SCHEMBL1792180

SCHEMBL1792180

CCCC=C1CC1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29187652 1.00 TSHR (0.33)
SCHEMBL102512 0.88
SCHEMBL16908443 0.87 TSHR (0.43)
SCHEMBL7666992 0.87 TRPA1 (0.34)
SCHEMBL104446 0.86 DPP7 (0.39)
SCHEMBL11303483 0.86 DPP7 (0.39)
SCHEMBL11299622 0.86 DPP7 (0.39)
SCHEMBL40358 0.82
SCHEMBL1630716 0.82 HTR2C (0.31)
SCHEMBL13901139 0.82 CHRM2 (0.33)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 594 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-114940871-B Three-layer packaging material and photovoltaic module 福斯特(嘉兴)新材料有限公司 2024-05-14 CN claimed
CN-117897449-A Resin composition and biodegradable resin molded article comprising the same 株式会社LG化学 2024-04-16 CN claimed
EP-4269469-A1 PROCESS FOR PREPARING POLYAMIDE BY COPOLYMERIZATION OF MULTIPLE COMPONENTS, POLYAMIDE PREPARED THEREBY, AND COMPOSITION COMPRISING SAME Hanwha Solutions Corporation (KR) 2023-11-01 EP claimed
CN-116640536-A Packaging adhesive film composition for heterojunction battery, preparation method of packaging adhesive film composition and photovoltaic module 杭州福斯特应用材料股份有限公司 2023-08-25 CN claimed
CN-116635479-A Method for producing polyamides by copolymerization of several components, polyamides produced therefrom and compositions containing the polyamides 韩华思路信(株) 2023-08-22 CN claimed
CN-116426220-A Photovoltaic packaging adhesive film and preparation method thereof 隆基绿能科技股份有限公司 2023-07-14 CN claimed
WO-2023068447-A1 RESIN COMPOSITION AND BIODEGRADABLE RESIN MOLDED PRODUCT COMPRISING SAME 주식회사 엘지화학 2023-04-27 WO claimed
CN-115806719-A Soft polyolefin resin composition for power cable having excellent insulation properties and molded article made of the same 韩华道达尔能源有限公司 2023-03-17 CN claimed
EP-4148087-A1 SOFT POLYOLEFIN RESIN COMPOSITION FOR POWER CABLES WITH EXCELLENT INSULATION CHARACTERISTICS AND ARTICLE MOLDED THEREFROM Hanwha TotalEnergies Petrochemical Co., Ltd. (KR) 2023-03-15 EP claimed
US-11566128-B2 Soft polyolefin resin composition with improved direct-current insulation characteristics and article molded therefrom HANWHA TOTAL PETROCHEMICAL CO., LTD. 2023-01-31 US claimed
EP-0917552-A1 METHOD OF PROCESSING POLYETHYLENE AND POLYETHYLENE/ELASTOMER BLENDS EXXON CHEMICAL PATENTS INC. (US) 1999-05-26 EP claimed
EP-0917551-A1 METHOD OF PROCESSING POLYETHYLENE EXXON CHEMICAL PATENTS INC. (US) 1999-05-26 EP claimed
EP-0904198-A1 MULTILAYER POLYAMIDE FILM STRUCTURES AlliedSignal Inc. (US) 1999-03-31 EP claimed
WO-1998027149-A1 METHOD OF MELT PROCESSING AMINE CONTAINING POLYETHYLENES EXXON CHEMICAL PATENTS INC. (US) 1998-06-25 WO claimed
WO-1998005710-A1 METHOD OF PROCESSING POLYETHYLENE EXXON CHEMICAL PATENTS INC. (US) 1998-02-12 WO claimed
WO-1998005711-A1 METHOD OF PROCESSING POLYETHYLENE AND POLYETHYLENE/ELASTOMER BLENDS EXXON CHEMICAL PATENTS INC. (US) 1998-02-12 WO claimed
WO-1997047468-A1 MULTILAYER POLYAMIDE FILM STRUCTURES ALLIEDSIGNAL INC. (US) 1997-12-18 WO claimed
EP-0731821-A1 FILMS PRODUCED BY BUBBLE FORMATION OF COMPOSITIONS OF POLYAMIDE AND FUNCTIONALIZED POLYOLEFIN AlliedSignal Inc. (US) 1996-09-18 EP claimed
EP-0579434-B1 Dialkyl peroxide, cross-linking composition containing the same, method for cross-linking, and electric power cable NOF CORP (JP) 1995-10-18 EP claimed
WO-1995015354-A1 FILMS PRODUCED BY BUBBLE FORMATION OF COMPOSITIONS OF POLYAMIDE AND FUNCTIONALIZED POLYOLEFIN ALLIEDSIGNAL INC. (US) 1995-06-08 WO claimed