SCHEMBL16745527

SCHEMBL16745527

Cc1ccc(S(=O)(=O)O/N=C(\C(=O)C(C)(C)C)c2nc3cc(Cl)c(C)c(Cl)c3o2)cc1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL16381781 0.79 HKDC1 (0.34) —
SCHEMBL16381780 0.79 XDH (0.50) —
SCHEMBL16745523 0.78 XDH (0.39) —
SCHEMBL16745529 0.75 GAA (0.41) —
SCHEMBL24745458 0.71 HKDC1 (0.36) —
SCHEMBL16381775 0.71 HKDC1 (0.36) —
SCHEMBL16745520 0.70 XDH (0.49) —
SCHEMBL16381776 0.70 XDH (0.47) —
SCHEMBL16381778 0.68 MAPT (0.44) —
SCHEMBL17364359 0.67 XDH (0.55) —

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20160131976-A1 RESIST COMPOSITION FOR SEMICONDUCTOR MANUFACTURING PROCESS; RESIST FILM, RESIST-COATED MASK BLANKS, PHOTOMASK, AND RESIST PATTERNING METHOD USING SAID RESIST COMPOSITION; ELECTRONIC-DEVICE MANUFACTURING METHOD; AND ELECTRONIC DEVICE FUJIFILM CORPORATION (JP) 2016-05-12 — — US disclosed
US-20160131976-A1 RESIST COMPOSITION FOR SEMICONDUCTOR MANUFACTURING PROCESS; RESIST FILM, RESIST-COATED MASK BLANKS, PHOTOMASK, AND RESIST PATTERNING METHOD USING SAID RESIST COMPOSITION; ELECTRONIC-DEVICE MANUFACTURING METHOD; AND ELECTRONIC DEVICE FUJIFILM CORPORATION (JP) 2016-05-12 — — US disclosed
US-9223211-B2 Photosensitive resin compositions, processes for preparing cured films, the resulting cured films, organic EL display devices and liquid crystal display devices FUJIFILM CORPORATION (JP) 2015-12-29 — — US disclosed
US-9223211-B2 Photosensitive resin compositions, processes for preparing cured films, the resulting cured films, organic EL display devices and liquid crystal display devices FUJIFILM CORPORATION (JP) 2015-12-29 — — US disclosed
US-20150148546-A1 PHOTOSENSITIVE RESIN COMPOSITIONS, PROCESSES FOR PREPARING CURED FILMS, THE RESULTING CURED FILMS, ORGANIC EL DISPLAY DEVICES AND LIQUID CRYSTAL DISPLAY DEVICES FUJIFILM CORPORATION (JP) 2015-05-28 — — US disclosed
US-20150148546-A1 PHOTOSENSITIVE RESIN COMPOSITIONS, PROCESSES FOR PREPARING CURED FILMS, THE RESULTING CURED FILMS, ORGANIC EL DISPLAY DEVICES AND LIQUID CRYSTAL DISPLAY DEVICES FUJIFILM CORPORATION (JP) 2015-05-28 — — US disclosed
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