SCHEMBL17070004

SCHEMBL17070004

CC(=O)O/N=C(/CCSc1ccc(Cl)cc1)C(=O)c1ccc(Sc2ccc(C(=O)c3ccc(-c4ccccc4)cc3)cc2)cc1

nearest known ligand 0.37

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
▸ HTT P42858 2/20 0.37
▸ PKM P14618 1/20 0.37
▸ MMP2 P08253 4/20 0.36
▸ MMP3 P08254 3/20 0.36
▸ MMP9 P14780 3/20 0.36
▸ MMP13 P45452 2/20 0.36
▸ MMP1 P03956 1/20 0.36
▸ MMP8 P22894 1/20 0.36
▸ SMN1; SMN2 Q16637 2/20 0.36
▸ L3MBTL1 Q9Y468 3/20 0.35
▸ SDCBP O00560 1/20 0.35
▸ SDC2 P34741 1/20 0.35
▸ HDAC1 Q13547 1/20 0.35
▸ HDAC2 Q92769 1/20 0.35
▸ LMNA P02545 3/20 0.34
▸ ALDH1A1 P00352 2/20 0.34
▸ HPGD P15428 2/20 0.34
▸ MAPT P10636 2/20 0.34
▸ KMT2A Q03164 1/20 0.34
▸ NPSR1 Q6W5P4 1/20 0.34

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL17069990 0.95 HTT (0.39) HTTPKMSMN1; SMN2L3MBTL1SDCBP
SCHEMBL2742396 0.95 HTT (0.39) HTTPKMSMN1; SMN2L3MBTL1SDCBP
SCHEMBL10262989 0.92 HTT (0.41) HTTPKMSMN1; SMN2L3MBTL1SDCBP
SCHEMBL10144554 0.92 HTT (0.41) HTTPKMSMN1; SMN2L3MBTL1SDCBP
SCHEMBL17069988 0.92 HTT (0.41) HTTPKMSMN1; SMN2L3MBTL1SDCBP
SCHEMBL10223312 0.91 ADORA3 (0.38) HTTPKMMMP1SMN1; SMN2L3MBTL1
SCHEMBL12286103 0.90 PKM (0.44) HTTPKMSMN1; SMN2L3MBTL1SDCBP
SCHEMBL12350155 0.89 RAB9A (0.40) HTTPKML3MBTL1HDAC1HDAC2
SCHEMBL12455441 0.89 ALDH1A1 (0.42) HTTSMN1; SMN2L3MBTL1ALDH1A1HPGD
SCHEMBL21153924 0.89 HDAC1 (0.42) HTTPKML3MBTL1HDAC1HDAC2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 9 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-9683150-B2 Curable composition, adhesive, method of producing fiber-reinforced composite material, and fiber-reinforced composite material TOKYO OHKA KOGYO CO., LTD. (JP) 2017-06-20 — — US disclosed
US-9683150-B2 Curable composition, adhesive, method of producing fiber-reinforced composite material, and fiber-reinforced composite material TOKYO OHKA KOGYO CO., LTD. (JP) 2017-06-20 — — US disclosed
US-20170115563-A1 ENERGY-SENSITIVE RESIN COMPOSITION TOKYO OHKA KOGYO CO., LTD. (JP) 2017-04-27 — — US disclosed
US-20170115563-A1 ENERGY-SENSITIVE RESIN COMPOSITION TOKYO OHKA KOGYO CO., LTD. (JP) 2017-04-27 — — US disclosed
EP-2930200-B1 Curable composition, adhesive, method of producing fiber-reinforced composite material, and fiber-reinforced composite material TOKYO OHKA KOGYO CO LTD (JP) 2016-07-20 — — EP disclosed
WO-2015198887-A1 ENERGY-SENSITIVE RESIN COMPOSITION 東京応化工業株式会社 2015-12-30 — — WO disclosed
EP-2930200-A1 Curable composition, adhesive, method of producing fiber-reinforced composite material, and fiber-reinforced composite material TOKYO OHKA KOGYO CO., LTD. (JP) 2015-10-14 — — EP disclosed
US-20150252229-A1 CURABLE COMPOSITION, ADHESIVE, METHOD OF PRODUCING FIBER-REINFORCED COMPOSITE MATERIAL, AND FIBER-REINFORCED COMPOSITE MATERIAL TOKYO OHKA KOGYO CO., LTD. (JP) 2015-09-10 — — US disclosed
US-20150252229-A1 CURABLE COMPOSITION, ADHESIVE, METHOD OF PRODUCING FIBER-REINFORCED COMPOSITE MATERIAL, AND FIBER-REINFORCED COMPOSITE MATERIAL TOKYO OHKA KOGYO CO., LTD. (JP) 2015-09-10 — — US disclosed
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