SCHEMBL16969733

SCHEMBL16969733

CCCCCC(Cl)/C(Cl)=C(/O)Cl

nearest known ligand 0.39

Predicted protein targets (top 12)

geneUniProtsupporting neighboursconfidence
GPR84 Q9NQS5 7/20 0.39
FFAR1 O14842 2/20 0.39
LMNA P02545 1/20 0.38
MAPT P10636 1/20 0.38
LCK P06239 1/20 0.38
PPARD Q03181 1/20 0.38
ZDHHC20 Q5W0Z9 1/20 0.38
ZDHHC2 Q9UIJ5 1/20 0.38
OPRM1 P35372 1/20 0.36
FDPS P14324 4/20 0.35
FFAR4 Q5NUL3 1/20 0.35
ACE2 Q9BYF1 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL16969735 1.00 GPR84 (0.39) GPR84FFAR1LMNAMAPTLCK
SCHEMBL16970382 0.98 GPR84 (0.42) GPR84FFAR1LMNAMAPTLCK
SCHEMBL16970383 0.98 GPR84 (0.42) GPR84FFAR1LMNAMAPTLCK
SCHEMBL16970384 0.93 CA2 (0.37) GPR84FFAR1MAPTLCKPPARD
SCHEMBL16969978 0.84 GPR84 (0.42) GPR84FFAR1LMNAMAPTLCK
SCHEMBL9278652 0.84 LMNA (0.39) GPR84FFAR1LMNAMAPTLCK
SCHEMBL16970128 0.83 CHRM1 (0.35)
SCHEMBL16970127 0.83 CHRM1 (0.35)
SCHEMBL3685575 0.82 LMNA (0.43) GPR84FFAR1LMNAMAPTLCK
SCHEMBL11317313 0.82 LMNA (0.38) GPR84FFAR1LMNAMAPTLCK

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2905349-B1 Ag ball, solder joint, formed solder, solder paste and silver paste SENJU METAL INDUSTRY CO (JP) 2017-05-17 EP disclosed
US-9266196-B2 Ag ball, ag core ball, flux-coated ag ball, flux-coated ag core ball, solder joint, formed solder, solder paste and ag paste SENJU METAL INDUSTRY CO., LTD. (JP) 2016-02-23 US disclosed
EP-2905349-A2 Ag ball, Ag core ball, flux-coated Ag ball, flux-coated Ag core ball, solder joint, formed solder, solder paste and Ag paste SENJU METAL INDUSTRY CO., LTD. (JP) 2015-08-12 EP disclosed
US-20150217409-A1 Ag BALL, Ag CORE BALL, FLUX-COATED Ag BALL, FLUX-COATED Ag CORE BALL, SOLDER JOINT, FORMED SOLDER, SOLDER PASTE AND Ag PASTE Senju Metal lndustry Co., Ltd. (JP) 2015-08-06 US disclosed