SCHEMBL168534

SCHEMBL168534

O=C(c1ccc(C(=O)O)c(C(=O)O)c1)c1ccc(C(=O)O)c(C(=O)OC(=O)c2cc(C(=O)c3ccc(C(=O)O)c(C(=O)O)c3)ccc2C(=O)O)c1

nearest known ligand 0.65

Predicted protein targets (top 14)

geneUniProtsupporting neighboursconfidence
POLB P06746 5/20 0.65
L3MBTL1 Q9Y468 2/20 0.65
TDP1 Q9NUW8 2/20 0.65
CDC25B P30305 2/20 0.61
CDC25A P30304 1/20 0.61
HSD17B10 Q99714 1/20 0.61
KDM4E B2RXH2 1/20 0.50
ALDH1A1 P00352 3/20 0.42
SRD5A2 P31213 4/20 0.41
APEX1 P27695 2/20 0.41
CTDSP1 Q9GZU7 1/20 0.41
LMNA P02545 1/20 0.40
AKR1C3 P42330 1/20 0.39
ATM Q13315 1/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2805605 0.93 POLB (0.61) POLBL3MBTL1TDP1CDC25BCDC25A
SCHEMBL1271058 0.91 KDM4E (0.64) POLBL3MBTL1TDP1CDC25BCDC25A
SCHEMBL8891552 0.88 POLB (0.51) POLBL3MBTL1TDP1CDC25BCDC25A
SCHEMBL2174840 0.88 KDM4E (0.60) POLBL3MBTL1TDP1CDC25BCDC25A
SCHEMBL48886 0.88 POLB (0.80) POLBL3MBTL1TDP1CDC25BCDC25A
SCHEMBL29404709 0.88 POLB (0.80) POLBL3MBTL1TDP1CDC25BCDC25A
SCHEMBL9789528 0.86 KDM4E (0.56) POLBL3MBTL1TDP1CDC25BCDC25A
SCHEMBL4842453 0.86 CDC25A (0.59) POLBL3MBTL1TDP1CDC25BCDC25A
SCHEMBL27350624 0.86 HSD17B10 (0.57) POLBL3MBTL1TDP1CDC25BCDC25A
Hydrochloric Acid SCHEMBL893971 0.86 POLB (0.77) POLBL3MBTL1TDP1CDC25BCDC25A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 210 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2023083782-A1 EPOXY RESIN COMPOSITIONS FOR PRODUCING STORAGE-STABLE COMPOSITES EVONIK OPERATIONS GMBH (DE) 2023-05-19 WO claimed
EP-4180477-A1 EPOXY RESIN COMPOSITIONS FOR THE PREPARATION OF STORAGE-STABLE COMPOSITES Evonik Operations GmbH (DE) 2023-05-17 EP claimed
CN-114249900-A Preparation method of epoxy emulsifier, epoxy resin aqueous dispersion and preparation method 万华化学集团股份有限公司 2022-03-29 CN claimed
US-9394638-B2 Polyimide nonwoven fabric and process for production thereof TOYO BOSEKI KABUSHIKI KAISHA (JP) 2016-07-19 US claimed
US-9231254-B2 Binder composition for electrode, electrode for secondary battery and secondary battery including the same SAMSUNG SDI CO., LTD. (KR) 2016-01-05 US claimed
US-20140255777-A1 BINDER COMPOSITION FOR ELECTRODE, ELECTRODE FOR SECONDARY BATTERY AND SECONDARY BATTERY INCLUDING THE SAME SAMSUNG SDI CO., LTD. (KR) 2014-09-11 US claimed
US-20080268218-A1 INSULATED ELECTRIC WIRE LS CABLE LTD. (KR) 2008-10-30 US claimed
EP-0384774-B1 Semiconductor device encapsulant TOSHIBA KK (JP) 1997-01-22 EP claimed
US-5290320-A Fiber treatment agent DOW CORNING TORAY SILICONE CO., LTD. (JP) 1994-03-01 US claimed
EP-0488886-A1 Composition of ethylene-vinyl acetate copolymers TAOKA CHEMICAL CO., LTD (JP) 1992-06-03 EP claimed
US-4689390-A AMINE-EPOXY ADDUCT REACTED WITH PHENOLIC RESIN, ONE-PACK ASAHI DENKA KOGYO K.K. (JP) 1987-08-25 US claimed
JP-9279027-A None JP disclosed
JP-9279026-A None JP disclosed
JP-1149863-A None JP disclosed
JP-61111317-A None JP disclosed
US-4185043-A Polymers containing chemically bonded metal atoms HITCO (US) 1980-01-22 US disclosed
US-4167506-A Diazaphenalene derivatives and resin containing color compositions TEIJIN LIMITED (JP) 1979-09-11 US disclosed
US-4068923-A ELECTRO-OPTICAL CELL DAI NIPPON INSATSU KABUSHIKI KAISHA (JA) 1978-01-17 US disclosed
US-3994567-A Electro-optical cell for field effect type liquid crystal display DAI NIPPON INSATSU KABUSHIKI KAISHA (JA) 1976-11-30 US disclosed
US-3933745-A Imide copolymers possessing hydroxyl groups RHONE-POULENC S.A. (FR) 1976-01-20 US disclosed