SCHEMBL1742973

SCHEMBL1742973

CNC(C)CNC(C)CO

nearest known ligand 0.35

Predicted protein targets (top 4)

geneUniProtsupporting neighboursconfidence
KMT2A Q03164 1/20 0.35
TSHR P16473 1/20 0.33
TDP1 Q9NUW8 1/20 0.32
KDM4E B2RXH2 2/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL799216 0.80
SCHEMBL422022 0.80
SCHEMBL420981 0.80
SCHEMBL7775069 0.78
SCHEMBL13661123 0.78
SCHEMBL13661583 0.78
Hydrochloric Acid SCHEMBL5307165 0.77
Ammonia Solution, Strong SCHEMBL15813800 0.77
SCHEMBL1741259 0.77 SIGMAR1 (0.34) KMT2ATSHRTDP1KDM4E
SCHEMBL1741298 0.77 LMNA (0.54) TDP1KDM4E

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 9 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2389612-A1 A PHOTORESIST IMAGE-FORMING PROCESS USING DOUBLE PATTERNING AZ Electronic Materials USA Corp. (US) 2011-11-30 EP claimed
WO-2010084372-A1 A PHOTORESIST IMAGE-FORMING PROCESS USING DOUBLE PATTERNING AZ ELECTRONIC MATERIALS USA CORP. (US) 2010-07-29 WO claimed
US-20100183851-A1 Photoresist Image-forming Process Using Double Patterning CAO YI 2010-07-22 US claimed
EP-2146250-B1 WATER-SOLUBLE RESIN COMPOSITION FOR THE FORMATION OF MICROPATTERNS AND PROCESS FOR THE FORMATION OF MICROPATTERNS WITH THE SAME MERCK PATENT GMBH (DE) 2017-08-23 EP disclosed
EP-2389612-A1 A PHOTORESIST IMAGE-FORMING PROCESS USING DOUBLE PATTERNING AZ Electronic Materials USA Corp. (US) 2011-11-30 EP disclosed
WO-2010084372-A1 A PHOTORESIST IMAGE-FORMING PROCESS USING DOUBLE PATTERNING AZ ELECTRONIC MATERIALS USA CORP. (US) 2010-07-29 WO disclosed
US-20100183851-A1 Photoresist Image-forming Process Using Double Patterning CAO YI 2010-07-22 US disclosed
US-20100119717-A1 WATER-SOLUBLE RESIN COMPOSITION FOR THE FORMATION OF MICROPATTERNS AND METHOD FOR THE FORMATION OF MICROPATTERNS WITH THE SAME HONG SUNG-EUN 2010-05-13 US disclosed
EP-2146250-A1 WATER-SOLUBLE RESIN COMPOSITION FOR THE FORMATION OF MICROPATTERNS AND PROCESS FOR THE FORMATION OF MICROPATTERNS WITH THE SAME AZ Electronic Materials (Japan) K.K. (JP) 2010-01-20 EP disclosed