SCHEMBL17069999

SCHEMBL17069999

CC(=O)O/N=C(/CCC1CCCC1)C(=O)c1ccc(Sc2ccccc2)cc1

nearest known ligand 0.46

Predicted protein targets (top 16)

geneUniProtsupporting neighboursconfidence
L3MBTL1 Q9Y468 3/20 0.44
LMNA P02545 2/20 0.44
MEN1 O00255 4/20 0.42
KMT2A Q03164 4/20 0.42
ALDH1A1 P00352 5/20 0.41
HPGD P15428 1/20 0.41
SMN1; SMN2 Q16637 3/20 0.40
TDP1 Q9NUW8 2/20 0.40
NPC1 O15118 1/20 0.40
RAB9A P51151 1/20 0.40
MAPT P10636 4/20 0.38
KLK7 P49862 2/20 0.36
CYP1A2 P05177 1/20 0.36
CYP3A4 P08684 1/20 0.36
CYP2C9 P11712 1/20 0.36
CYP2C19 P33261 1/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL17069995 0.99 MEN1 (0.43) L3MBTL1LMNAMEN1KMT2AALDH1A1
SCHEMBL19795433 0.99 MEN1 (0.43) L3MBTL1LMNAMEN1KMT2AALDH1A1
SCHEMBL17540454 0.98 L3MBTL1 (0.41) L3MBTL1LMNAMEN1KMT2AALDH1A1
SCHEMBL19795453 0.93 MEN1 (0.40) L3MBTL1LMNAMEN1KMT2AALDH1A1
SCHEMBL25373230 0.89 L3MBTL1 (0.44) L3MBTL1LMNAMEN1KMT2AALDH1A1
SCHEMBL17070001 0.89 L3MBTL1 (0.44) L3MBTL1LMNAMEN1KMT2AALDH1A1
SCHEMBL19795438 0.89 L3MBTL1 (0.44) L3MBTL1LMNAMEN1KMT2AALDH1A1
SCHEMBL21333934 0.89 ALDH1A1 (0.43) L3MBTL1LMNAKMT2AALDH1A1HPGD
SCHEMBL17070000 0.89 ALDH1A1 (0.43) L3MBTL1LMNAKMT2AALDH1A1HPGD
SCHEMBL17540461 0.89 L3MBTL1 (0.44) L3MBTL1LMNAMEN1KMT2AALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 9 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-9683150-B2 Curable composition, adhesive, method of producing fiber-reinforced composite material, and fiber-reinforced composite material TOKYO OHKA KOGYO CO., LTD. (JP) 2017-06-20 US disclosed
US-9683150-B2 Curable composition, adhesive, method of producing fiber-reinforced composite material, and fiber-reinforced composite material TOKYO OHKA KOGYO CO., LTD. (JP) 2017-06-20 US disclosed
US-20170115563-A1 ENERGY-SENSITIVE RESIN COMPOSITION TOKYO OHKA KOGYO CO., LTD. (JP) 2017-04-27 US disclosed
US-20170115563-A1 ENERGY-SENSITIVE RESIN COMPOSITION TOKYO OHKA KOGYO CO., LTD. (JP) 2017-04-27 US disclosed
EP-2930200-B1 Curable composition, adhesive, method of producing fiber-reinforced composite material, and fiber-reinforced composite material TOKYO OHKA KOGYO CO LTD (JP) 2016-07-20 EP disclosed
WO-2015198887-A1 ENERGY-SENSITIVE RESIN COMPOSITION 東京応化工業株式会社 2015-12-30 WO disclosed
EP-2930200-A1 Curable composition, adhesive, method of producing fiber-reinforced composite material, and fiber-reinforced composite material TOKYO OHKA KOGYO CO., LTD. (JP) 2015-10-14 EP disclosed
US-20150252229-A1 CURABLE COMPOSITION, ADHESIVE, METHOD OF PRODUCING FIBER-REINFORCED COMPOSITE MATERIAL, AND FIBER-REINFORCED COMPOSITE MATERIAL TOKYO OHKA KOGYO CO., LTD. (JP) 2015-09-10 US disclosed
US-20150252229-A1 CURABLE COMPOSITION, ADHESIVE, METHOD OF PRODUCING FIBER-REINFORCED COMPOSITE MATERIAL, AND FIBER-REINFORCED COMPOSITE MATERIAL TOKYO OHKA KOGYO CO., LTD. (JP) 2015-09-10 US disclosed