Predicted protein targets (top 16)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | CA1 | P00915 | 4/20 | 0.36 |
| ▸ | CA2 | P00918 | 4/20 | 0.36 |
| ▸ | CYP2A6 | P11509 | 2/20 | 0.35 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.34 |
| ▸ | HIF1A | Q16665 | 1/20 | 0.34 |
| ▸ | CYP1B1 | Q16678 | 1/20 | 0.34 |
| ▸ | HSD17B10 | Q99714 | 1/20 | 0.34 |
| ▸ | NQO1 | P15559 | 1/20 | 0.34 |
| ▸ | GPR84 | Q9NQS5 | 3/20 | 0.34 |
| ▸ | MAPT | P10636 | 1/20 | 0.32 |
| ▸ | CLK1 | P49759 | 1/20 | 0.32 |
| ▸ | DYRK1A | Q13627 | 1/20 | 0.32 |
| ▸ | KCNA3 | P22001 | 1/20 | 0.32 |
| ▸ | CYP1A2 | P05177 | 1/20 | 0.31 |
| ▸ | TRPM4 | Q8TD43 | 1/20 | 0.31 |
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.31 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL29364866 | 1.00 | CA1 (0.36) | CA1CA2CYP2A6ALDH1A1HIF1A | |
| SCHEMBL29398546 | 0.83 | — | — | |
| SCHEMBL184385 | 0.83 | — | — | |
| SCHEMBL185298 | 0.80 | GAA (0.36) | CYP2A6KCNA3CYP1A2 | |
| SCHEMBL29364780 | 0.80 | GAA (0.36) | CYP2A6KCNA3CYP1A2 | |
| SCHEMBL28065752 | 0.78 | CYP2A6 (0.39) | CA1CA2CYP2A6ALDH1A1HSD17B10 | |
| SCHEMBL15568336 | 0.77 | — | — | |
| SCHEMBL13684334 | 0.76 | KDM4E (0.33) | CYP2A6KDM4E | |
| SCHEMBL30725930 | 0.76 | HTR1B (0.46) | CA1CA2CYP2A6ALDH1A1HSD17B10 | |
| SCHEMBL822708 | 0.76 | HTR1B (0.46) | CA1CA2CYP2A6ALDH1A1HSD17B10 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 309 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-6790473-B2 | EPOXY RESIN | INTERNATIONAL BUSINESS MACHINES CORPORATION | 2004-09-14 | — | — | US | claimed |
| US-6770691-B2 | (A) BROMINE-FREE EPOXY RESIN AND CURING AGENT; (B) A FLAME RETARDANT ADDITIVE THAT IS THE CONDENSATION PRODUCT OF A BROMINATED PHENOL AND A CYANURIC HALIDE; (C) THERMOPLASTIC RESIN (POLYPHENYLENE ETHER), AND (D) A CYANATE ESTER | GENERAL ELECTRIC COMPANY | 2004-08-03 | — | — | US | claimed |
| US-20020107308-A1 | Curable epoxy resin compositions and the cured residues thereof | CITIBANK, N.A., AS COLLATERAL AGENT | 2002-08-08 | — | — | US | claimed |
| JP-11060946-A | — | — | None | — | — | JP | disclosed |
| US-12606723-B2 | Thermosetting resin composition, semiconductor device and electrical/electronic component | KYOCERA CORPORATION (JP) | 2026-04-21 | — | — | US | disclosed |
| US-12583966-B2 | Curable resin, cured product thereof, resin composition, and method for producing curable resin | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2026-03-24 | — | — | US | disclosed |
| US-12565608-B2 | Thermally conductive resin composition | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2026-03-03 | — | — | US | disclosed |
| US-12544830-B2 | Method for producing silver particles, thermosetting resin composition, semiconductor device, and electrical and/or electronic components | KYOCERA CORPORATION (JP) | 2026-02-10 | — | — | US | disclosed |
| US-12539539-B2 | Silver particles, method for producing silver particles, paste composition, semiconductor device, and electrical and/or electronic components | KYOCERA CORPORATION (JP) | 2026-02-03 | — | — | US | disclosed |
