⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL8719764 | 0.75 | — | — | |
| SCHEMBL1224341 | 0.74 | TSHR (0.38) | — | |
| SCHEMBL707169 | 0.74 | ALDH1A1 (0.37) | — | |
| SCHEMBL17763359 | 0.72 | MAPT (0.32) | — | |
| SCHEMBL3679065 | 0.71 | TSHR (0.37) | — | |
| SCHEMBL9246247 | 0.69 | ALDH1A1 (0.33) | — | |
| SCHEMBL31187729 | 0.69 | TSHR (0.36) | — | |
| SCHEMBL16309500 | 0.69 | HCAR2 (0.39) | — | |
| SCHEMBL3298602 | 0.69 | CA4 (0.33) | — | |
| SCHEMBL5470478 | 0.67 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 19 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-109415494-B | Two-pack type epoxy resin composition | 思美定株式会社 | 2021-11-09 | — | — | CN | disclosed |
| CN-107148453-B | Photocurable composition | 思美定株式会社 | 2021-08-17 | — | — | CN | disclosed |
| CN-107428891-B | Curable composition | 施敏打硬株式会社 | 2021-04-20 | — | — | CN | disclosed |
| US-10920068-B2 | Two-pack type epoxy resin composition | CEMEDINE CO., LTD. (JP) | 2021-02-16 | — | — | US | disclosed |
| CN-108431157-B | Bonding method using photocurable adhesive | 思美定株式会社 | 2021-02-05 | — | — | CN | disclosed |
| EP-3480238-B1 | TWO-PACK TYPE EPOXY RESIN COMPOSITION | CEMEDINE CO LTD (JP) | 2020-12-02 | — | — | EP | disclosed |
| US-10844251-B2 | Pressure-sensitive adhesive | CEMEDINE CO., LTD. (JP) | 2020-11-24 | — | — | US | disclosed |
| CN-105392845-B | Photocurable composition | 思美定株式会社 | 2020-10-20 | — | — | CN | disclosed |
| CN-107532061-B | Pressure-sensitive adhesive | 思美定株式会社 | 2020-03-03 | — | — | CN | disclosed |
| US-20190225795-A1 | TWO-PACK TYPE EPOXY RESIN COMPOSITION | CEMEDINE CO., LTD. (JP) | 2019-07-25 | — | — | US | disclosed |
| EP-3480238-A1 | TWO-PACK TYPE EPOXY RESIN COMPOSITION | Cemedine Co., Ltd. (JP) | 2019-05-08 | — | — | EP | disclosed |
| EP-3081612-B1 | PHOTOCURABLE COMPOSITION HAVING ADHESIVE PROPERTIES | CEMEDINE CO LTD (JP) | 2018-11-14 | — | — | EP | disclosed |
| US-20180298239-A1 | PRESSURE-SENSITIVE ADHESIVE | CEMEDINE CO., LTD. (JP) | 2018-10-18 | — | — | US | disclosed |
| EP-3287501-A1 | PRESSURE-SENSITIVE ADHESIVE | Cemedine Co., Ltd. (JP) | 2018-02-28 | — | — | EP | disclosed |
| US-9718999-B2 | Photocurable composition having adhesive properties | CEMEDINE CO., LTD (JP) | 2017-08-01 | — | — | US | disclosed |
| US-20160312089-A1 | PHOTOCURABLE COMPOSITION HAVING ADHESIVE PROPERTIES | CEMEDINE CO., LTD. (JP) | 2016-10-27 | — | — | US | disclosed |
| EP-3081612-A1 | PHOTOCURABLE COMPOSITION HAVING ADHESIVE PROPERTIES | Cemedine Co., Ltd. (JP) | 2016-10-19 | — | — | EP | disclosed |
| US-20160152783-A1 | PHOTOCURABLE COMPOSITION | CEMEDINE CO., LTD. (JP) | 2016-06-02 | — | — | US | disclosed |
| EP-3023462-A1 | PHOTOCURABLE COMPOSITION | Cemedine Co., Ltd. (JP) | 2016-05-25 | — | — | EP | disclosed |