SCHEMBL17866245

SCHEMBL17866245

CC(C)(C)c1cc(O)cc(CCC(=O)OC2CC(C)(C)N(CCOC(=O)CCc3cc(C(C)(C)C)c(O)c(C(C)(C)C)c3)C(C)(C)C2)c1

nearest known ligand 0.41

Predicted protein targets (top 15)

geneUniProtsupporting neighboursconfidence
KMT2A Q03164 2/20 0.38
MEN1 O00255 1/20 0.38
GAA P10253 6/20 0.36
HTT P42858 2/20 0.35
PKM P14618 1/20 0.35
MAOB P27338 3/20 0.33
MAOA P21397 2/20 0.33
ALDH1A1 P00352 2/20 0.33
LMNA P02545 1/20 0.33
AGTR1 P30556 1/20 0.33
SMN1; SMN2 Q16637 1/20 0.33
ACHE P22303 1/20 0.32
ALOX5 P09917 1/20 0.31
KDM4E B2RXH2 1/20 0.31
MAPT P10636 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL206978 0.93 KMT2A (0.43) KMT2AMEN1GAAHTTPKM
SCHEMBL5008540 0.90 KMT2A (0.37) KMT2AMEN1GAAHTTPKM
SCHEMBL4302639 0.90 KMT2A (0.37) KMT2AMEN1GAAHTTPKM
SCHEMBL2958675 0.87 ALOX5 (0.44) KMT2AMEN1GAAHTTPKM
SCHEMBL2998267 0.86 APP (0.40) KMT2AMEN1GAAHTTPKM
SCHEMBL27938272 0.86 GAA (0.35) KMT2AMEN1GAAHTTPKM
SCHEMBL5415495 0.84 GAA (0.37) KMT2AMEN1GAAHTTPKM
SCHEMBL11449728 0.84 KMT2A (0.45) KMT2AMEN1GAAHTTPKM
SCHEMBL9192202 0.83 KMT2A (0.38) KMT2AMEN1GAAHTTPKM
SCHEMBL2775346 0.83 KMT2A (0.38) KMT2AMEN1GAAHTTPKM

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 15 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3260500-B1 POLYAMIDE RESIN COMPOSITION, METHOD FOR PRODUCING POLYAMIDE RESIN COMPOSITION, AND MOLDED ARTICLE ASAHI CHEMICAL IND (JP) 2023-11-08 EP disclosed
CN-114466895-A Fiber-reinforced resin molding material, fiber-reinforced resin molded article, and method for producing fiber-reinforced resin molded article 东丽株式会社 2022-05-10 CN disclosed
CN-105820560-B Molded article comprising polyamide resin composition 旭化成株式会社 2021-12-03 CN disclosed
US-11017918-B2 Semi-conductive composition for power cable DYM SOLUTION CO., LTD. (KR) 2021-05-25 US disclosed
US-10927232-B2 Polyamide resin composition, method for producing polyamide resin composition, and molded article ASAHI KASEI KABUSHIKI KAISHA (JP) 2021-02-23 US disclosed
CN-107250274-B Polyamide resin composition, method for producing polyamide resin composition, and molded article 旭化成株式会社 2021-02-02 CN disclosed
US-20190180889-A1 SEMI-CONDUCTIVE COMPOSITION FOR POWER CABLE DYM SOLUTION CO., LTD. (KR) 2019-06-13 US disclosed
EP-3037478-B1 POLYAMIDE RESIN COMPOSITION AND MOLDED PRODUCT ASAHI CHEMICAL IND (JP) 2018-12-26 EP disclosed
US-10113054-B2 Molded article comprising polyamide resin composition ASAHI KASEI KABUSHIKI KAISHA (JP) 2018-10-30 US disclosed
US-9902843-B2 Polyamide resin composition and molded product ASAHI KASEI CHEMICALS CORPORATION (JP) 2018-02-27 US disclosed
US-20180030236-A1 POLYAMIDE RESIN COMPOSITION, METHOD FOR PRODUCING POLYAMIDE RESIN COMPOSITION, AND MOLDED ARTICLE ASAHI KASEI KABUSHIKI KAISHA (JP) 2018-02-01 US disclosed
EP-3260500-A1 POLYAMIDE RESIN COMPOSITION, METHOD FOR PRODUCING POLYAMIDE RESIN COMPOSITION, AND MOLDED ARTICLE Asahi Kasei Kabushiki Kaisha (JP) 2017-12-27 EP disclosed
US-20160222196-A1 POLYAMIDE RESIN COMPOSITION AND MOLDED PRODUCT ASAHI KASEI CHEMICALS CORPORATION (JP) 2016-08-04 US disclosed
US-20160215109-A1 MOLDED ARTICLE COMPRISING POLYAMIDE RESIN COMPOSITION ASAHI KASEI CHEMICALS CORPORATION (JP) 2016-07-28 US disclosed
EP-3037478-A1 POLYAMIDE RESIN COMPOSITION AND MOLDED PRODUCT Asahi Kasei Chemicals Corporation (JP) 2016-06-29 EP disclosed