CIRCUIT PATTERN FORMATION METHOD, AND COMPOSITION FOR OPTICAL MEMBER FORMATION | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2024-04-11 | — | — | US | disclosed |
| WO-2024043084-A1 | RESIN COMPOSITION, PREPREG, FILM WITH RESIN, METAL FOIL WITH RESIN, METAL-CLAD LAMINATE, AND WIRING BOARD | パナソニックＩＰマネジメント株式会社 | 2024-02-29 | — | — | WO | disclosed |
| WO-2024043083-A1 | RESIN COMPOSITION, PREPREG, FILM WITH RESIN, METAL FOIL WITH RESIN, METAL-CLAD LAMINATED PLATE, AND WIRING BOARD | パナソニックＩＰマネジメント株式会社 | 2024-02-29 | — | — | WO | disclosed |
| US-20230374880-A1 | PLUG, DOWNHOLE TOOL, AND WELL TREATMENT METHOD | KUREHA CORPORATION (JP) | 2023-11-23 | — | — | US | disclosed |
| US-20230314942-A1 | POLYCYCLIC POLYPHENOLIC RESIN, COMPOSITION, METHOD FOR PRODUCING POLYCYCLIC POLYPHENOLIC RESIN, COMPOSITION FOR FILM FORMATION, RESIST COMPOSITION, RESIST PATTERN FORMATION METHOD, RADIATION-SENSITIVE COMPOSITION, COMPOSITION FOR UNDERLAYER FILM FORMATION FOR LITHOGRAPHY, METHOD FOR PRODUCING UNDERLAYER FILM FOR LITHOGRAPHY, CIRCUIT PATTERN FORMATION METHOD, AND COMPOSITION FOR OPTICAL MEMBER FORMATION | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2023-10-05 | — | — | US | disclosed |
| US-20230296982-A1 | POLYMER, COMPOSITION, METHOD FOR PRODUCING POLYMER, COMPOSITION, COMPOSITION FOR FILM FORMATION, RESIST COMPOSITION, RADIATION-SENSITIVE COMPOSITION, COMPOSITION FOR UNDERLAYER FILM FORMATION FOR LITHOGRAPHY, RESIST PATTERN FORMATION METHOD, METHOD FOR PRODUCING UNDERLAYER FILM FOR LITHOGRAPHY, CIRCUIT PATTERN FORMATION METHOD, AND COMPOSITION FOR OPTICAL MEMBER FORMATION | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2023-09-21 | — | — | US | disclosed |
| EP-4227355-A1 | PLUG, DOWNHOLE TOOL, AND WELL TREATING METHOD | Kureha Corporation (JP) | 2023-08-16 | — | — | EP | disclosed |
| US-11702504-B2 | Resin composition for printed wiring board, prepreg, laminate, metal foil-clad laminate, printed wiring board, and multilayer printed wiring board | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2023-07-18 | — | — | US | disclosed |
| EP-2479320-A1 | FIBER AND FIBER STRUCTURE | Teijin Limited (JP) | 2012-07-25 | — | — | EP | disclosed |
| US-20120184166-A1 | FIBER AND FIBER STRUCTURE | TEIJIN LIMITED (JP) | 2012-07-19 | — | — | US | disclosed |
| EP-2374833-A1 | METHOD FOR USING CYCLIC CARBODIMIDE | Teijin Limited (JP) | 2011-10-12 | — | — | EP | disclosed |
| US-20110237755-A1 | METHOD OF USING A CYCLIC CARBODIIMIDE | TEIJIN LIMITED (JP) | 2011-09-29 | — | — | US | disclosed |
| US-20110224385-A1 | RESIN COMPOSITION COMPRISING A CYCLIC CARBODIIMIDE | TEIJIN LIMITED (JP) | 2011-09-15 | — | — | US | disclosed |
| EP-2360208-A1 | RESIN COMPOSITION CONTAINING CYCLIC CARBODIMIDE | Teijin Limited (JP) | 2011-08-24 | — | — | EP | disclosed |
| EP-0915865-B1 | COVALENTLY IMMOBILISED FLUOROIONOPHORES FOR OPTICAL ION SENSORS | NOVARTIS AG (CH) | 2002-02-20 | — | — | EP | disclosed |
| US-6294390-B1 | COMPOUND CONSISTING OF IONOPHORE, FLUOROPHORE, AND A FUNCTIONAL GROUP BOUND TOGETHER THROUGH A TRIVALENT ORGANIC RADICAL; SENSORS HAVING LONG USABLE LIFE AND A HIGH DEGREE OF SENSITIVITY | NOVARTIS AG (CH) | 2001-09-25 | — | — | US | disclosed |
| US-4694102-A | OXIDATION INHIBITORS | MITSUBISHI YUKA FINE CHEMICALS CO., LTD. (JP) | 1987-09-15 | — | — | US | disclosed |
| US-4633008-A | FOR POLYMERS AND OTHER ORGANIC MATERIALS | MITSUBISHI YUKA FINE CHEMICALS CO., LTD. (JP) | 1986-12-30 | — | — | US | disclosed |