SCHEMBL17060490

SCHEMBL17060490

Cc1cc(-c2ccc(-c3cc(C)c(O)c(C)c3)cc2)cc(C)c1O

nearest known ligand 0.82

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CA1 P00915 1/20 0.82
CA2 P00918 1/20 0.82
CYP1A2 P05177 1/20 0.52
CYP2C9 P11712 1/20 0.52
CYP2C19 P33261 1/20 0.52
ALDH1A1 P00352 3/20 0.48
ESR1 P03372 3/20 0.48
HSD17B1 P14061 1/20 0.45
HSD17B2 P37059 1/20 0.45
CYP17A1 P05093 1/20 0.44
ABL1 P00519 1/20 0.43
ABCB1 P08183 1/20 0.43
BCR P11274 1/20 0.43
FYN P06241 2/20 0.43
ALOX5 P09917 2/20 0.43
PTGS1 P23219 2/20 0.43
PTGS2 P35354 2/20 0.43
MEN1 O00255 1/20 0.43
GAA P10253 1/20 0.43
G6PD P11413 1/20 0.43

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL278774 0.92 CA1 (0.70) CA1CA2CYP1A2CYP2C9CYP2C19
SCHEMBL503537 0.92 CA1 (0.70) CA1CA2CYP1A2CYP2C9CYP2C19
SCHEMBL17220670 0.92 CA1 (0.70) CA1CA2CYP1A2CYP2C9CYP2C19
SCHEMBL15445310 0.92 CA1 (0.70) CA1CA2CYP1A2CYP2C9CYP2C19
SCHEMBL22804025 0.91 CA1 (1.00) CA1CA2CYP1A2CYP2C9CYP2C19
SCHEMBL220910 0.91 CA1 (1.00) CA1CA2CYP1A2CYP2C9CYP2C19
SCHEMBL8552828 0.88 CA1 (0.64) CA1CA2CYP1A2CYP2C9CYP2C19
SCHEMBL20101127 0.88 CA1 (0.64) CA1CA2CYP1A2CYP2C9CYP2C19
SCHEMBL9579782 0.88 CA1 (0.64) CA1CA2CYP1A2CYP2C9CYP2C19
SCHEMBL18804065 0.88 CA1 (0.64) CA1CA2CYP1A2CYP2C9CYP2C19

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12054611-B2 Poly(phenylene ether), curable composition containing poly(phenylene ether), dry film, prepreg, cured object, laminate, and electronic component TAIYO HOLDINGS CO., LTD. (JP) 2024-08-06 US disclosed
CN-112384552-B Polyphenylene ether, curable composition containing polyphenylene ether, dry film, prepreg, cured product, laminate, and electronic component 太阳控股株式会社 2024-01-30 CN disclosed
US-20230331925-A1 THERMOPLASTIC RESIN, COMPOSITION, MOLDED ARTICLE, OPTICAL LENS, AND METHOD FOR PRODUCING THERMOPLASTIC RESIN MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2023-10-19 US disclosed
EP-4219589-A1 THERMOPLASTIC RESIN, COMPOSITION, MOLDED ARTICLE, OPTICAL LENS, AND METHOD FOR PRODUCING THERMOPLASTIC RESIN MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2023-08-02 EP disclosed
US-20210301129-A1 POLY(PHENYLENE ETHER), CURABLE COMPOSITION CONTAINING POLY(PHENYLENE ETHER), DRY FILM, PREPREG, CURED OBJECT, LAMINATE, AND ELECTRONIC COMPONENT TAIYO HOLDINGS CO., LTD. (JP) 2021-09-30 US disclosed
US-9633848-B2 Photosensitive resin composition, method for producing patterned cured film, semiconductor element and electronic device HITACHI CHEMICAL COMPANY, LTD. (JP) 2017-04-25 US disclosed
US-20150325431-A1 PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING PATTERNED CURED FILM, SEMICONDUCTOR ELEMENT AND ELECTRONIC DEVICE RESONAC CORPORATION (JP) 2015-11-12 US disclosed
EP-2916169-A1 PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING PATTERNED CURED FILM, SEMICONDUCTOR ELEMENT AND ELECTRONIC DEVICE Hitachi Chemical Company, Ltd. (JP) 2015-09-09 EP disclosed