SCHEMBL1755839

SCHEMBL1755839

Cc1cc(C(C)(C)c2ccc(OCC3CO3)c(C)c2)ccc1OCC1CO1

nearest known ligand 0.64

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 6/20 0.64
TSHR P16473 5/20 0.64
TP53 P04637 3/20 0.64
MAPT P10636 2/20 0.64
HPGD P15428 2/20 0.64
MEN1 O00255 2/20 0.64
KMT2A Q03164 2/20 0.64
HIF1A Q16665 2/20 0.64
CYP1A2 P05177 1/20 0.64
PPARG P37231 1/20 0.64
GLA P06280 1/20 0.58
VDR P11473 2/20 0.51
SMN1; SMN2 Q16637 2/20 0.45
CYP3A4 P08684 1/20 0.45
TDP1 Q9NUW8 1/20 0.42
KDM4E B2RXH2 4/20 0.42
RECQL P46063 1/20 0.40
ESR1 P03372 1/20 0.38
LMNA P02545 1/20 0.37
GAA P10253 1/20 0.37

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL10021043 0.98 ALDH1A1 (0.67) ALDH1A1TSHRTP53MAPTHPGD
SCHEMBL13385085 0.93 ALDH1A1 (0.78) ALDH1A1TSHRTP53MAPTHPGD
SCHEMBL3139952 0.90 ALDH1A1 (0.58) ALDH1A1TSHRTP53MAPTHPGD
SCHEMBL15835685 0.90 ALDH1A1 (0.54) ALDH1A1TSHRTP53MAPTHPGD
SCHEMBL20057511 0.88 TP53 (0.51) ALDH1A1TSHRTP53MAPTHPGD
SCHEMBL467256 0.88 ALDH1A1 (0.60) ALDH1A1TSHRTP53MAPTHPGD
SCHEMBL31290868 0.88 ALDH1A1 (0.60) ALDH1A1TSHRTP53MAPTHPGD
SCHEMBL15835640 0.86 TSHR (0.63) ALDH1A1TSHRTP53MAPTHPGD
SCHEMBL10407011 0.86 ALDH1A1 (0.59) ALDH1A1TSHRTP53MAPTHPGD
SCHEMBL12558176 0.86 TSHR (0.59) ALDH1A1TSHRTP53MAPTHPGD

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 71 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-4110846-B1 AMINE EPOXY RESIN ADDUCT SIKA TECH AG (CH) 2024-01-24 EP disclosed
WO-2023182408-A1 COMPOSITION FOR FORMING RESIST-LOWER-LAYER FILM INCLUDING FLUORENE SKELETON 日産化学株式会社 2023-09-28 WO disclosed
WO-2023149327-A1 PROTECTIVE FILM FORMING COMPOSITION 日産化学株式会社 2023-08-10 WO disclosed
US-20230088913-A1 AMINE-EPOXY RESIN ADDITION PRODUCT SIKA TECHNOLOGY AG (CH) 2023-03-23 US disclosed
US-20230068858-A1 AMINE EPOXY RESIN ADDUCT SIKA TECHNOLOGY AG (CN) 2023-03-02 US disclosed
CN-111801355-B Polymer material and method for producing same 国立大学法人大阪大学 2023-02-28 CN disclosed
US-20220404706-A1 CHEMICAL-RESISTANT POLYVALENT CARBOXYLIC ACID-CONTAINING PROTECTIVE FILM NISSAN CHEMICAL CORPORATION (JP) 2022-12-22 US disclosed
US-20220153920-A1 METHOD FOR PRODUCING POLYMER NISSAN CHEMICAL CORPORATION (JP) 2022-05-19 US disclosed
US-20220145119-A1 CHEMICAL SOLUTION-RESISTANT PROTECTIVE FILM FORMING COMPOSITION CONTAINING POLYMERIZATION PRODUCT HAVING DIOL STRUCTURE AT TERMINAL THEREOF NISSAN CHEMICAL CORPORATION (JP) 2022-05-12 US disclosed
US-20210403635-A1 CHEMICAL-RESISTANT PROTECTIVE FILM-FORMING COMPOSITION CONTAINING POLYMERIZATION PRODUCT OF ARYLENE COMPOUND HAVING GLYCIDYL GROUP NISSAN CHEMICAL CORPORATION (JP) 2021-12-30 US disclosed
EP-2492332-A1 Adhesive composition and adhesive dry film Shin-Etsu Chemical Co., Ltd. (JP) 2012-08-29 EP disclosed
US-20120213993-A1 ADHESIVE COMPOSITION AND ADHESIVE DRY FILM SHIN-ETSU CHEMICAL CO., LTD. (JP) 2012-08-23 US disclosed
US-20120094222-A1 PHOTOCURABLE RESIN COMPOSITION, DRY FILM THEREOF, PATTERN FORMING METHOD, AND ELECTRICAL/ELECTRONIC PART PROTECTIVE FILM SHIN-ETSU CHEMICAL CO., LTD. (JP) 2012-04-19 US disclosed
US-20120094222-A1 PHOTOCURABLE RESIN COMPOSITION, DRY FILM THEREOF, PATTERN FORMING METHOD, AND ELECTRICAL/ELECTRONIC PART PROTECTIVE FILM SHIN-ETSU CHEMICAL CO., LTD. (JP) 2012-04-19 US disclosed
EP-2442182-A1 Photocurable resin composition, dry film thereof, pattern forming method, and electrical/electronic part protective film Shin-Etsu Chemical Co., Ltd. (JP) 2012-04-18 EP disclosed
EP-2305754-B1 Epoxy-containing polymer photo-curable resin composition, patterning process and electric/electronic part protective film SHINETSU CHEMICAL CO (JP) 2012-01-25 EP disclosed
US-20090220849-A1 FUEL CELL SEPARATOR SEALING MATERIAL AND FUEL CELL SEPARATOR HONDA MOTOR CO., LTD. (JP) 2009-09-03 US disclosed
EP-0253084-A2 1,3-Disubstituted imidazolium salts F. HOFFMANN-LA ROCHE AG (CH) 1988-01-20 EP disclosed
US-4626379-A REACTION PRODUCT OF BLEND OF POLYOXYALKYLENE OXIDE COPOLYMER AND VINYL MONOMER PETROLITE CORPORATION (US) 1986-12-02 US disclosed
US-4502977-A REACTION PRODUCT OF BLEND OF OXYALKYLATED MATERIALS WITH VINYL MONOMER PETROLITE CORPORATION (US) 1985-03-05 US disclosed