SCHEMBL1774909

SCHEMBL1774909

CS(=O)(=O)O.[SnH4]

nearest known ligand 0.00

Known targets — ChEMBL curated mechanism

ABL1ADRA1AADRA1BADRA1DADRA2AADRA2BADRA2CADRB2AGTR1BCL2BCL2A1BCL2L1BCL2L10BCL2L2BCRBRAFCHRM1CHRNA10CHRNA9DRD1DRD2DRD3DRD4DRD5EGFRF2FLT1FLT4GCKGHSRGNRHRGRIN1GRIN2AGRIN2BGRIN2CGRIN2DGRIN3AGRIN3BHTR1AHTR1BHTR1DHTR2AHTR2CHTR3AIDH2KDRKITMAOBMCL1MTTPPP4HBPDGFRBPIK3CAPIK3CBPIK3CDPIK3CGPIK3R1PIK3R2PIK3R3PIK3R5PIKFYVEROCK1ROCK2SLC18A2SLC6A2SLC6A3SLC6A4TACR1TUBA1ATUBA1BTUBA1CTUBA3CTUBA3ETUBA4ATUBBTUBB1TUBB2ATUBB2BTUBB3TUBB4ATUBB4BTUBB6TUBB8gyrAgyrBparCparEpol

The experimentally established mechanism targets of None. The predicted profile below is derived independently by chemical similarity — agreement is a validation signal, a miss is honest.

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL128169 0.94 — —
SCHEMBL246838 0.94 CA2 (0.58) —
SCHEMBL8596055 0.94 CA2 (0.58) —
SCHEMBL25599 0.94 CA2 (0.58) —
SCHEMBL15109974 0.94 — —
SCHEMBL105 0.94 — —
SCHEMBL3365970 0.89 — —
SCHEMBL20570028 0.89 — —
SCHEMBL9555295 0.89 — —
SCHEMBL21641627 0.89 CA2 (0.54) —

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7943032-B2 Anode used for electroplating METAKEM GESELLSCHAFT FUR SCHICHTCHEMIE DER METALLE MBH (DE) 2011-05-17 — — US disclosed
US-20060124454-A1 Anode used for electroplating METAKEM GESELLSCHAFT FUR SCHICHTCHEMIE DER METALLE MBH (DE) 2006-06-15 — — US disclosed
US-20030024822-A1 PROCESS FOR THE DEPOSITION OF A SILVER-TIN ALLOY ENTHONE INC. 2003-02-06 — — US disclosed
EP-1194614-A1 PROCESS FOR THE DEPOSITION OF A SILVER-TIN ALLOY ENTHONE INC. (US) 2002-04-10 — — EP disclosed
WO-2001073167-A1 PROCESS FOR THE DEPOSITION OF A SILVER-TIN ALLOY ENTHONE INC. (US) 2001-10-04 — — WO disclosed
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