SCHEMBL16970187

SCHEMBL16970187

CCCCC(I)C(O)(O)I

nearest known ligand 0.36

Predicted protein targets (top 14)

geneUniProtsupporting neighboursconfidence
FDPS P14324 2/20 0.36
ALDH1A1 P00352 3/20 0.36
DNM1 Q05193 2/20 0.35
CA2 P00918 6/20 0.33
MAPK1 P28482 1/20 0.33
CA1 P00915 3/20 0.32
HSPD1 P10809 1/20 0.32
BLM P54132 1/20 0.32
HSPE1 P61604 1/20 0.32
TDP1 Q9NUW8 1/20 0.31
LMNA P02545 1/20 0.31
TSHR P16473 2/20 0.30
SMN1; SMN2 Q16637 1/20 0.30
CYP3A4 P08684 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28023479 0.93 FDPS (0.39) FDPSCA1HSPD1BLMHSPE1
SCHEMBL28023465 0.91 LMNA (0.43) FDPSDNM1HSPD1BLMHSPE1
SCHEMBL16969881 0.91 LMNA (0.43) FDPSDNM1HSPD1BLMHSPE1
SCHEMBL16970167 0.91 LMNA (0.43) FDPSDNM1HSPD1BLMHSPE1
SCHEMBL16969963 0.85 FDPS (0.36) FDPSALDH1A1DNM1CA2MAPK1
SCHEMBL16969809 0.84
SCHEMBL16969715 0.83 FDPS (0.35) FDPSALDH1A1DNM1CA2MAPK1
SCHEMBL16969778 0.82 FDPS (0.42) FDPSALDH1A1DNM1CA2MAPK1
SCHEMBL16969786 0.78 FDPS (0.39) FDPSCA1HSPD1BLMHSPE1
SCHEMBL16969831 0.76 LMNA (0.43) FDPSDNM1HSPD1BLMHSPE1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2905349-B1 Ag ball, solder joint, formed solder, solder paste and silver paste SENJU METAL INDUSTRY CO (JP) 2017-05-17 EP disclosed
US-9266196-B2 Ag ball, ag core ball, flux-coated ag ball, flux-coated ag core ball, solder joint, formed solder, solder paste and ag paste SENJU METAL INDUSTRY CO., LTD. (JP) 2016-02-23 US disclosed
EP-2905349-A2 Ag ball, Ag core ball, flux-coated Ag ball, flux-coated Ag core ball, solder joint, formed solder, solder paste and Ag paste SENJU METAL INDUSTRY CO., LTD. (JP) 2015-08-12 EP disclosed
US-20150217409-A1 Ag BALL, Ag CORE BALL, FLUX-COATED Ag BALL, FLUX-COATED Ag CORE BALL, SOLDER JOINT, FORMED SOLDER, SOLDER PASTE AND Ag PASTE Senju Metal lndustry Co., Ltd. (JP) 2015-08-06 US disclosed