SCHEMBL17753418

SCHEMBL17753418

Cc1cc(-c2c(C)c(O)c(C)c(C)c2O)ccc1O

nearest known ligand 0.47

Predicted protein targets (top 16)

geneUniProtsupporting neighboursconfidence
▸ HSD17B1 P14061 6/20 0.47
▸ HSD17B2 P37059 6/20 0.47
▸ ESR2 Q92731 5/20 0.46
▸ TP53 P04637 1/20 0.45
▸ TDP1 Q9NUW8 1/20 0.45
▸ SENP1 Q9P0U3 1/20 0.42
▸ PDE10A Q9Y233 1/20 0.42
▸ CYP3A4 P08684 1/20 0.41
▸ CYP2D6 P10635 1/20 0.41
▸ CYP2C19 P33261 1/20 0.41
▸ ESR1 P03372 5/20 0.41
▸ AR P10275 3/20 0.40
▸ FGFR1 P11362 1/20 0.40
▸ CA1 P00915 1/20 0.39
▸ CA2 P00918 1/20 0.39
▸ TLR8 Q9NR97 1/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL7105404 0.90 HSD17B1 (0.48) HSD17B1HSD17B2ESR2TP53TDP1
SCHEMBL6699314 0.83 HSD17B1 (0.53) HSD17B1HSD17B2ESR2TP53TDP1
SCHEMBL6701966 0.79 HSD17B1 (0.50) HSD17B1HSD17B2ESR2TP53TDP1
SCHEMBL17753399 0.79 CA1 (0.59) ESR2SENP1CYP3A4CYP2D6CYP2C19
SCHEMBL272034 0.78 HSD17B1 (0.68) HSD17B1HSD17B2ESR2TP53TDP1
SCHEMBL29696046 0.78 HSD17B1 (0.68) HSD17B1HSD17B2ESR2TP53TDP1
SCHEMBL29429121 0.78 HSD17B1 (0.68) HSD17B1HSD17B2ESR2TP53TDP1
SCHEMBL26979937 0.78 HSD17B1 (0.68) HSD17B1HSD17B2ESR2TP53TDP1
SCHEMBL9721292 0.77 HSD17B1 (0.41) HSD17B1HSD17B2ESR2TP53TDP1
SCHEMBL17753421 0.77 BACE1 (0.48) HSD17B1HSD17B2ESR2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-10011676-B2 Compound containing phenolic hydroxyl group, phenolic resin, curable composition, cured product thereof, semiconductor sealing material, and printed circuit board DIC CORPORATION (JP) 2018-07-03 — — US disclosed
US-10011676-B2 Compound containing phenolic hydroxyl group, phenolic resin, curable composition, cured product thereof, semiconductor sealing material, and printed circuit board DIC CORPORATION (JP) 2018-07-03 — — US disclosed
US-20160137770-A1 COMPOUND CONTAINING PHENOLIC HYDROXYL GROUP, PHENOLIC RESIN, CURABLE COMPOSITION, CURED PRODUCT THEREOF, SEMICONDUCTOR SEALING MATERIAL, AND PRINTED CIRCUIT BOARD DIC CORPORATION (JP) 2016-05-19 — — US disclosed
US-20160137770-A1 COMPOUND CONTAINING PHENOLIC HYDROXYL GROUP, PHENOLIC RESIN, CURABLE COMPOSITION, CURED PRODUCT THEREOF, SEMICONDUCTOR SEALING MATERIAL, AND PRINTED CIRCUIT BOARD DIC CORPORATION (JP) 2016-05-19 — — US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (2 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20160137770-A1 COMPOUND CONTAINING PHENOLIC HYDROXYL GROUP, PHENOLIC RESIN, CURABLE COMPOSITION, CURED PRODUCT THEREOF, SEMICONDUCTOR SEALING MATERIAL, AND PRINTED CIRCUIT BOARD ASH2L, SEM1, KDM1A HSD17B1 1039/4885HSD17B2 1880/4885ESR2 990/4885
US-10011676-B2 Compound containing phenolic hydroxyl group, phenolic resin, curable composition, cured product thereof, semiconductor sealing material, and printed circuit board ASH2L, SEM1, KDM1A HSD17B1 1039/4885HSD17B2 1880/4885ESR2 990/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.

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