SCHEMBL180339

SCHEMBL180339

Cc1ccc(-c2cc(C)ccc2OC(=O)Oc2ccc(C)cc2-c2ccc(C)cc2)cc1

nearest known ligand 0.51

Predicted protein targets (top 16)

geneUniProtsupporting neighboursconfidence
PTGDR2 Q9Y5Y4 1/20 0.51
BACE1 P56817 1/20 0.41
SYK P43405 2/20 0.40
HDAC7 Q8WUI4 1/20 0.39
GRM2 Q14416 1/20 0.39
LMNA P02545 1/20 0.38
MAOB P27338 2/20 0.38
CYP46A1 Q9Y6A2 1/20 0.37
ADORA3 P0DMS8 2/20 0.37
ALDH1A1 P00352 2/20 0.36
ACHE P22303 1/20 0.36
HPGD P15428 1/20 0.36
MAPT P10636 1/20 0.36
TSHR P16473 1/20 0.36
MAPK1 P28482 1/20 0.36
HSD17B10 Q99714 1/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL122491 0.89 PTGDR2 (0.65) PTGDR2BACE1HDAC7LMNAALDH1A1
SCHEMBL27556162 0.87 PTGDR2 (0.54) PTGDR2BACE1SYKHDAC7GRM2
SCHEMBL122492 0.79 PTGDR2 (0.65) PTGDR2BACE1HDAC7LMNAMAPK1
SCHEMBL4974893 0.77 PTGDR2 (0.63) PTGDR2BACE1HDAC7LMNAMAOB
SCHEMBL37754 0.76 L3MBTL1 (0.53) LMNAALDH1A1ACHEHPGDMAPT
SCHEMBL14446041 0.76 ACHE (0.58) PTGDR2BACE1SYKLMNAMAOB
SCHEMBL4284793 0.76 PTGDR2 (0.61) PTGDR2BACE1HDAC7LMNAMAPK1
SCHEMBL11157416 0.76 BACE1 (0.59) BACE1LMNAMAOBADORA3ACHE
SCHEMBL17720784 0.76 PTGDR2 (0.50) PTGDR2HDAC7LMNAMAOBALDH1A1
SCHEMBL11332753 0.76 ACHE (0.48) PTGDR2BACE1LMNAALDH1A1ACHE

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 55 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-115667338-B Photocurable resin composition, cured film, and molded article with cured film CHUGOKU MARINE PAINTS, LTD. (JP) 2026-05-26 CN disclosed
EP-4632023-A1 COATING MATERIAL, COATING LAYER, AND SPRING NHK Spring Co., Ltd. (JP) 2025-10-15 EP disclosed
EP-4632027-A1 COATING MATERIAL, COATING LAYER, AND SPRING NHK Spring Co., Ltd. (JP) 2025-10-15 EP disclosed
EP-4632024-A1 COATING MATERIAL AND METHOD FOR FORMING COATING LAYER NHK Spring Co., Ltd. (JP) 2025-10-15 EP disclosed
US-20240271000-A1 COATING AGENT AND SPRING NHK SPRING CO., LTD. (JP) 2024-08-15 US disclosed
WO-2024122654-A1 COATING MATERIAL AND METHOD FOR FORMING COATING LAYER 日本発條株式会社 2024-06-13 WO disclosed
WO-2024122655-A1 COATING MATERIAL, COATING LAYER, AND SPRING 日本発條株式会社 2024-06-13 WO disclosed
WO-2024122653-A1 COATING MATERIAL, COATING LAYER, AND SPRING 日本発條株式会社 2024-06-13 WO disclosed
EP-4353789-A1 COATING AGENT AND SPRING NHK Spring Co., Ltd. (JP) 2024-04-17 EP disclosed
CN-117480225-A Coating agent and spring 日本发条株式会社 2024-01-30 CN disclosed
US-20100016520-A1 RADIATION-CURABLE COMPOSITION FOR OPTICAL RECORDING MEDIUM, AND OPTICAL RECORDING MEDIUM MITSUBISHI CHEMICAL CORPORATION (JP) 2010-01-21 US disclosed
EP-2096637-A1 RADIATION CURING COMPOSITION FOR OPTICAL RECORDING MEDIUM, AND OPTICAL RECORDING MEDIUM Mitsubishi Chemical Corporation (JP) 2009-09-02 EP disclosed
US-20090166984-A1 Rod Sealing System UNIMATEC CO., LTD. (JP) 2009-07-02 US disclosed
US-7531580-B2 Process for production of uv-curable liquid polyurethane resin UNIMATEC CO., LTD. (JP) 2009-05-12 US disclosed
US-20090010603-A1 Resin Composition for Optical Packaging Material and Process for Preparing the Same, and Optical Packaging Material, Optical Packaging Component, and Optical Module NIPPON SHOKUBAI CO., LTD. (JP) 2009-01-08 US disclosed
EP-1959171-A1 ROD SEALING SYSTEM NOK Corporation (JP) 2008-08-20 EP disclosed
US-20060194938-A1 Process for production of uv-curable liquid polyurethane resin UNIMATEE CO., LTD. (JP) 2006-08-31 US disclosed
WO-2006038735-A1 RESIN COMPOSITION FOR OPTICAL PACKAGING MATERIAL AND PROCESS FOR PREPARING THE SAME, AND OPTICAL PACKAGING MATERIAL, OPTICAL PACKAGING COMPONENT, AND OPTICAL MODULE NIPPON SHOKUBAI CO., LTD. (JP) 2006-04-13 WO disclosed
US-20050206093-A1 Method of manufacturing gasket for hard disk device and gasket BRIDGESTONE CORPORATION (JP) 2005-09-22 US disclosed
EP-1488908-A1 METHOD OF MANUFACTURING GASKET FOR HARD DISK DEVICE AND GASKET Bridgestone Corporation (JP) 2004-12-22 EP disclosed