Known targets — ChEMBL curated mechanism
SCN10ASCN11ASCN1ASCN2ASCN3ASCN4ASCN5ASCN7ASCN8ASCN9A
The experimentally established mechanism targets of Phenazopyridine. The predicted profile below is derived independently by chemical similarity — agreement is a validation signal, a miss is honest.
Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | MAPT | P10636 | 9/20 | 0.96 |
| ▸ | MEN1 | O00255 | 8/20 | 0.96 |
| ▸ | KMT2A | Q03164 | 8/20 | 0.96 |
| ▸ | MAPK1 | P28482 | 6/20 | 0.96 |
| ▸ | TDP1 | Q9NUW8 | 5/20 | 0.96 |
| ▸ | CYP3A4 | P08684 | 3/20 | 0.96 |
| ▸ | SMN1; SMN2 | Q16637 | 3/20 | 0.96 |
| ▸ | HBB | P68871 | 2/20 | 0.96 |
| ▸ | KDM4E | B2RXH2 | 2/20 | 0.96 |
| ▸ | TSHR | P16473 | 2/20 | 0.96 |
| ▸ | ALOX15 | P16050 | 2/20 | 0.96 |
| ▸ | SARM1 | Q6SZW1 | 1/20 | 0.96 |
| ▸ | HSD17B10 | Q99714 | 1/20 | 0.96 |
| ▸ | LMNA | P02545 | 3/20 | 0.93 |
| ▸ | CYP1A2 | P05177 | 2/20 | 0.93 |
| ▸ | HIF1A | Q16665 | 2/20 | 0.93 |
| ▸ | USP2 | O75604 | 1/20 | 0.93 |
| ▸ | CHRM1 | P11229 | 1/20 | 0.93 |
| ▸ | CYP2C9 | P11712 | 1/20 | 0.93 |
| ▸ | DRD2 | P14416 | 1/20 | 0.93 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Phenazopyridine SCHEMBL28796595 | 0.98 | MAPT (1.00) | MAPTMEN1KMT2AMAPK1TDP1 | |
| Phenazopyridine SCHEMBL14687482 | 0.98 | MAPT (1.00) | MAPTMEN1KMT2AMAPK1TDP1 | |
| Phenazopyridine SCHEMBL19357 | 0.98 | MAPT (1.00) | MAPTMEN1KMT2AMAPK1TDP1 | |
| Phenazopyridine SCHEMBL29392321 | 0.98 | MAPT (1.00) | MAPTMEN1KMT2AMAPK1TDP1 | |
| Phenazopyridine SCHEMBL215655 | 0.98 | MAPT (1.00) | MAPTMEN1KMT2AMAPK1TDP1 | |
| Phenazopyridine SCHEMBL26499 | 0.98 | MAPT (1.00) | MAPTMEN1KMT2AMAPK1TDP1 | |
| Phenazopyridine SCHEMBL301672 | 0.96 | MAPT (0.96) | MAPTMEN1KMT2AMAPK1TDP1 | |
| Phenazopyridine SCHEMBL6661856 | 0.96 | MAPT (0.96) | MAPTMEN1KMT2AMAPK1TDP1 | |
| Phenazopyridine SCHEMBL302506 | 0.96 | MAPT (0.96) | MAPTMEN1KMT2AMAPK1TDP1 | |
| Phenazopyridine SCHEMBL5973732 | 0.96 | MAPT (0.96) | MAPTMEN1KMT2AMAPK1TDP1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 33 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-2590758-B1 | METHODS OF TREATING METAL SURFACES | ATOTECH DEUTSCHLAND GMBH (DE) | 2020-06-10 | — | — | EP | claimed |
| US-10375835-B2 | Methods of treating metal surfaces and devices formed thereby | ATOTECH DEUTCHLAND GMBH (DE) | 2019-08-06 | — | — | US | claimed |
| EP-2591645-B1 | METHODS OF TREATING COPPER SURFACES FOR ENHANCING ADHESION TO ORGANIC SUBSTRATES FOR USE IN PRINTED CIRCUIT BOARDS | NAMICS CORP (JP) | 2018-09-05 | — | — | EP | claimed |
| US-9795040-B2 | Methods of treating copper surfaces for enhancing adhesion to organic substrates for use in printed circuit boards | NAMICS CORPORATION (JP) | 2017-10-17 | — | — | US | claimed |
