Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | GAA | P10253 | 8/20 | 0.47 |
| ▸ | MAPT | P10636 | 4/20 | 0.47 |
| ▸ | CA1 | P00915 | 2/20 | 0.47 |
| ▸ | CA2 | P00918 | 2/20 | 0.47 |
| ▸ | CA12 | O43570 | 1/20 | 0.47 |
| ▸ | CA9 | Q16790 | 1/20 | 0.47 |
| ▸ | ALDH1A1 | P00352 | 9/20 | 0.46 |
| ▸ | HSD17B10 | Q99714 | 6/20 | 0.46 |
| ▸ | ALOX15 | P16050 | 6/20 | 0.46 |
| ▸ | ALOX12 | P18054 | 3/20 | 0.46 |
| ▸ | HPGD | P15428 | 3/20 | 0.46 |
| ▸ | SMN1; SMN2 | Q16637 | 2/20 | 0.46 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.46 |
| ▸ | THRB | P10828 | 2/20 | 0.44 |
| ▸ | MEN1 | O00255 | 3/20 | 0.42 |
| ▸ | KMT2A | Q03164 | 3/20 | 0.42 |
| ▸ | HTT | P42858 | 2/20 | 0.42 |
| ▸ | KDM4E | B2RXH2 | 2/20 | 0.42 |
| ▸ | RECQL | P46063 | 2/20 | 0.42 |
| ▸ | USP2 | O75604 | 2/20 | 0.42 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL11191085 | 0.92 | GAA (0.41) | GAAMAPTCA1CA2CA12 | |
| SCHEMBL11195200 | 0.90 | ALDH1A1 (0.48) | GAAMAPTCA1CA2CA12 | |
| SCHEMBL11197229 | 0.89 | GAA (0.39) | GAAMAPTCA1CA2CA12 | |
| SCHEMBL11193057 | 0.89 | ALDH1A1 (0.57) | GAAMAPTCA1CA2CA12 | |
| SCHEMBL11190173 | 0.89 | ALDH1A1 (0.57) | GAAMAPTCA1CA2CA12 | |
| SCHEMBL11197868 | 0.89 | GAA (0.39) | GAAMAPTCA1CA2CA12 | |
| SCHEMBL11195512 | 0.89 | GAA (0.39) | GAAMAPTCA1CA2CA12 | |
| SCHEMBL11194552 | 0.84 | TRPA1 (0.43) | GAAMAPTCA1CA2CA12 | |
| SCHEMBL11196257 | 0.84 | ALDH1A1 (0.61) | GAAMAPTCA1CA2CA12 | |
| SCHEMBL17231836 | 0.83 | ALDH1A1 (0.48) | GAAMAPTCA1CA2CA12 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 39 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-110408024-B | Polyimide precursor composition, polyamic acid, polyimide resin, polyimide film, and optical device | 东京应化工业株式会社 | 2023-11-17 | — | — | CN | disclosed |
| CN-110408024-A | Polyimide precursor composition, polyamic acid, polyimide resin, polyimide film and Optical devices | TOKYO OHKA KOGYO CO LTD | 2019-11-05 | — | — | CN | disclosed |
| EP-2204484-B1 | POLYIMIDE FIBER MASS, SOUND ABSORBING MATERIAL, HEAT INSULATION MATERIAL, FLAME-RETARDANT MAT, FILTER CLOTH, HEAT-RESISTANT CLOTHING, NONWOVEN FABRIC, HEAT INSULATION/SOUND ABSORBING MATERIAL FOR AIRCRAFT, AND HEAT-RESISTANT BAG FILTER | KANEKA CORP (JP) | 2019-05-15 | — | — | EP | disclosed |
| US-10292262-B2 | Reinforcing-plate-integrated flexible printed circuit board | KANEKA CORPORATION (JP) | 2019-05-14 | — | — | US | disclosed |
| US-10045433-B2 | Conductive-layer-integrated flexible printed circuit board | KANEKA CORPORATION (JP) | 2018-08-07 | — | — | US | disclosed |
