SCHEMBL17054281

SCHEMBL17054281

COc1ccc(/C=C/C(=O)c2ccc(N3CCOCC3)cc2)cc1[N+](=O)[O-]

nearest known ligand 0.66

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
▸ MAPT P10636 11/20 0.66
▸ ALDH1A1 P00352 7/20 0.66
▸ LMNA P02545 4/20 0.66
▸ NPSR1 Q6W5P4 3/20 0.66
▸ NPC1 O15118 3/20 0.58
▸ RAB9A P51151 3/20 0.58
▸ SMN1; SMN2 Q16637 4/20 0.57
▸ L3MBTL1 Q9Y468 4/20 0.57
▸ MAPK1 P28482 3/20 0.57
▸ TP53 P04637 1/20 0.57
▸ TDP1 Q9NUW8 1/20 0.57
▸ KMT2A Q03164 4/20 0.56
▸ MEN1 O00255 3/20 0.56
▸ HTT P42858 1/20 0.56
▸ PTPN1 P18031 1/20 0.56
▸ KDR P35968 1/20 0.55
▸ KDM4E B2RXH2 2/20 0.55
▸ RECQL P46063 1/20 0.55
▸ MAOB P27338 2/20 0.55
▸ MAOA P21397 1/20 0.54

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL25218218 0.85 MAPT (0.62) MAPTALDH1A1LMNANPSR1NPC1
SCHEMBL25198669 0.85 MAPT (0.62) MAPTALDH1A1LMNANPSR1NPC1
SCHEMBL25192148 0.84 MAPT (0.67) MAPTALDH1A1LMNANPSR1NPC1
SCHEMBL30383417 0.84 MAPT (0.67) MAPTALDH1A1LMNANPSR1NPC1
SCHEMBL25190579 0.84 MAPT (0.67) MAPTALDH1A1LMNANPSR1NPC1
SCHEMBL30383230 0.84 MAPT (0.67) MAPTALDH1A1LMNANPSR1NPC1
SCHEMBL17054282 0.83 ALDH1A1 (0.56) MAPTALDH1A1LMNANPSR1NPC1
SCHEMBL14375110 0.82 TRPV1 (0.67) MAPTALDH1A1LMNANPSR1NPC1
SCHEMBL19782818 0.82 MAPT (0.67) MAPTNPC1RAB9APTPN1KDR
SCHEMBL25219790 0.82 MAPT (0.67) MAPTNPC1RAB9APTPN1KDR

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-9547239-B2 Positive photosensitive resin composition, method for forming polyimide resin patterns, and patterned polyimide resin film TOKYO OHKA KOGYO CO., LTD. (JP) 2017-01-17 — — US disclosed
US-9547239-B2 Positive photosensitive resin composition, method for forming polyimide resin patterns, and patterned polyimide resin film TOKYO OHKA KOGYO CO., LTD. (JP) 2017-01-17 — — US disclosed
US-20150261086-A1 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR FORMING POLYIMIDE RESIN PATTERNS, AND PATTERNED POLYIMIDE RESIN FILM TOKYO OHKA KOGYO CO, LTD. (JP) 2015-09-17 — — US disclosed
US-20150261086-A1 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR FORMING POLYIMIDE RESIN PATTERNS, AND PATTERNED POLYIMIDE RESIN FILM TOKYO OHKA KOGYO CO, LTD. (JP) 2015-09-17 — — US disclosed
EP-2913714-A1 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR FORMING POLYIMIDE RESIN PATTERNS, AND PATTERNED POLYIMIDE RESIN FILM Tokyo Ohka Kogyo Co., Ltd. (JP) 2015-09-02 — — EP disclosed
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