SCHEMBL17220670

SCHEMBL17220670

Cc1cc(-c2cc(C)c(O)c(C)c2)cc(C)c1O.Oc1ccc(-c2ccc(O)cc2)cc1

nearest known ligand 0.70

Predicted protein targets (top 19)

geneUniProtsupporting neighboursconfidence
CA1 P00915 1/20 0.70
CA2 P00918 1/20 0.70
ESR1 P03372 7/20 0.62
ABL1 P00519 3/20 0.56
ABCB1 P08183 3/20 0.56
BCR P11274 3/20 0.56
ESR2 Q92731 6/20 0.55
SENP1 Q9P0U3 1/20 0.50
MEN1 O00255 1/20 0.48
KMT2A Q03164 1/20 0.48
CYP1A2 P05177 1/20 0.46
CYP2C9 P11712 1/20 0.46
CYP2C19 P33261 1/20 0.46
ALOX5 P09917 1/20 0.46
MMP3 P08254 1/20 0.46
BCL2L1 Q07817 1/20 0.46
HSD17B1 P14061 2/20 0.45
HSD17B2 P37059 2/20 0.45
ACHE P22303 1/20 0.43

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL503537 1.00 CA1 (0.70) CA1CA2ESR1ABL1ABCB1
SCHEMBL278774 1.00 CA1 (0.70) CA1CA2ESR1ABL1ABCB1
SCHEMBL17060490 0.92 CA1 (0.82) CA1CA2ESR1ABL1ABCB1
P-Cresol SCHEMBL15511799 0.88 CA1 (0.67) CA1CA2ESR1ABL1ABCB1
SCHEMBL28148470 0.85 ESR1 (0.62) CA1CA2ESR1ABL1ABCB1
SCHEMBL15445310 0.85 CA1 (0.70) CA1CA2ESR1MEN1KMT2A
SCHEMBL220910 0.84 CA1 (1.00) CA1CA2ESR1ESR2MEN1
SCHEMBL22804025 0.84 CA1 (1.00) CA1CA2ESR1ESR2MEN1
Phenol SCHEMBL7039341 0.83 CA1 (0.67) CA1CA2ESR2MEN1KMT2A
SCHEMBL3807600 0.82 CYP2C9 (0.78) CA1CA2ESR1ABL1ABCB1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 10 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-9504147-B2 Resin composition, and printed circuit board using same LG INNOTEK CO., LTD. (KR) 2016-11-22 US disclosed
US-9468096-B2 Epoxy resin composition, and printed circuit board using same LG INNOTEK CO., LTD. (KR) 2016-10-11 US disclosed
US-9445498-B2 Epoxy resin composition and printed circuit board LG INNOTEK CO., LTD. (KR) 2016-09-13 US disclosed
US-9445499-B2 Epoxy resin composition, and printed circuit board using same LG INNOTEK CO., LTD. (KR) 2016-09-13 US disclosed
US-9445500-B2 Epoxy resin composition and printed circuit board using same LG INNOTEK CO., LTD. (KR) 2016-09-13 US disclosed
US-20150334827-A1 EPOXY RESIN COMPOSITION AND PRINTED CIRCUIT BOARD USING SAME LG INNOTEK CO., LTD. (KR) 2015-11-19 US disclosed
US-20150319856-A1 EPOXY RESIN COMPOSITION, AND PRINTED CIRCUIT BOARD USING SAME LG INNOTEK CO., LTD. (KR) 2015-11-05 US disclosed
US-20150319854-A1 EPOXY RESIN COMPOSITION AND PRINTED CIRCUIT BOARD LG INNOTEK CO., LTD. (KR) 2015-11-05 US disclosed
US-20150319855-A1 RESIN COMPOSITION, AND PRINTED CIRCUIT BOARD USING SAME LG INNOTEK CO., LTD. (KR) 2015-11-05 US disclosed
US-20150319857-A1 EPOXY RESIN COMPOSITION, AND PRINTED CIRCUIT BOARD USING SAME LG INNOTEK CO., LTD. (KR) 2015-11-05 US disclosed