SCHEMBL1733328

SCHEMBL1733328

C=CC(=O)OC12CC3CC(C1)CC(C(=O)OC(C)(C)C)(C3)C2

nearest known ligand 0.42

Predicted protein targets (top 14)

geneUniProtsupporting neighboursconfidence
CYP17A1 P05093 3/20 0.35
CYP19A1 P11511 3/20 0.35
MEN1 O00255 1/20 0.35
MAPK1 P28482 1/20 0.35
KMT2A Q03164 1/20 0.35
NPSR1 Q6W5P4 1/20 0.35
HSD11B1 P28845 1/20 0.31
GLA P06280 1/20 0.31
DPP8 Q6V1X1 1/20 0.30
DPP9 Q86TI2 1/20 0.30
EPHX2 P34913 1/20 0.30
SCN1A P35498 1/20 0.30
SCN2A Q99250 1/20 0.30
SCN3A Q9NY46 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1733414 0.88 CYP17A1 (0.31) CYP17A1CYP19A1MEN1MAPK1KMT2A
SCHEMBL6560154 0.85 GLA (0.39) MEN1KMT2ANPSR1GLASCN1A
SCHEMBL14593987 0.85 NPSR1 (0.35) MEN1KMT2ANPSR1GLASCN1A
SCHEMBL2208058 0.84 MEN1 (0.36) MEN1MAPK1KMT2ADPP8DPP9
SCHEMBL5195169 0.84 CYP17A1 (0.39) CYP17A1CYP19A1MEN1MAPK1KMT2A
SCHEMBL1733193 0.84 DGAT1 (0.31)
SCHEMBL133289 0.83 CYP17A1 (0.38) CYP17A1CYP19A1MEN1MAPK1KMT2A
SCHEMBL1733543 0.83
SCHEMBL14593991 0.82 SCN1A (0.35) CYP17A1CYP19A1MEN1KMT2ANPSR1
SCHEMBL6561662 0.82 GLA (0.34) MEN1KMT2ANPSR1HSD11B1GLA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 12 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1443363-B1 Photoresist composition DAICEL CHEM (JP) 2013-07-10 EP disclosed
EP-0999474-B1 Photoresist resin composition and method for forming a pattern DAICEL CHEM (JP) 2011-11-23 EP disclosed
US-6806335-B2 FOR USE IN FINE PATTERNING OF SEMICONDUCTORS DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 2004-10-19 US disclosed
EP-1443363-A2 Compounds for photoresist and resin composition for photoresist Daicel Chemical Industries, Ltd. (JP) 2004-08-04 EP disclosed
US-6692889-B1 COPOLYMERS CONTAINING DERIVATIZED ADAMANTANYL ACRYLATE FUNCTIONALITY; ETCHING RESISTANCE DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 2004-02-17 US disclosed
US-20040006189-A1 Polymeric compound and resin composition for photoresist DAICEL CHEMICAL INDUSTRIES, LTD. 2004-01-08 US disclosed
US-6552143-B2 Addition polymer including units of 1-oxo-perhydro-5,6-didehydro-4,7-methanoisobenzofuran; making a semiconductor using the photoresist; high adhesion, fine patterns DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 2003-04-22 US disclosed
US-20020169266-A1 Polymeric compound and resin composition for photoresist DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 2002-11-14 US disclosed
US-6391520-B1 ADAMANTANE COMPOUND OR POLYMER AND PHOTOACID GENERATORS; ETCHING RESISTANCE; SOLUBILIZABLE BY IRRADIATION WITH LIGHT; MINUTE PATTERNS DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 2002-05-21 US disclosed
EP-1172694-A1 POLYMERIC COMPOUND FOR PHOTORESIST AND RESIN COMPOSITION FOR PHOTORESIST Daicel Chemical Industries, Ltd. (JP) 2002-01-16 EP disclosed
EP-1172384-A1 POLYMER FOR PHOTORESISTS AND RESIN COMPOSITIONS FOR PHOTORESISTS Daicel Chemical Industries, Ltd. (JP) 2002-01-16 EP disclosed
EP-0999474-A1 COMPOUNDS FOR PHOTORESIST AND RESIN COMPOSITION FOR PHOTORESIST Daicel Chemical Industries, Ltd. (JP) 2000-05-10 EP disclosed