SCHEMBL1815350

SCHEMBL1815350

CC(C)=C(C)C(=O)OCC(C(C)O)(C(C)O)C(C)O

nearest known ligand 0.31

Predicted protein targets (top 1)

geneUniProtsupporting neighboursconfidence
TSHR P16473 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1200078 0.81 CHRM5 (0.31)
SCHEMBL9147596 0.76 TRPA1 (0.33)
SCHEMBL899312 0.74 CYP2C19 (0.32)
SCHEMBL19796057 0.72 HTT (0.46) TSHR
SCHEMBL51593 0.71 ALDH1A1 (0.41)
SCHEMBL8318867 0.71
SCHEMBL9700923 0.71 POLB (0.39) TSHR
SCHEMBL3420729 0.71 CHRM5 (0.31)
SCHEMBL20061887 0.70 TSHR (0.61) TSHR
SCHEMBL10357806 0.69 LMNA (0.34)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 23 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20230320972-A1 COMPOSITE PARTICLES, METHOD OF PRODUCING COMPOSITE PARTICLES AND DRY POWDER OF COMPOSITE PARTICLES, SKIN APPLICATION COMPOSITION AND METHOD OF PRODUCING THE SKIN APPLICATION COMPOSITION TOPPAN INC. (JP) 2023-10-12 US disclosed
US-11685799-B2 Composite particles, method of producing composite particles, dry powder, and molding resin composition TOPPAN PRINTING CO., LTD. (JP) 2023-06-27 US disclosed
WO-2023276585-A1 METHOD FOR PRODUCING COMPOSITE PARTICLE, AND COMPOSITE PARTICLE 凸版印刷株式会社 2023-01-05 WO disclosed
EP-3995514-A1 COMPOSITE PARTICLE AND METHOD FOR PRODUCING COMPOSITE PARTICLE TOPPAN INC. (JP) 2022-05-11 EP disclosed
EP-3929237-A1 COMPOSITE PARTICLES, COMPOSITE-PARTICLE COMPOSITION, AND METHOD FOR PRODUCING COMPOSITE-PARTICLE COMPOSITION TOPPAN INC. (JP) 2021-12-29 EP disclosed
US-20210363329-A1 COMPOSITE PARTICLES, COMPOSITE-PARTICLE COMPOSITION, AND METHOD FOR PRODUCING COMPOSITE-PARTICLE COMPOSITION TOPPAN INC. (JP) 2021-11-25 US disclosed
EP-3786232-A1 COMPOSITE PARTICLES, METHOD FOR PRODUCING COMPOSITE PARTICLES, DRY POWDER, COMPOSITION FOR APPLICATION TO SKIN, AND METHOD FOR PRODUCING COMPOSITION FOR APPLICATION TO SKIN Toppan Printing Co., Ltd. (JP) 2021-03-03 EP disclosed
US-20200397687-A1 COMPOSITE PARTICLES, METHOD OF PRODUCING COMPOSITE PARTICLES AND DRY POWDER OF COMPOSITE PARTICLES, SKIN APPLICATION COMPOSITION AND METHOD OF PRODUCING THE SKIN APPLICATION COMPOSITION TOPPAN PRINTING CO.,LTD. (JP) 2020-12-24 US disclosed
EP-3736297-A1 COMPOSITE PARTICLES, PRODUCTION METHOD FOR COMPOSITE PARTICLES, DRY POWDER, AND RESIN COMPOSITION FOR MOLDING Toppan Printing Co., Ltd. (JP) 2020-11-11 EP disclosed
US-20200332040-A1 COMPOSITE PARTICLES, METHOD OF PRODUCING COMPOSITE PARTICLES, DRY POWDER, AND MOLDING RESIN COMPOSITION TOPPAN PRINTING CO., LTD. (JP) 2020-10-22 US disclosed
US-8908293-B2 Dispersion composition, photosensitive resin composition, and solid-state image pick-up element FUJIFILM CORPORATION (JP) 2014-12-09 US disclosed
EP-2687201-A1 KIT OF MATERIAL FOR REPAIRING DENTIN Tokuyama Dental Corporation (JP) 2014-01-22 EP disclosed
US-20140017638-A1 KIT OF MATERIAL FOR REPAIRING DENTIN TOKUYAMA DENTAL CORPORATION (JP) 2014-01-16 US disclosed
WO-2012157784-A1 DISPERSION COMPOSITION, CURABLE COMPOSITION, TRANSPARENT FILM, MICROLENS AND SOLID-STATE IMAGE SENSING DEVICE USING THE SAME, METHOD FOR MANUFACTURING TRANSPARENT FILM, METHOD FOR MANUFACTURING MICROLENS AND METHOD FOR MANUFACTURING SOLID-STATE IMAGE SENSING DEVICE FUJIFILM CORPORATION (JP) 2012-11-22 WO disclosed
WO-2012153826-A1 DISPERSION COMPOSITION, CURABLE COMPOSITION, COMPOSITION, TRANSPARENT FILM, MICROLENS, SOLID-STATE IMAGE SENSING DEVICE, METHOD FOR MANUFACTURING TRANSPARENT FILM, METHOD FOR MANUFACTURING MICROLENS AND METHOD FOR MANUFACTURING SOLID-STATE IMAGE SENSING DEVICE FUJIFILM CORPORATION (JP) 2012-11-15 WO disclosed
US-20120257283-A1 DISPERSION COMPOSITION, PHOTOSENSITIVE RESIN COMPOSITION, AND SOLID-STATE IMAGE PICK-UP ELEMENT FUJIFILM CORPORATION (JP) 2012-10-11 US disclosed
US-8278386-B2 Dispersion composition, polymerizable composition, light-shielding color filter, solid-state image pick-up element, liquid crystal display device, wafer level lens, and image pick-up unit FUJIFILM CORPORATION (JP) 2012-10-02 US disclosed
EP-2502963-A1 DISPERSION COMPOSITION, PHOTOSENSITIVE RESIN COMPOSITION, AND SOLID-STATE IMAGE PICKUP ELEMENT FUJIFILM Corporation (JP) 2012-09-26 EP disclosed
EP-2354187-A1 DISPERSED COMPOSITION, POLYMERIZABLE COMPOSITION, LIGHT SHIELDING COLOR FILTER, SOLID-STATE IMAGING ELEMENT, LIQUID CRYSTAL DISPLAY DEVICE, WAFER-LEVEL LENS, AND IMAGING UNIT FUJIFILM Corporation (JP) 2011-08-10 EP disclosed
US-20110124824-A1 DISPERSION COMPOSITION, POLYMERIZABLE COMPOSITION, LIGHT-SHIELDING COLOR FILTER, SOLID-STATE IMAGE PICK-UP ELEMENT, LIQUID CRYSTAL DISPLAY DEVICE, WAFER LEVEL LENS, AND IMAGE PICK-UP UNIT FUJIFILM CORPORATION (JP) 2011-05-26 US disclosed