Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | LCK | P06239 | 3/20 | 0.54 |
| ▸ | PTGS1 | P23219 | 3/20 | 0.53 |
| ▸ | PTGS2 | P35354 | 2/20 | 0.53 |
| ▸ | ESR1 | P03372 | 3/20 | 0.52 |
| ▸ | ESR2 | Q92731 | 3/20 | 0.52 |
| ▸ | IAPP | P10997 | 4/20 | 0.50 |
| ▸ | AKR1B10 | O60218 | 1/20 | 0.50 |
| ▸ | AKR1B1 | P15121 | 1/20 | 0.50 |
| ▸ | AKR1C3 | P42330 | 1/20 | 0.50 |
| ▸ | BACE1 | P56817 | 1/20 | 0.48 |
| ▸ | PTPN2 | P17706 | 1/20 | 0.47 |
| ▸ | PTPN1 | P18031 | 1/20 | 0.47 |
| ▸ | PTPN6 | P29350 | 1/20 | 0.47 |
| ▸ | NQO2 | P16083 | 1/20 | 0.47 |
| ▸ | TTR | P02766 | 2/20 | 0.46 |
| ▸ | DPP4 | P27487 | 1/20 | 0.46 |
| ▸ | HSP90AA1 | P07900 | 1/20 | 0.46 |
| ▸ | HSP90AB1 | P08238 | 1/20 | 0.46 |
| ▸ | HSD17B1 | P14061 | 1/20 | 0.46 |
| ▸ | MMP2 | P08253 | 2/20 | 0.45 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL1824017 | 1.00 | LCK (0.54) | LCKPTGS1PTGS2ESR1ESR2 | |
| SCHEMBL1821929 | 0.92 | NQO2 (0.60) | LCKPTGS1PTGS2ESR1ESR2 | |
| SCHEMBL1821927 | 0.92 | NQO2 (0.60) | LCKPTGS1PTGS2ESR1ESR2 | |
| SCHEMBL28738043 | 0.90 | CNR2 (0.60) | LCKPTGS1PTGS2ESR1ESR2 | |
| SCHEMBL19337400 | 0.90 | CNR2 (0.60) | LCKPTGS1PTGS2ESR1ESR2 | |
| SCHEMBL5692872 | 0.86 | PTPN1 (0.53) | PTGS1PTGS2IAPPAKR1B10AKR1B1 | |
| SCHEMBL5692869 | 0.86 | PTPN1 (0.53) | PTGS1PTGS2IAPPAKR1B10AKR1B1 | |
| SCHEMBL28388536 | 0.85 | ALDH1A1 (0.44) | LCKPTGS1PTGS2ESR1ESR2 | |
| SCHEMBL10632283 | 0.85 | AKR1C3 (0.70) | PTGS1ESR1ESR2IAPPAKR1B10 | |
| SCHEMBL5607630 | 0.85 | PTGS2 (0.59) | PTGS1PTGS2ESR1ESR2IAPP |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 17 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20110163461-A1 | ELECTRONIC PACKAGING | EVONIK DEGUSSA GMBH (DE) | 2011-07-07 | — | — | US | claimed |
| US-20110163461-A1 | ELECTRONIC PACKAGING | EVONIK DEGUSSA GMBH (DE) | 2011-07-07 | — | — | US | disclosed |
| EP-2119737-B1 | Electronic packaging | EVONIK DEGUSSA GMBH (DE) | 2011-05-04 | — | — | EP | disclosed |
| EP-2119737-A1 | Electronic packaging | Evonik Degussa GmbH (DE) | 2009-11-18 | — | — | EP | disclosed |
| EP-0869140-B1 | Epoxy resin composition and resin-encapsulated semiconductor device | SUMITOMO CHEMICAL CO (JP) | 2003-08-13 | — | — | EP | disclosed |
| US-6255409-B1 | EPOXY RESIN COMPOSITION COMPRISING BIFUNCTIONAL CRYSTALLINE EPOXY COMPOUND, AMORPHOUS TRISPHENOLMETHANE TYPE EPOXY COMPOUND HAVING THREE OR MORE EPOXY GROUPS IN MOLECULE, AND EPOXY CURING AGENT HAVING PHENOLIC HYDROXYL GROUPS | SUMITOMO CHEMICAL CO., LTD. (JP) | 2001-07-03 | — | — | US | disclosed |
| US-6190786-B1 | BIS(GLYCIDYLOXY)STILBENE RESINS | SUMITOMO CHEMICAL COMPANY, LTD. (JP) | 2001-02-20 | — | — | US | disclosed |
| EP-0749968-B1 | Epoxy resin and process for producing the same | SUMITOMO CHEMICAL CO (JP) | 2000-10-11 | — | — | EP | disclosed |
| EP-0943639-A2 | Epoxy resin composition and resin-encapsulated semiconductor device | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 1999-09-22 | — | — | EP | disclosed |
| US-5939509-A | Epoxy resin, resin composition, and resin-encapsulated semiconductor device | SUMITOMO CHEMICAL COMPANY, LTD. (JP) | 1999-08-17 | — | — | US | disclosed |
| US-5939473-A | Epoxy resin, resin composition, and resin-encapsulated semiconductor device | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 1999-08-17 | — | — | US | disclosed |
| EP-0739877-B1 | Epoxy resin, resin composition, and resin-encapsulated semiconductor device | SUMITOMO CHEMICAL CO (JP) | 1999-08-04 | — | — | EP | disclosed |
| US-5854370-A | Epoxy resin stilbenes and process for producing the same by photoisomerization | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 1998-12-29 | — | — | US | disclosed |
| EP-0869140-A2 | Epoxy resin composition and resin-encapsulated semiconductor device | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 1998-10-07 | — | — | EP | disclosed |
| US-5705596-A | STILBENE COMPOUNDS FOR ADHESIVES, PAINTS, ELECTRONICS AND INSULATION OF LAMINATES | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 1998-01-06 | — | — | US | disclosed |
| EP-0749968-A1 | Epoxy resin and process for producing the same | SUMITOMO CHEMICAL COMPANY LIMITED (JP) | 1996-12-27 | — | — | EP | disclosed |
| EP-0739877-A2 | Epoxy resin, resin composition, and resin-encapsulated semiconductor device | SUMITOMO CHEMICAL COMPANY LIMITED (JP) | 1996-10-30 | — | — | EP | disclosed |