| US-20170027065-A1 | Methods Of Treating Copper Surfaces For Enhancing Adhesion To Organic Substrates For Use In Printed Circuit Boards | NAMICS CORPORATION (JP) | 2017-01-26 | — | — | US | claimed |
| US-20160360623-A1 | METHODS OF TREATING METAL SURFACES AND DEVICES FORMED THEREBY | ATOTECH DEUTSCHLAND GMBH & CO. KG (F/K/A ATOTECH DEUTSCHLAND GMBH) (DE) | 2016-12-08 | — | — | US | claimed |
| US-9345149-B2 | Methods of treating copper surfaces for enhancing adhesion to organic substrates for use in printed circuit boards | ESIONIC CORP. (US) | 2016-05-17 | — | — | US | claimed |
| EP-2591645-A1 | METHODS OF TREATING COPPER SURFACES FOR ENHANCING ADHESION TO ORGANIC SUBSTRATES FOR USE IN PRINTED CIRCUIT BOARDS | Esionic 3000, Inc. (US) | 2013-05-15 | — | — | EP | claimed |
| EP-2590758-A1 | METHODS OF TREATING METAL SURFACES AND DEVICES FORMED THEREBY | Atotech Deutschland GmbH (DE) | 2013-05-15 | — | — | EP | claimed |
| US-20120125514-A1 | Methods Of Treating Copper Surfaces For Enhancing Adhesion To Organic Substrates For Use In Printed Circuit Boards | ZETTACORE, INC. (US) | 2012-05-24 | — | — | US | claimed |
| WO-2012005722-A1 | METHODS OF TREATING METAL SURFACES AND DEVICES FORMED THEREBY | ZETTACORE, INC. (US) | 2012-01-12 | — | — | WO | claimed |
| WO-2012005723-A1 | METHODS OF TREATING COPPER SURFACES FOR ENHANCING ADHESION TO ORGANIC SUBSTRATES FOR USE IN PRINTED CIRCUIT BOARDS | ZETTACORE, INC. (US) | 2012-01-12 | — | — | WO | claimed |
| EP-2590758-B1 | METHODS OF TREATING METAL SURFACES | ATOTECH DEUTSCHLAND GMBH (DE) | 2020-06-10 | — | — | EP | disclosed |
| CN-107072072-B | Copper surface is handled to enhance the method for the adhesion strength to RF magnetron sputtering used in printed circuit board | 纳美仕有限公司 | 2019-10-25 | — | — | CN | disclosed |
| US-10375835-B2 | Methods of treating metal surfaces and devices formed thereby | ATOTECH DEUTCHLAND GMBH (DE) | 2019-08-06 | — | — | US | disclosed |
| EP-2591645-B1 | METHODS OF TREATING COPPER SURFACES FOR ENHANCING ADHESION TO ORGANIC SUBSTRATES FOR USE IN PRINTED CIRCUIT BOARDS | NAMICS CORP (JP) | 2018-09-05 | — | — | EP | disclosed |
| EP-2590758-A1 | METHODS OF TREATING METAL SURFACES AND DEVICES FORMED THEREBY | Atotech Deutschland GmbH (DE) | 2013-05-15 | — | — | EP | disclosed |
| US-20120125514-A1 | Methods Of Treating Copper Surfaces For Enhancing Adhesion To Organic Substrates For Use In Printed Circuit Boards | ZETTACORE, INC. (US) | 2012-05-24 | — | — | US | disclosed |
| WO-2012005722-A1 | METHODS OF TREATING METAL SURFACES AND DEVICES FORMED THEREBY | ZETTACORE, INC. (US) | 2012-01-12 | — | — | WO | disclosed |
| WO-2012005723-A1 | METHODS OF TREATING COPPER SURFACES FOR ENHANCING ADHESION TO ORGANIC SUBSTRATES FOR USE IN PRINTED CIRCUIT BOARDS | ZETTACORE, INC. (US) | 2012-01-12 | — | — | WO | disclosed |