SCHEMBL16970167

SCHEMBL16970167

CCCCCCCCC(I)C(O)(O)I

nearest known ligand 0.43

Predicted protein targets (top 19)

geneUniProtsupporting neighboursconfidence
LMNA P02545 2/20 0.43
FDPS P14324 4/20 0.42
BLM P54132 2/20 0.41
HSPD1 P10809 1/20 0.41
HSPE1 P61604 1/20 0.41
GPR84 Q9NQS5 4/20 0.39
SPHK1 Q9NYA1 2/20 0.39
FFAR1 O14842 1/20 0.39
MAPT P10636 1/20 0.38
LCK P06239 1/20 0.38
PPARD Q03181 1/20 0.38
ZDHHC20 Q5W0Z9 1/20 0.38
ZDHHC2 Q9UIJ5 1/20 0.38
DNM1 Q05193 1/20 0.37
GMNN O75496 1/20 0.36
POLB P06746 1/20 0.36
CYP2D6 P10635 1/20 0.36
THPO P40225 1/20 0.36
MTOR P42345 1/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28023465 1.00 LMNA (0.43) LMNAFDPSBLMHSPD1HSPE1
SCHEMBL16969881 1.00 LMNA (0.43) LMNAFDPSBLMHSPD1HSPE1
SCHEMBL28023479 0.98 FDPS (0.39) LMNAFDPSBLMHSPD1HSPE1
SCHEMBL16970187 0.91 FDPS (0.36) LMNAFDPSBLMHSPD1HSPE1
SCHEMBL16969734 0.86 LMNA (0.43) LMNAFDPSBLMHSPD1HSPE1
SCHEMBL16969831 0.86 LMNA (0.43) LMNAFDPSBLMHSPD1HSPE1
SCHEMBL16969717 0.86 LMNA (0.43) LMNAFDPSBLMHSPD1HSPE1
SCHEMBL16969795 0.84 GPR84 (0.42) LMNAFDPSBLMHSPD1HSPE1
SCHEMBL16970322 0.84 GPR84 (0.42) LMNAFDPSBLMHSPD1HSPE1
SCHEMBL16969918 0.84 FDPS (0.48) LMNAFDPSGPR84SPHK1FFAR1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2905349-B1 Ag ball, solder joint, formed solder, solder paste and silver paste SENJU METAL INDUSTRY CO (JP) 2017-05-17 EP disclosed
US-9266196-B2 Ag ball, ag core ball, flux-coated ag ball, flux-coated ag core ball, solder joint, formed solder, solder paste and ag paste SENJU METAL INDUSTRY CO., LTD. (JP) 2016-02-23 US disclosed
EP-2905349-A2 Ag ball, Ag core ball, flux-coated Ag ball, flux-coated Ag core ball, solder joint, formed solder, solder paste and Ag paste SENJU METAL INDUSTRY CO., LTD. (JP) 2015-08-12 EP disclosed
US-20150217409-A1 Ag BALL, Ag CORE BALL, FLUX-COATED Ag BALL, FLUX-COATED Ag CORE BALL, SOLDER JOINT, FORMED SOLDER, SOLDER PASTE AND Ag PASTE Senju Metal lndustry Co., Ltd. (JP) 2015-08-06 US disclosed
CN-104816104-A Ag ball, Ag core ball, flux-coated Ag ball, flux-coated Ag core ball, solder joint, formed solder, solder paste SENJU METAL INDUSTRY CO 2015-08-05 CN disclosed