SCHEMBL177202

SCHEMBL177202

C=CCN(CC=C)C(=S)NO

nearest known ligand 0.50

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CYP1A2 P05177 2/20 0.50
ALDH1A1 P00352 10/20 0.45
SMN1; SMN2 Q16637 5/20 0.45
LMNA P02545 4/20 0.40
HPGD P15428 1/20 0.40
ALOX12 P18054 1/20 0.40
CCR6 P51684 1/20 0.40
KDM4E B2RXH2 4/20 0.40
L3MBTL1 Q9Y468 2/20 0.40
TDP1 Q9NUW8 2/20 0.40
GAA P10253 2/20 0.40
KCNH2 Q12809 1/20 0.40
MEN1 O00255 2/20 0.39
MAPT P10636 2/20 0.39
KMT2A Q03164 2/20 0.39
NSD2 O96028 1/20 0.39
BLM P54132 1/20 0.39
ATM Q13315 1/20 0.39
HTT P42858 1/20 0.38
CYP3A4 P08684 1/20 0.37

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL10635366 0.87 CYP1A2 (0.41) CYP1A2ALDH1A1SMN1; SMN2LMNAHPGD
SCHEMBL11589871 0.78 CYP1A2 (0.48) CYP1A2ALDH1A1SMN1; SMN2LMNAHPGD
SCHEMBL6517665 0.78 CYP1A2 (0.53) CYP1A2ALDH1A1SMN1; SMN2LMNAHPGD
SCHEMBL10701424 0.78 CYP1A2 (0.48) CYP1A2ALDH1A1SMN1; SMN2LMNAHPGD
SCHEMBL28491839 0.78 CYP1A2 (0.48) CYP1A2ALDH1A1SMN1; SMN2LMNAHPGD
SCHEMBL11527916 0.76 CYP1A2 (0.47) CYP1A2ALDH1A1SMN1; SMN2LMNAHPGD
SCHEMBL4618339 0.73 ALDH1A1 (0.44) CYP1A2ALDH1A1SMN1; SMN2LMNAHPGD
SCHEMBL406319 0.70 CYP1A2 (0.45) CYP1A2ALDH1A1SMN1; SMN2LMNAHPGD
SCHEMBL11526002 0.70 CYP1A2 (0.42) CYP1A2ALDH1A1SMN1; SMN2LMNAHPGD
SCHEMBL9293887 0.70 ALDH1A1 (0.48) CYP1A2ALDH1A1SMN1; SMN2LMNAHPGD

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1946362-B1 TIN-SILVER SOLDER BUMPING IN ELECTRONICS MANUFACTURE ENTHONE (US) 2012-01-11 EP disclosed
US-7713859-B2 Tin-silver solder bumping in electronics manufacture ENTHONE INC. (US) 2010-05-11 US disclosed
EP-1946362-A2 TIN-SILVER SOLDER BUMPING IN ELECTRONICS MANUFACTURE ENTHONE, INCORPORATED (US) 2008-07-23 EP disclosed
WO-2007022075-A2 TIN-SILVER SOLDER BUMPING IN ELECTRONICS MANUFACTURE ENTHONE INC. (US) 2007-02-22 WO disclosed
US-20070037377-A1 TIN-SILVER SOLDER BUMPING IN ELECTRONICS MANUFACTURE ENTHONE INC. (US) 2007-02-15 US disclosed