SCHEMBL16807398

SCHEMBL16807398

C=C(C)C(=O)OC(CC)(CC)C1CC1

nearest known ligand 0.37

Predicted protein targets (top 3)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 2/20 0.37
THRB P10828 1/20 0.35
TSHR P16473 3/20 0.34

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL22201018 0.93 ALDH1A1 (0.35) ALDH1A1THRBTSHR
SCHEMBL16807392 0.93 ALDH1A1 (0.35) ALDH1A1THRBTSHR
SCHEMBL22733567 0.92 ALDH1A1 (0.33) ALDH1A1THRBTSHR
SCHEMBL171954 0.91 ALDH1A1 (0.34) ALDH1A1THRBTSHR
SCHEMBL22733020 0.86 ALDH1A1 (0.31) ALDH1A1TSHR
SCHEMBL74557 0.82 ALDH1A1 (0.37) ALDH1A1
SCHEMBL16181818 0.80 ALDH1A1 (0.36) ALDH1A1
SCHEMBL16807393 0.80 ALDH1A1 (0.36) ALDH1A1THRBTSHR
SCHEMBL22733575 0.79 ALDH1A1 (0.34) ALDH1A1
SCHEMBL14825607 0.79 MTNR1A (0.35) ALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-9261785-B2 Polymer compound, resin composition for photoresists, and method for producing semiconductor DAICEL CORPORATION (JP) 2016-02-16 US disclosed
US-9261785-B2 Polymer compound, resin composition for photoresists, and method for producing semiconductor DAICEL CORPORATION (JP) 2016-02-16 US disclosed
US-20150168831-A1 POLYMER COMPOUND, RESIN COMPOSITION FOR PHOTORESISTS, AND METHOD FOR PRODUCING SEMICONDUCTOR DAICEL CORPORATION (JP) 2015-06-18 US disclosed
US-20150168831-A1 POLYMER COMPOUND, RESIN COMPOSITION FOR PHOTORESISTS, AND METHOD FOR PRODUCING SEMICONDUCTOR DAICEL CORPORATION (JP) 2015-06-18 US disclosed