SCHEMBL17069988

SCHEMBL17069988

CC(=O)O/N=C(/CCSc1ccc(Cl)cc1)C(=O)c1ccc(Sc2ccccc2)cc1

nearest known ligand 0.41

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
▸ HTT P42858 4/20 0.41
▸ PKM P14618 1/20 0.41
▸ ALDH1A1 P00352 3/20 0.41
▸ HPGD P15428 2/20 0.41
▸ L3MBTL1 Q9Y468 4/20 0.39
▸ SDCBP O00560 1/20 0.38
▸ SDC2 P34741 1/20 0.38
▸ MAPT P10636 2/20 0.38
▸ KMT2A Q03164 2/20 0.38
▸ LMNA P02545 1/20 0.38
▸ NPSR1 Q6W5P4 1/20 0.38
▸ CES2 O00748 1/20 0.38
▸ CES1 P23141 1/20 0.38
▸ RAB9A P51151 1/20 0.37
▸ SMN1; SMN2 Q16637 2/20 0.37
▸ POLB P06746 1/20 0.37
▸ HDAC3 O15379 1/20 0.37
▸ HDAC4 P56524 1/20 0.37
▸ HDAC1 Q13547 1/20 0.37
▸ HDAC7 Q8WUI4 1/20 0.37

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL10262989 1.00 HTT (0.41) HTTPKMALDH1A1HPGDL3MBTL1
SCHEMBL10144554 1.00 HTT (0.41) HTTPKMALDH1A1HPGDL3MBTL1
SCHEMBL12286103 0.96 PKM (0.44) HTTPKMALDH1A1HPGDL3MBTL1
SCHEMBL17069990 0.95 HTT (0.39) HTTPKMALDH1A1HPGDL3MBTL1
SCHEMBL2742396 0.95 HTT (0.39) HTTPKMALDH1A1HPGDL3MBTL1
SCHEMBL1087609 0.94 ALDH1A1 (0.46) HTTALDH1A1HPGDL3MBTL1MAPT
SCHEMBL12455475 0.92 HPGD (0.42) HTTPKMALDH1A1HPGDL3MBTL1
SCHEMBL17070004 0.92 HTT (0.37) HTTPKMALDH1A1HPGDL3MBTL1
SCHEMBL12350148 0.91 MAPT (0.38) HTTPKMALDH1A1HPGDL3MBTL1
SCHEMBL12350150 0.90 HSP90AA1 (0.42) HTTPKMALDH1A1HPGDL3MBTL1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 9 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-9683150-B2 Curable composition, adhesive, method of producing fiber-reinforced composite material, and fiber-reinforced composite material TOKYO OHKA KOGYO CO., LTD. (JP) 2017-06-20 — — US disclosed
US-9683150-B2 Curable composition, adhesive, method of producing fiber-reinforced composite material, and fiber-reinforced composite material TOKYO OHKA KOGYO CO., LTD. (JP) 2017-06-20 — — US disclosed
US-20170115563-A1 ENERGY-SENSITIVE RESIN COMPOSITION TOKYO OHKA KOGYO CO., LTD. (JP) 2017-04-27 — — US disclosed
US-20170115563-A1 ENERGY-SENSITIVE RESIN COMPOSITION TOKYO OHKA KOGYO CO., LTD. (JP) 2017-04-27 — — US disclosed
EP-2930200-B1 Curable composition, adhesive, method of producing fiber-reinforced composite material, and fiber-reinforced composite material TOKYO OHKA KOGYO CO LTD (JP) 2016-07-20 — — EP disclosed
WO-2015198887-A1 ENERGY-SENSITIVE RESIN COMPOSITION 東京応化工業株式会社 2015-12-30 — — WO disclosed
EP-2930200-A1 Curable composition, adhesive, method of producing fiber-reinforced composite material, and fiber-reinforced composite material TOKYO OHKA KOGYO CO., LTD. (JP) 2015-10-14 — — EP disclosed
US-20150252229-A1 CURABLE COMPOSITION, ADHESIVE, METHOD OF PRODUCING FIBER-REINFORCED COMPOSITE MATERIAL, AND FIBER-REINFORCED COMPOSITE MATERIAL TOKYO OHKA KOGYO CO., LTD. (JP) 2015-09-10 — — US disclosed
US-20150252229-A1 CURABLE COMPOSITION, ADHESIVE, METHOD OF PRODUCING FIBER-REINFORCED COMPOSITE MATERIAL, AND FIBER-REINFORCED COMPOSITE MATERIAL TOKYO OHKA KOGYO CO., LTD. (JP) 2015-09-10 — — US disclosed
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