| US-9957390-B2 | Resin composition for pigment-containing insulating film, and use thereof | KANEKA CORPORATION (JP) | 2018-05-01 | — | — | US | disclosed |
| US-9835942-B2 | Photosensitive resin composition and use thereof | KANEKA CORPORATION (JP) | 2017-12-05 | — | — | US | disclosed |
| US-20170290141-A1 | CONDUCTIVE-LAYER-INTEGRATED FLEXIBLE PRINTED CIRCUIT BOARD | KANEKA CORPORATION | 2017-10-05 | — | — | US | disclosed |
| US-9723708-B2 | Conductive-layer-integrated flexible printed circuit board | KANEKA CORPORATION (JP) | 2017-08-01 | — | — | US | disclosed |
| US-9617669-B2 | Method of making polyimide fiber assembly | KANEKA CORPORATION (JP) | 2017-04-11 | — | — | US | disclosed |
| US-20100229517-A1 | POLYIMIDE FIBER MASS, SOUND ABSORBING MATERIAL, THERMAL INSULATING MATERIAL, FLAME-RETARDANT MAT, FILTER CLOTH, HEAT RESISTANT CLOTHING, NONWOVEN FABRIC, HEAT INSULATION/SOUND ABSORBING MATERIAL FOR AIRCRAFT, AND HEAT RESISTANT BAG FILTER | KANEKA CORPORATION (JP) | 2010-09-16 | — | — | US | disclosed |
| EP-2204484-A1 | POLYIMIDE FIBER MASS, SOUND ABSORBING MATERIAL, HEAT INSULATION MATERIAL, FLAME-RETARDANT MAT, FILTER CLOTH, HEAT-RESISTANT CLOTHING, NONWOVEN FABRIC, HEAT INSULATION/SOUND ABSORBING MATERIAL FOR AIRCRAFT, AND HEAT-RESISTANT BAG FILTER | Kaneka Corporation (JP) | 2010-07-07 | — | — | EP | disclosed |
| US-20100132989-A1 | NOVEL POLYIMIDE PRECURSOR COMPOSITION AND USE THEREOF | KANEKA CORPORATION (JP) | 2010-06-03 | — | — | US | disclosed |
| US-20100084171-A1 | NOVEL POLYIMIDE PRECURSOR COMPOSITION, USE THEREOF AND PRODUCTION METHOD THEREOF | KANEKA CORPORATION (JP) | 2010-04-08 | — | — | US | disclosed |
| WO-2002020650-A1 | COATED PERFLUOROELASTOMER ARTICLES | DUPONT DOW ELASTOMERS L.L.C. (US) | 2002-03-14 | — | — | WO | disclosed |
| US-5011753-A | Polyamides Containing Hexafluoroisopropylidene Groups Which May Be Cured To Form Polybenzoxazoles | HOECHST CELANESE CORPORATION (US) | 1991-04-30 | — | — | US | disclosed |
| US-4939215-A | CHEMICAL AND RADIATION RESISTANCE; AIRCRAFT, ELECTRONICS | HOECHST CELANESE CORPORATION (US) | 1990-07-03 | — | — | US | disclosed |
| US-4845183-A | MOLDING MATERIALS; FOR DIELECTRICS OR COATING SOLUTIONS; TOUGHNESS, FLEXIBILITY, TRANSPARENT | HOECHST CELANESE CORPORATION (US) | 1989-07-04 | — | — | US | disclosed |
| EP-0317942-A2 | Heat resistant polyamides and polybenzoxazoles from bis-[(aminohydroxyphenyl hexafluoro-isopropyl] diphenyl ethers | HOECHST CELANESE CORPORATION (US) | 1989-05-31 | — | — | EP | disclosed |
| EP-0083204-A2 | 2-Aminophenol derivatives and process for their preparation | ONO PHARMACEUTICAL CO., LTD. (JP) | 1983-07-06 | — | — | EP | disclosed |