| EP-4635650-A1 | PASTE COMPOSITION, SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME, AND ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING SAME | KYOCERA Corporation (JP) | 2025-10-22 | — | — | EP | disclosed |
| EP-3733746-B1 | RESIN COMPOSITION, PREPREG, LAMINATE, METAL FOIL-CLAD LAMINATE, PRINTED WIRING BOARD, AND MULTILAYER PRINTED WIRING BOARD | MITSUBISHI GAS CHEMICAL CO (JP) | 2025-08-27 | — | — | EP | disclosed |
| WO-2008036454-A1 | POLY (ARYLENE ETHER) COPOLYMER | SABIC INNOVATIVE PLASTICS IP B.V. (NL) | 2008-03-27 | — | — | WO | disclosed |
| WO-2007044312-A1 | POLY(ARYLENE ETHER) COMPOSITION, METHOD, AND ARTICLE | GENERAL ELECTRIC COMPANY (US) | 2007-04-19 | — | — | WO | disclosed |
| WO-2007044294-A1 | POLYMER COMPOSITION, METHOD, AND ARTICLE | GENERAL ELECTRIC COMPANY (US) | 2007-04-19 | — | — | WO | disclosed |
| WO-2007044489-A1 | FLAME RETARDANT COMPOSITION AND METHOD | GENERAL ELECTRIC COMPANY (US) | 2007-04-19 | — | — | WO | disclosed |
| US-20070080330-A1 | Flame retardant composition and method | CITIBANK, N.A., AS COLLATERAL AGENT | 2007-04-12 | — | — | US | disclosed |
| US-20070082986-A1 | Polymer composition, method, and article | SABIC GLOBAL TECHNOLOGIES IP B.V. (NL) | 2007-04-12 | — | — | US | disclosed |
| US-20070082987-A1 | Poly(arylene ether) composition, method, and article | SABIC GLOBAL TECHNOLOGIES B.V. (NL) | 2007-04-12 | — | — | US | disclosed |
| US-20060177666-A1 | Curable resin compositions | NIPPON STEEL CHEMICAL CO., LTD. (JP) | 2006-08-10 | — | — | US | disclosed |
| JP-H1160946-A | THERMOSETTING RESIN COMPOSITION AND ITS CURED PRODUCT | JSR CORP | 1999-03-05 | — | — | JP | disclosed |
Patent text — is the patent's own abstract consistent with the prediction?
For each of this compound's patents that has machine-readable text (5 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.
| Patent | Title | Text reads most about | Predicted target · text-rank |
|---|---|---|---|
| US-12565608-B2 | Thermally conductive resin composition | ITGAM, RAE1, FCGR1A | CA1 1109/4885CA2 1047/4885CYP2A6 2819/4885 |
| US-12539539-B2 | Silver particles, method for producing silver particles, paste composition, semiconductor device, and electrical and/or electronic components | DNMT3A, RPA1, BET1 | CA1 1057/4885CA2 2583/4885CYP2A6 4482/4885 |
| US-12583966-B2 | Curable resin, cured product thereof, resin composition, and method for producing curable resin | ARL1, ASH2L, SEM1 | CA1 360/4885CA2 559/4885CYP2A6 2654/4885 |
| US-12606723-B2 | Thermosetting resin composition, semiconductor device and electrical/electronic component | RPS3A, SEM1, DAP3 | CA1 1681/4885CA2 3378/4885CYP2A6 3630/4885 |
| US-12544830-B2 | Method for producing silver particles, thermosetting resin composition, semiconductor device, and electrical and/or electronic components | RPL37A, RPL39, RPL36A | CA1 1707/4885CA2 3377/4885CYP2A6 4531/4885 |
“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.