SCHEMBL467256

SCHEMBL467256

CC(C)(c1ccc(OCC2CO2)c(Br)c1)c1ccc(OCC2CO2)c(Br)c1

nearest known ligand 0.60

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 8/20 0.60
TSHR P16473 6/20 0.60
MAPT P10636 4/20 0.60
KMT2A Q03164 4/20 0.60
TP53 P04637 3/20 0.60
MEN1 O00255 3/20 0.60
HPGD P15428 2/20 0.60
HIF1A Q16665 2/20 0.60
CYP1A2 P05177 1/20 0.60
PPARG P37231 1/20 0.60
GLA P06280 1/20 0.47
SMN1; SMN2 Q16637 3/20 0.42
CYP3A4 P08684 1/20 0.42
VDR P11473 1/20 0.41
NPSR1 Q6W5P4 2/20 0.40
NPC1 O15118 1/20 0.40
HTT P42858 1/20 0.40
RAB9A P51151 1/20 0.40
L3MBTL1 Q9Y468 1/20 0.40
TDP1 Q9NUW8 1/20 0.40

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL31290868 1.00 ALDH1A1 (0.60) ALDH1A1TSHRMAPTKMT2ATP53
SCHEMBL1755839 0.88 ALDH1A1 (0.64) ALDH1A1TSHRMAPTKMT2ATP53
SCHEMBL10021043 0.86 ALDH1A1 (0.67) ALDH1A1TSHRMAPTKMT2ATP53
SCHEMBL12558176 0.84 TSHR (0.59) ALDH1A1TSHRMAPTKMT2ATP53
SCHEMBL15835640 0.84 TSHR (0.63) ALDH1A1TSHRMAPTKMT2ATP53
SCHEMBL10407011 0.84 ALDH1A1 (0.59) ALDH1A1TSHRMAPTKMT2ATP53
SCHEMBL18328216 0.83 TP53 (0.58) ALDH1A1TSHRMAPTKMT2ATP53
SCHEMBL12592893 0.82 ALDH1A1 (0.57) ALDH1A1TSHRMAPTKMT2ATP53
SCHEMBL15835628 0.82 ALDH1A1 (0.61) ALDH1A1TSHRMAPTKMT2ATP53
SCHEMBL16744115 0.82 TSHR (0.57) ALDH1A1TSHRMAPTKMT2ATP53

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 160 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-0455755-B1 EPOXY MATRIX TOUGHENED WITH POLYIMIDE THERMOPLASTIC RESIN FIBERITE INC (US) 1997-04-02 EP claimed
US-20250367911-A1 GROUT FREE FIBER ENHANCED COMPOSITE LINER STEEL TUBE FOR CCUS AND WATER INJECTION CNPC USA CORP (US) 2025-12-04 US disclosed
US-12202932-B2 Formulation and processing of degradable high Tg epoxy composite that can be degradable at extremely low temperature CNPC USA CORPORATION (US) 2025-01-21 US disclosed
US-12049557-B2 Bi-continuos epoxy microstructure for fabrication of degradable thermoset composite used in HTHP downhole conditions CNPC USA Corp. (US) 2024-07-30 US disclosed
US-20230323015-A1 Formulation and Processing of Degradable High Tg Epoxy Composite that can be degradable at Extremely Low Temperature CNPC USA CORPORATION 2023-10-12 US disclosed
WO-2023196026-A1 FORMULATION AND PROCESSING OF DEGRADABLE HIGH Tg EPOXY COMPOSITE THAT CAN BE DEGRADABLE AT EXTREMELY LOW TEMPERATURE CNPC USA CORPORATION (US) 2023-10-12 WO disclosed
WO-2023047439-A1 ROTARY MACHINE COIL, METHOD FOR MANUFACTURING SAME, AND ROTARY MACHINE 三菱電機株式会社 2023-03-30 WO disclosed
US-20230022703-A1 NOVEL BI-CONTINUOS EPOXY MICROSTRUCTURE FOR FABRICATION OF DEGRADABLE THERMOSET COMPOSITE USED IN HTHP DOWNHOLE CONDITIONS CNPC USA Corp. 2023-01-26 US disclosed
US-11142671-B2 Adhesive composition comprising metal nanoparticles XEROX CORPORATION (US) 2021-10-12 US disclosed
US-11095179-B2 Thermosetting resin composition, stator coil obtained using same, and rotating electric machine MITSUBISHI ELECTRIC CORPORATION (JP) 2021-08-17 US disclosed
EP-0193082-B1 THERMOSETTING EPOXY RESIN COMPOSITIONS AND THERMOSETS THEREFROM HERCULES INCORPORATED (US) 1990-03-21 EP disclosed
US-4863787-A CROSSLINKED EPOXY RESIN MATRIX HERCULES INCORPORATED (US) 1989-09-05 US disclosed
US-4822832-A REACTING POLYEPOXIDES, AROMATIC OLIGOMERS, AMINE HARDENER; PREPREGS, TOUGHNESS, MULTIPHASE MORPHOLOGY HERCULES INCORPORATED (US) 1989-04-18 US disclosed
US-4783506-A EPOXY RESIN MATRIX HERCULES INCORPORATED (US) 1988-11-08 US disclosed
EP-0259100-A2 Multiphase epoxy thermosets having rubber within disperse phase HERCULES INCORPORATED (US) 1988-03-09 EP disclosed
EP-0252725-A2 Damage tolerant composites containing infusible particles HERCULES INCORPORATED (US) 1988-01-13 EP disclosed
US-4680076-A Multiphase epoxy thermosets having rubber within disperse phase HERCULES INCORPORATED (US) 1987-07-14 US disclosed
US-4656208-A POLYEPOXIDE, AMINE HARDENER, REACTIVE AROMATIC OLIGOMER HERCULES INCORPORATED (US) 1987-04-07 US disclosed
US-4656207-A Epoxy thermosets having improved toughness HERCULES INCORPORATED (US) 1987-04-07 US disclosed
EP-0193082-A1 Thermosetting epoxy resin compositions and thermosets therefrom HERCULES INCORPORATED (US) 1986-09-03 EP disclosed