SCHEMBL17345238

SCHEMBL17345238

CCOCC(COc1ccc(C(c2ccccc2)(c2ccccc2)c2ccc(OCC3CO3)c(CC(COCC)OC(=O)NCCC[Si](OCC)(OCC)OCC)c2)cc1CC1CO1)OC(=O)NCCC[Si](OCC)(OCC)OCC

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL17051363 0.94
SCHEMBL17345229 0.89 VDR (0.31)
SCHEMBL17366113 0.89
SCHEMBL17051360 0.83
SCHEMBL17345227 0.79
SCHEMBL17345248 0.76 HPGD (0.46)
SCHEMBL17345239 0.76 MEN1 (0.37)
SCHEMBL17345241 0.73 NPC1 (0.33)
SCHEMBL17051356 0.73
SCHEMBL17345246 0.72 ALDH1A1 (0.31)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-9732182-B2 Epoxy compound having alkoxysilyl group, method of preparing the same, composition and cured product comprising the same, and use thereof KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGY (KR) 2017-08-15 US disclosed
US-20150361211-A1 EPOXY COMPOUND HAVING ALKOXYSILYL GROUP, METHOD OF PREPARING THE SAME, COMPOSITION AND CURED PRODUCT COMPRISING THE SAME, AND USE THEREOF KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGY (KR) 2015-12-17 US disclosed