SCHEMBL170098

SCHEMBL170098

C(OCC1CO1)C1CO1.c1ccc(CC2CO2)cc1

nearest known ligand 0.53

Predicted protein targets (top 15)

geneUniProtsupporting neighboursconfidence
TDP1 Q9NUW8 1/20 0.53
MEN1 O00255 2/20 0.47
KMT2A Q03164 2/20 0.47
MGLL Q99685 2/20 0.46
ALDH1A1 P00352 2/20 0.44
GLA P06280 1/20 0.44
TSHR P16473 2/20 0.43
TP53 P04637 1/20 0.43
CYP3A4 P08684 1/20 0.43
SMN1; SMN2 Q16637 1/20 0.43
HIF1A Q16665 1/20 0.43
SLC6A2 P23975 1/20 0.42
SLC6A4 P31645 1/20 0.42
SLC6A3 Q01959 1/20 0.42
LMNA P02545 1/20 0.41

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL873444 0.88 SLC6A2 (0.50) TDP1MEN1KMT2ATSHRSLC6A2
SCHEMBL2186411 0.88 SLC6A2 (0.50) TDP1MEN1KMT2ATSHRSLC6A2
SCHEMBL51254 0.88 SLC6A2 (0.50) TDP1MEN1KMT2ATSHRSLC6A2
SCHEMBL2841231 0.87 TSHR (0.50) TDP1MEN1KMT2AMGLLALDH1A1
Diphenylmethane SCHEMBL2464629 0.86 MGLL (0.59) TDP1MEN1KMT2AMGLLALDH1A1
Water SCHEMBL27572757 0.86 SLC6A2 (0.48) TDP1MEN1KMT2ASLC6A2SLC6A4
Methane SCHEMBL28820455 0.86 SLC6A2 (0.48) TDP1MEN1KMT2ASLC6A2SLC6A4
SCHEMBL16993434 0.85 LMNA (0.55) TDP1MEN1KMT2AMGLLALDH1A1
Ethylene SCHEMBL28205448 0.84 SLC6A2 (0.47) TDP1MEN1KMT2ASLC6A2SLC6A4
Benzyl Alcohol SCHEMBL14889734 0.83 TSHR (0.52) TDP1MEN1KMT2AMGLLALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 375 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-119220106-A Composite toughening modified cold-mixed epoxy asphalt and preparation method thereof 中国公路工程咨询集团有限公司 2024-12-31 CN claimed
CN-116790175-A Interior wall sound insulation coating and preparation method thereof 江西恒大高新技术股份有限公司 2023-09-22 CN claimed
CN-111057219-B Thermosetting oligomer, thermosetting composition, thermosetting material and article comprising the same, and method for producing the same 高新特殊工程塑料全球技术有限公司 2022-12-06 CN claimed
EP-3504283-B1 SOLID HOMOGENEOUS AMORPHOUS HIGH HEAT EPOXY BLENDS, ARTICLES, AND USES THEREOF SHPP GLOBAL TECH BV (NL) 2021-04-07 EP claimed
US-20200263052-A1 SOLID HOMOGENEOUS AMORPHOUS HIGH HEAT EPOXY BLENDS, ARTICLES, AND USES THEREOF SHPP GLOBAL TECHNOLOGIES B.V. (NL) 2020-08-20 US claimed
CN-111057219-A Thermosetting oligomer, thermosetting composition, thermosetting material and article comprising the same, and method for producing the same 沙特基础工业全球技术有限公司 2020-04-24 CN claimed
EP-3640276-A1 HIGH HEAT EPOXY-TERMINATED POLYOXAZOLIDONES, COMPOSITIONS, METHODS OF MANUFACTURE, AND USES THEREOF SABIC Global Technologies B.V. (NL) 2020-04-22 EP claimed
US-20200115373-A1 HIGH HEAT EPOXY-TERMINATED POLYOXAZOLIDONES, COMPOSITIONS, METHODS OF MANUFACTURE, AND USES THEREOF SHPP GLOBAL TECHNOLOGIES B.V. (NL) 2020-04-16 US claimed
CN-110964404-A High-heat epoxy resin coating powder, preparation method and application thereof 沙特基础工业全球技术有限公司 2020-04-07 CN claimed
US-20200102459-A1 HIGH HEAT EPOXY COATING POWDERS, PROCESSES OF MAKING, AND USES THEREOF SHPP GLOBAL TECHNOLOGIES B.V. (NL) 2020-04-02 US claimed
WO-2007005275-A1 MOLDING COMPOSITION AND METHOD, AND MOLDED ARTICLE GENERAL ELECTRIC COMPANY (US) 2007-01-11 WO claimed
US-20070004872-A1 suitable for encapsulating solid state devices includes an epoxy resin( examples bisphenol A or F epoxy resin, phenol or cresol novolak resins etc.) a hardener, a poly(arylene ether) resin and sililca filler; curable; exhibits improved increased copper substrte adhesion and reduced shrinkage CITIBANK, N.A., AS COLLATERAL AGENT 2007-01-04 US claimed
US-20070004819-A1 A curable epoxy resin , two latent cationic curing catalyst, a free radical-producng cocatalyst and inorganic filler of about 70-95 weight % based on the total weight; catalyst allows the use of increased filler loadingsto reduce moisture absorption and thermal expansion; encapsulating solid state device CITIBANK, N.A., AS COLLATERAL AGENT 2007-01-04 US claimed
US-20070004871-A1 Curable composition and method CITIBANK, N.A., AS COLLATERAL AGENT 2007-01-04 US claimed
WO-2006135556-A2 B-STAGEABLE FILM, ELECTRONIC DEVICE, AND ASSOCIATED PROCESS MOMENTIVE PERFORMANCE MATERIALS INC. (US) 2006-12-21 WO claimed
US-20060275608-A1 B-stageable film, electronic device, and associated process GENERAL ELECTRIC COMPANY 2006-12-07 US claimed
US-6800373-B2 COMPRISES AT LEAST ONE SILICONE RESIN, AT LEAST ONE EPOXY RESIN, AT LEAST ONE ANHYDRIDE CURING AGENT, AT LEAST ONE SILOXANE SURFACTANT, AND AT LEAST ONE ANCILLARY CURING CATALYST GENERAL ELECTRIC COMPANY 2004-10-05 US claimed
US-20040067366-A1 COMPRISES AT LEAST ONE SILICONE RESIN, AT LEAST ONE EPOXY RESIN, AT LEAST ONE ANHYDRIDE CURING AGENT, AT LEAST ONE SILOXANE SURFACTANT, AND AT LEAST ONE ANCILLARY CURING CATALYST GENERAL ELECTRIC COMPANY 2004-04-08 US claimed
US-6507049-B1 Encapsulants for solid state devices GENERAL ELECTRIC COMPANY 2003-01-14 US claimed
WO-2002019440-A1 ENCAPSULANTS FOR SOLID STATE DEVICES GENERAL ELECTRIC COMPANY (US) 2002-03-07 WO claimed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20200115373-A1 HIGH HEAT EPOXY-TERMINATED POLYOXAZOLIDONES, COMPOSITIONS, METHODS OF MANUFACTURE, AND USES THEREOF CBR3, HEATR1, RPP30 TDP1 2629/4885MEN1 3585/4885KMT2A 2314/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.