SCHEMBL503537

SCHEMBL503537

Cc1cc(-c2ccc(-c3ccc(O)cc3)cc2)cc(C)c1O

nearest known ligand 0.70

Predicted protein targets (top 19)

geneUniProtsupporting neighboursconfidence
CA1 P00915 1/20 0.70
CA2 P00918 1/20 0.70
ESR1 P03372 7/20 0.62
ABL1 P00519 3/20 0.56
ABCB1 P08183 3/20 0.56
BCR P11274 3/20 0.56
ESR2 Q92731 6/20 0.55
SENP1 Q9P0U3 1/20 0.50
MEN1 O00255 1/20 0.48
KMT2A Q03164 1/20 0.48
CYP1A2 P05177 1/20 0.46
CYP2C9 P11712 1/20 0.46
CYP2C19 P33261 1/20 0.46
ALOX5 P09917 1/20 0.46
MMP3 P08254 1/20 0.46
BCL2L1 Q07817 1/20 0.46
HSD17B1 P14061 2/20 0.45
HSD17B2 P37059 2/20 0.45
ACHE P22303 1/20 0.43

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL278774 1.00 CA1 (0.70) CA1CA2ESR1ABL1ABCB1
SCHEMBL17220670 1.00 CA1 (0.70) CA1CA2ESR1ABL1ABCB1
SCHEMBL17060490 0.92 CA1 (0.82) CA1CA2ESR1ABL1ABCB1
P-Cresol SCHEMBL15511799 0.88 CA1 (0.67) CA1CA2ESR1ABL1ABCB1
SCHEMBL28148470 0.85 ESR1 (0.62) CA1CA2ESR1ABL1ABCB1
SCHEMBL15445310 0.85 CA1 (0.70) CA1CA2ESR1MEN1KMT2A
SCHEMBL220910 0.84 CA1 (1.00) CA1CA2ESR1ESR2MEN1
SCHEMBL22804025 0.84 CA1 (1.00) CA1CA2ESR1ESR2MEN1
Phenol SCHEMBL7039341 0.83 CA1 (0.67) CA1CA2ESR2MEN1KMT2A
SCHEMBL3807600 0.82 CYP2C9 (0.78) CA1CA2ESR1ABL1ABCB1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 15 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20230331925-A1 THERMOPLASTIC RESIN, COMPOSITION, MOLDED ARTICLE, OPTICAL LENS, AND METHOD FOR PRODUCING THERMOPLASTIC RESIN MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2023-10-19 US disclosed
EP-4219589-A1 THERMOPLASTIC RESIN, COMPOSITION, MOLDED ARTICLE, OPTICAL LENS, AND METHOD FOR PRODUCING THERMOPLASTIC RESIN MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2023-08-02 EP disclosed
US-9633848-B2 Photosensitive resin composition, method for producing patterned cured film, semiconductor element and electronic device HITACHI CHEMICAL COMPANY, LTD. (JP) 2017-04-25 US disclosed
US-20150325431-A1 PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING PATTERNED CURED FILM, SEMICONDUCTOR ELEMENT AND ELECTRONIC DEVICE RESONAC CORPORATION (JP) 2015-11-12 US disclosed
EP-2916169-A1 PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING PATTERNED CURED FILM, SEMICONDUCTOR ELEMENT AND ELECTRONIC DEVICE Hitachi Chemical Company, Ltd. (JP) 2015-09-09 EP disclosed
US-9023974-B2 Ester group-containing tetracarboxylic acid dianhydride, novel polyesterimide precursor derived therefrom, and polyesterimide HONSHU CHEMICAL INDUSTRY CO., LTD. (JP) 2015-05-05 US disclosed
EP-2383265-B1 METHOD FOR MANUFACTURING TRIMELLITIC ANHYDRIDE ARYL ESTER HONSHU CHEMICAL IND (JP) 2015-03-11 EP disclosed
US-8563751-B2 Method for manufacturing trimellitic anhydride aryl ester HONSHU CHEMICAL INDUSTRY CO., LTD. (JP) 2013-10-22 US disclosed
US-20120029215-A1 METHOD FOR MANUFACTURING TRIMELLITIC ANHYDRIDE ARYL ESTER HONSHU CHEMICAL INDUSTRY CO., LTD. (JP) 2012-02-02 US disclosed
EP-2383265-A1 METHOD FOR MANUFACTURING TRIMELLITIC ANHYDRIDE ARYL ESTER Honshu Chemical Industry Co., Ltd. (JP) 2011-11-02 EP disclosed
US-20090306329-A1 NOVEL ESTER GROUP-CONTAINING TETRACARBOXYLIC ACID DIANHYDRIDE, NOVEL POLYESTERIMIDE PRECURSOR DERIVED THEREFROM, AND POLYESTERIMIDE HONSHU CHEMICAL INDUSTRY CO., LTD. (JP) 2009-12-10 US disclosed
EP-1375461-B1 DIPHENOL AND PROCESS FOR PRODUCING THE SAME HONSHU CHEMICAL IND (JP) 2009-08-05 EP disclosed
US-6872858-B2 Diphenol and process for producing the same HONSHU CHEMICAL INDUSTRY CO., LTD. (JP) 2005-03-29 US disclosed
US-20040049086-A1 Diphenol and process for producing the same HONSHU CHEMICAL INDUSTRY CO., LTD. (JP) 2004-03-11 US disclosed
EP-1375461-A1 DIPHENOL AND PROCESS FOR PRODUCING THE SAME Honshu Chemical Industry Co. Ltd. (JP) 2004-01-02 EP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (3 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20090306329-A1 NOVEL ESTER GROUP-CONTAINING TETRACARBOXYLIC ACID DIANHYDRIDE, NOVEL POLYESTERIMIDE PRECURSOR DERIVED THEREFROM, AND POLYESTERIMIDE NOTUM, WEE2, THEM6 CA1 407/4885CA2 645/4885ESR1 3617/4885
US-20120029215-A1 METHOD FOR MANUFACTURING TRIMELLITIC ANHYDRIDE ARYL ESTER TRIM4, CA6, TRIM58 CA1 81/4885CA2 109/4885ESR1 3967/4885
US-20040049086-A1 Diphenol and process for producing the same CYP1A1, AHR, CYP2E1 CA1 1487/4885CA2 865/4885ESR1 489/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.