SCHEMBL17090716

SCHEMBL17090716

CCC(C)(CC)OCC1CO1

nearest known ligand 0.64

Predicted protein targets (top 15)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 9/20 0.64
TSHR P16473 5/20 0.48
MAPK1 P28482 1/20 0.48
SMN1; SMN2 Q16637 2/20 0.42
TDP1 Q9NUW8 2/20 0.39
TP53 P04637 4/20 0.39
MAPT P10636 2/20 0.39
HPGD P15428 2/20 0.39
MEN1 O00255 2/20 0.39
KMT2A Q03164 2/20 0.39
HIF1A Q16665 2/20 0.39
CYP1A2 P05177 1/20 0.39
PPARG P37231 1/20 0.39
GLA P06280 1/20 0.33
CYP3A4 P08684 2/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL13991448 0.86 ALDH1A1 (0.53) ALDH1A1TSHRMAPK1SMN1; SMN2TDP1
SCHEMBL7957645 0.83 ALDH1A1 (0.50) ALDH1A1TSHRMAPK1SMN1; SMN2TDP1
SCHEMBL1700016 0.82 ALDH1A1 (0.64) ALDH1A1TSHRMAPK1SMN1; SMN2TDP1
SCHEMBL11744628 0.82 ALDH1A1 (0.64) ALDH1A1TSHRMAPK1SMN1; SMN2TDP1
SCHEMBL21882000 0.82 ALDH1A1 (0.48) ALDH1A1TSHRMAPK1SMN1; SMN2TDP1
SCHEMBL22096093 0.82 ALDH1A1 (0.50) ALDH1A1TSHRMAPK1SMN1; SMN2TDP1
SCHEMBL5369450 0.82 ALDH1A1 (0.48) ALDH1A1TSHRMAPK1SMN1; SMN2TDP1
SCHEMBL14177832 0.80 ALDH1A1 (0.47) ALDH1A1TSHRMAPK1SMN1; SMN2TDP1
SCHEMBL5360156 0.80 ALDH1A1 (0.47) ALDH1A1TSHRMAPK1SMN1; SMN2TDP1
SCHEMBL12064794 0.80 ALDH1A1 (0.47) ALDH1A1TSHRMAPK1SMN1; SMN2TDP1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-115820036-A Ink composition and electronic device including film formed using ink composition 三星显示有限公司 2023-03-21 CN disclosed
CN-111819262-B Curable adhesive composition, adhesive sheet using the same, laminate containing the adhesive sheet, and method for producing the laminate DIC株式会社 2022-11-18 CN disclosed
CN-111819262-A Curable adhesive composition, adhesive sheet using the composition, laminate containing the adhesive sheet, and method for producing the laminate DIC株式会社 2020-10-23 CN disclosed
CN-111108162-A Method for producing laminate containing curable bonding material DIC株式会社 2020-05-05 CN disclosed
US-9139687-B2 Soluble imide skeleton resin, soluble imide skeleton resin solution composition, curable resin composition, and cured product thereof MITSUBISHI CHEMICAL CORPORATION (JP) 2015-09-22 US disclosed