SCHEMBL17002609

SCHEMBL17002609

C=C(C)c1cccc2cc3ccccc3cc12

nearest known ligand 0.56

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 6/20 0.56
KDM4E B2RXH2 3/20 0.56
GAA P10253 2/20 0.56
MEN1 O00255 2/20 0.40
KMT2A Q03164 2/20 0.40
MAPT P10636 2/20 0.40
SMN1; SMN2 Q16637 1/20 0.40
PTK2B Q14289 1/20 0.38
L3MBTL1 Q9Y468 1/20 0.38
PAX8 Q06710 1/20 0.37
HSD17B10 Q99714 3/20 0.37
HIF1A Q16665 1/20 0.37
CYP1B1 Q16678 1/20 0.37
NQO1 P15559 1/20 0.36
CYP1A2 P05177 3/20 0.36
HPGD P15428 3/20 0.36
NR4A1 P22736 1/20 0.35
NR4A2 P43354 1/20 0.35
NR4A3 Q92570 1/20 0.35
GLA P06280 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL31115692 1.00 ALDH1A1 (0.56) ALDH1A1KDM4EGAAMEN1KMT2A
Hydrogen Sulfide SCHEMBL28189994 0.98 ALDH1A1 (0.55) ALDH1A1KDM4EGAAMEN1KMT2A
SCHEMBL25748795 0.86 CYP1A2 (0.46) ALDH1A1KDM4EGAAMEN1KMT2A
SCHEMBL3555364 0.82 ALDH1A1 (0.59) ALDH1A1KDM4EGAAMEN1KMT2A
SCHEMBL197227 0.82 ALDH1A1 (0.58) ALDH1A1KDM4EGAAMEN1KMT2A
SCHEMBL273123 0.81 PTK2B (0.55) ALDH1A1KDM4EMEN1KMT2AMAPT
SCHEMBL29563474 0.81 PTK2B (0.55) ALDH1A1KDM4EMEN1KMT2AMAPT
SCHEMBL10842567 0.80 ALDH1A1 (0.56) ALDH1A1KDM4EGAAMEN1KMT2A
SCHEMBL978940 0.80 KDM4E (0.67) ALDH1A1KDM4EGAAMEN1KMT2A
SCHEMBL29875368 0.80 KDM4E (0.67) ALDH1A1KDM4EGAAMEN1KMT2A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 21 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-117461120-A Conductive paste, cured product, and semiconductor device 住友电木株式会社 2024-01-26 CN disclosed
CN-115884995-A Film 住友化学株式会社 2023-03-31 CN disclosed
CN-115884996-A Film 住友化学株式会社 2023-03-31 CN disclosed
EP-3536723-B1 COPOLYMER RUBBER AND METHOD FOR PRODUCING SAME, AND CROSSLINKED RUBBER COMPOSITION NIPPON STEEL CHEMICAL & MAT CO LTD (JP) 2023-01-25 EP disclosed
WO-2022270374-A1 COMPOSITION 住友化学株式会社 2022-12-29 WO disclosed
WO-2022270373-A1 COMPOSITION 住友化学株式会社 2022-12-29 WO disclosed
WO-2022270375-A1 COMPOSITION 住友化学株式会社 2022-12-29 WO disclosed
CN-115516010-A Resin particle and film 住友化学株式会社 2022-12-23 CN disclosed
WO-2022259905-A1 CONDUCTIVE PASTE, CURED PRODUCT, AND SEMICONDUCTOR DEVICE 住友ベークライト株式会社 2022-12-15 WO disclosed
WO-2022045361-A1 METHOD FOR PRODUCING COMPOSITION 住友化学株式会社 2022-03-03 WO disclosed
WO-2022045356-A1 PRODUCTION METHOD FOR COMPOSITION 住友化学株式会社 2022-03-03 WO disclosed
WO-2022045357-A1 FILM 住友化学株式会社 2022-03-03 WO disclosed
WO-2022045358-A1 COMPOSITION 住友化学株式会社 2022-03-03 WO disclosed
WO-2022045360-A1 FILM 住友化学株式会社 2022-03-03 WO disclosed
WO-2022045363-A1 FILM 住友化学株式会社 2022-03-03 WO disclosed
WO-2021241433-A1 RESIN PARTICLES AND FILM 住友化学株式会社 2021-12-02 WO disclosed
EP-3536723-A1 COPOLYMER RUBBER AND METHOD FOR PRODUCING SAME, AND CROSSLINKED RUBBER COMPOSITION NIPPON STEEL Chemical & Material Co., Ltd. (JP) 2019-09-11 EP disclosed
EP-3225644-A1 CURABLE RESIN COMPOSITION, AND CURED PRODUCT THEREOF Daicel Corporation (JP) 2017-10-04 EP disclosed
US-20150232620-A1 CURABLE RESIN COMPOSITION, AND CURED PRODUCT THEREOF DAICEL CORPORATION (JP) 2015-08-20 US disclosed
EP-2907833-A1 CURABLE RESIN COMPOSITION, AND CURED PRODUCT THEREOF Daicel Corporation (JP) 2015-08-19 EP disclosed