SCHEMBL17069995

SCHEMBL17069995

CC(=O)O/N=C(/CCC1CCCCC1)C(=O)c1ccc(Sc2ccccc2)cc1

nearest known ligand 0.46

Predicted protein targets (top 13)

geneUniProtsupporting neighboursconfidence
MEN1 O00255 4/20 0.43
KMT2A Q03164 4/20 0.43
L3MBTL1 Q9Y468 2/20 0.43
LMNA P02545 1/20 0.43
SMN1; SMN2 Q16637 2/20 0.41
NPC1 O15118 1/20 0.41
RAB9A P51151 1/20 0.41
ALDH1A1 P00352 4/20 0.40
HPGD P15428 1/20 0.40
TDP1 Q9NUW8 2/20 0.39
MAPT P10636 4/20 0.39
KLK7 P49862 2/20 0.36
CHEK2 O96017 1/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL19795433 1.00 MEN1 (0.43) MEN1KMT2AL3MBTL1LMNASMN1; SMN2
SCHEMBL17069999 0.99 L3MBTL1 (0.44) MEN1KMT2AL3MBTL1LMNASMN1; SMN2
SCHEMBL17540454 0.97 L3MBTL1 (0.41) MEN1KMT2AL3MBTL1LMNASMN1; SMN2
SCHEMBL19795453 0.94 MEN1 (0.40) MEN1KMT2AL3MBTL1LMNASMN1; SMN2
SCHEMBL17540461 0.90 L3MBTL1 (0.44) MEN1KMT2AL3MBTL1LMNASMN1; SMN2
SCHEMBL17540444 0.89 L3MBTL1 (0.43) MEN1KMT2AL3MBTL1LMNASMN1; SMN2
SCHEMBL17070003 0.89 L3MBTL1 (0.43) MEN1KMT2AL3MBTL1LMNASMN1; SMN2
SCHEMBL28883558 0.89 ALDH1A1 (0.42) MEN1KMT2AL3MBTL1LMNANPC1
SCHEMBL16371669 0.89 ALDH1A1 (0.42) MEN1KMT2AL3MBTL1LMNANPC1
SCHEMBL16371670 0.89 ALDH1A1 (0.42) MEN1KMT2AL3MBTL1LMNANPC1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 9 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-9683150-B2 Curable composition, adhesive, method of producing fiber-reinforced composite material, and fiber-reinforced composite material TOKYO OHKA KOGYO CO., LTD. (JP) 2017-06-20 US disclosed
US-9683150-B2 Curable composition, adhesive, method of producing fiber-reinforced composite material, and fiber-reinforced composite material TOKYO OHKA KOGYO CO., LTD. (JP) 2017-06-20 US disclosed
US-20170115563-A1 ENERGY-SENSITIVE RESIN COMPOSITION TOKYO OHKA KOGYO CO., LTD. (JP) 2017-04-27 US disclosed
US-20170115563-A1 ENERGY-SENSITIVE RESIN COMPOSITION TOKYO OHKA KOGYO CO., LTD. (JP) 2017-04-27 US disclosed
EP-2930200-B1 Curable composition, adhesive, method of producing fiber-reinforced composite material, and fiber-reinforced composite material TOKYO OHKA KOGYO CO LTD (JP) 2016-07-20 EP disclosed
WO-2015198887-A1 ENERGY-SENSITIVE RESIN COMPOSITION 東京応化工業株式会社 2015-12-30 WO disclosed
EP-2930200-A1 Curable composition, adhesive, method of producing fiber-reinforced composite material, and fiber-reinforced composite material TOKYO OHKA KOGYO CO., LTD. (JP) 2015-10-14 EP disclosed
US-20150252229-A1 CURABLE COMPOSITION, ADHESIVE, METHOD OF PRODUCING FIBER-REINFORCED COMPOSITE MATERIAL, AND FIBER-REINFORCED COMPOSITE MATERIAL TOKYO OHKA KOGYO CO., LTD. (JP) 2015-09-10 US disclosed
US-20150252229-A1 CURABLE COMPOSITION, ADHESIVE, METHOD OF PRODUCING FIBER-REINFORCED COMPOSITE MATERIAL, AND FIBER-REINFORCED COMPOSITE MATERIAL TOKYO OHKA KOGYO CO., LTD. (JP) 2015-09-10 US disclosed