SCHEMBL18059798

SCHEMBL18059798

CC(C)(C)c1ccc(-c2[c]ccc(-c3cc[c]cc3)c2-c2ccc(C(C)(C)C)cc2C(C)(C)C)c(C(C)(C)C)c1

nearest known ligand 0.30

Predicted protein targets (top 5)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 1/20 0.30
HPGD P15428 1/20 0.30
ALOX15 P16050 1/20 0.30
HSD17B10 Q99714 1/20 0.30
TDP1 Q9NUW8 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1898775 0.89 ALDH1A1 (0.36) ALDH1A1HPGDALOX15HSD17B10TDP1
SCHEMBL105740 0.89 ALDH1A1 (0.35) ALDH1A1HPGDALOX15HSD17B10TDP1
SCHEMBL1242637 0.83 ALDH1A1 (0.35) ALDH1A1HPGDALOX15HSD17B10TDP1
SCHEMBL28861362 0.82 ALDH1A1 (0.38) ALDH1A1HPGDALOX15HSD17B10TDP1
SCHEMBL105741 0.81 NPC1 (0.31) ALDH1A1
SCHEMBL23673812 0.79 KIF11 (0.38) ALDH1A1HPGDALOX15HSD17B10TDP1
SCHEMBL1901592 0.79 KIF11 (0.38) ALDH1A1HPGDALOX15HSD17B10TDP1
SCHEMBL1902139 0.78 ALDH1A1 (0.36) ALDH1A1HPGDALOX15HSD17B10TDP1
SCHEMBL1537930 0.78 ALDH1A1 (0.36) ALDH1A1HPGDALOX15HSD17B10TDP1
SCHEMBL1898678 0.72 ALDH1A1 (0.41) ALDH1A1HPGDALOX15HSD17B10TDP1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 23 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3070137-B1 SILICONE ADHESIVE COMPOSITION AND SOLID-STATE IMAGING DEVICE SHINETSU CHEMICAL CO (JP) 2023-12-27 EP disclosed
EP-3173453-B1 WAFER LAMINATE AND MAKING METHOD SHINETSU CHEMICAL CO (JP) 2020-09-30 EP disclosed
US-10453732-B2 Wafer laminate and making method SHIN-ETSU CHEMICAL CO., LTD. (JP) 2019-10-22 US disclosed
EP-3382743-B1 LAMINATE AND MAKING METHOD SHINETSU CHEMICAL CO (JP) 2019-10-09 EP disclosed
EP-3382742-B1 SEMICONDUCTOR DEVICE, MAKING METHOD, AND LAMINATE SHINETSU CHEMICAL CO (JP) 2019-09-25 EP disclosed
US-10377923-B2 Surface protective film, making method, and substrate processing laminate SHIN-ETSU CHEMICAL CO., LTD. (JP) 2019-08-13 US disclosed
EP-3255662-B1 WAFER LAMINATE AND METHOD OF MAKING THE SAME SHINETSU CHEMICAL CO (JP) 2019-08-07 EP disclosed
US-10373903-B2 Laminate and making method SHIN-ETSU CHEMICAL CO., LTD. (JP) 2019-08-06 US disclosed
US-10297485-B2 Semiconductor device, making method, and laminate SHIN-ETSU CHEMICAL CO., LTD. (JP) 2019-05-21 US disclosed
EP-3382743-A1 LAMINATE AND MAKING METHOD Shin-Etsu Chemical Co., Ltd. (JP) 2018-10-03 EP disclosed
US-10074626-B2 Wafer laminate and making method SHIN-ETSU CHEMICAL CO., LTD. (JP) 2018-09-11 US disclosed
EP-3202827-B1 SURFACE PROTECTIVE FILM, MAKING METHOD, AND SUBSTRATE PROCESSING LAMINATE SHINETSU CHEMICAL CO (JP) 2018-08-29 EP disclosed
US-20170352637-A1 WAFER LAMINATE AND MAKING METHOD SHIN-ETSU CHEMICAL CO., LTD. (JP) 2017-12-07 US disclosed
US-9796892-B2 Silicone adhesive composition and solid-state imaging device SHIN-ETSU CHEMICAL CO., LTD. (JP) 2017-10-24 US disclosed
US-20170226386-A1 SURFACE PROTECTIVE FILM, MAKING METHOD, AND SUBSTRATE PROCESSING LAMINATE SHIN-ETSU CHEMICAL CO., LTD. (JP) 2017-08-10 US disclosed
EP-3202827-A1 SURFACE PROTECTIVE FILM, MAKING METHOD, AND SUBSTRATE PROCESSING LAMINATE Shin-Etsu Chemical Co., Ltd. (JP) 2017-08-09 EP disclosed
US-20170154802-A1 WAFER LAMINATE AND MAKING METHOD SHIN-ETSU CHEMICAL CO., LTD. (JP) 2017-06-01 US disclosed
EP-3173453-A1 WAFER LAMINATE AND MAKING METHOD Shin-Etsu Chemical Co., Ltd. (JP) 2017-05-31 EP disclosed
US-20160289519-A1 SILICONE ADHESIVE COMPOSITION AND SOLID-STATE IMAGING DEVICE SHIN-ETSU CHEMICAL CO., LTD. (JP) 2016-10-06 US disclosed
EP-3070137-A1 SILICONE ADHESIVE COMPOSITION AND SOLID-STATE IMAGING DEVICE Shin-Etsu Chemical Co., Ltd. (JP) 2016-09-21 EP disclosed