Predicted protein targets (top 11)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | GAA | P10253 | 1/20 | 0.36 |
| ▸ | RCE1 | Q9Y256 | 1/20 | 0.36 |
| ▸ | CYP2D6 | P10635 | 1/20 | 0.35 |
| ▸ | KCNA3 | P22001 | 1/20 | 0.31 |
| ▸ | ACHE | P22303 | 1/20 | 0.31 |
| ▸ | CYP1A2 | P05177 | 1/20 | 0.31 |
| ▸ | CYP2A6 | P11509 | 1/20 | 0.31 |
| ▸ | HPGDS | O60760 | 1/20 | 0.30 |
| ▸ | SIRT2 | Q8IXJ6 | 1/20 | 0.30 |
| ▸ | SIRT1 | Q96EB6 | 1/20 | 0.30 |
| ▸ | SIRT3 | Q9NTG7 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL29364780 | 1.00 | GAA (0.36) | GAARCE1CYP2D6KCNA3ACHE | |
| SCHEMBL28065761 | 0.86 | HTR2A (0.33) | GAARCE1KCNA3ACHECYP1A2 | |
| SCHEMBL20555926 | 0.81 | NQO1 (0.39) | GAARCE1KCNA3ACHECYP1A2 | |
| SCHEMBL29398546 | 0.81 | — | — | |
| SCHEMBL184385 | 0.81 | — | — | |
| SCHEMBL11709888 | 0.81 | CYP1A2 (0.39) | CYP2D6CYP1A2 | |
| SCHEMBL11712472 | 0.81 | PLAU (0.49) | CYP1A2 | |
| SCHEMBL184763 | 0.80 | CA1 (0.36) | KCNA3CYP1A2CYP2A6 | |
| SCHEMBL29364866 | 0.80 | CA1 (0.36) | KCNA3CYP1A2CYP2A6 | |
| SCHEMBL822708 | 0.79 | HTR1B (0.46) | GAAKCNA3CYP1A2CYP2A6 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 290 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-6790473-B2 | EPOXY RESIN | INTERNATIONAL BUSINESS MACHINES CORPORATION | 2004-09-14 | — | — | US | claimed |
| US-6770691-B2 | (A) BROMINE-FREE EPOXY RESIN AND CURING AGENT; (B) A FLAME RETARDANT ADDITIVE THAT IS THE CONDENSATION PRODUCT OF A BROMINATED PHENOL AND A CYANURIC HALIDE; (C) THERMOPLASTIC RESIN (POLYPHENYLENE ETHER), AND (D) A CYANATE ESTER | GENERAL ELECTRIC COMPANY | 2004-08-03 | — | — | US | claimed |
| US-20020107308-A1 | Curable epoxy resin compositions and the cured residues thereof | CITIBANK, N.A., AS COLLATERAL AGENT | 2002-08-08 | — | — | US | claimed |
| JP-4202353-A | — | — | None | — | — | JP | disclosed |
| US-12606723-B2 | Thermosetting resin composition, semiconductor device and electrical/electronic component | KYOCERA CORPORATION (JP) | 2026-04-21 | — | — | US | disclosed |
| US-12583966-B2 | Curable resin, cured product thereof, resin composition, and method for producing curable resin | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2026-03-24 | — | — | US | disclosed |
| US-12565608-B2 | Thermally conductive resin composition | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2026-03-03 | — | — | US | disclosed |
| US-12544830-B2 | Method for producing silver particles, thermosetting resin composition, semiconductor device, and electrical and/or electronic components | KYOCERA CORPORATION (JP) | 2026-02-10 | — | — | US | disclosed |
| US-12539539-B2 | Silver particles, method for producing silver particles, paste composition, semiconductor device, and electrical and/or electronic components | KYOCERA CORPORATION (JP) | 2026-02-03 | — | — | US | disclosed |
| EP-4635650-A1 | PASTE COMPOSITION, SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME, AND ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING SAME | KYOCERA Corporation (JP) | 2025-10-22 | — | — | EP | disclosed |
| EP-3733746-B1 | RESIN COMPOSITION, PREPREG, LAMINATE, METAL FOIL-CLAD LAMINATE, PRINTED WIRING BOARD, AND MULTILAYER PRINTED WIRING BOARD | MITSUBISHI GAS CHEMICAL CO (JP) | 2025-08-27 | — | — | EP | disclosed |
| EP-1951814-A1 | POLY(ARYLENE ETHER) COMPOSITION, METHOD, AND ARTICLE | General Electric Company (US) | 2008-08-06 | — | — | EP | disclosed |
| EP-1940936-A1 | POLYMER COMPOSITION, METHOD, AND ARTICLE | General Electric Company (US) | 2008-07-09 | — | — | EP | disclosed |
| WO-2007044312-A1 | POLY(ARYLENE ETHER) COMPOSITION, METHOD, AND ARTICLE | GENERAL ELECTRIC COMPANY (US) | 2007-04-19 | — | — | WO | disclosed |
| WO-2007044294-A1 | POLYMER COMPOSITION, METHOD, AND ARTICLE | GENERAL ELECTRIC COMPANY (US) | 2007-04-19 | — | — | WO | disclosed |
| WO-2007044489-A1 | FLAME RETARDANT COMPOSITION AND METHOD | GENERAL ELECTRIC COMPANY (US) | 2007-04-19 | — | — | WO | disclosed |
| US-20070080330-A1 | Flame retardant composition and method | CITIBANK, N.A., AS COLLATERAL AGENT | 2007-04-12 | — | — | US | disclosed |
| US-20070082986-A1 | Polymer composition, method, and article | SABIC GLOBAL TECHNOLOGIES IP B.V. (NL) | 2007-04-12 | — | — | US | disclosed |
| US-20070082987-A1 | Poly(arylene ether) composition, method, and article | SABIC GLOBAL TECHNOLOGIES B.V. (NL) | 2007-04-12 | — | — | US | disclosed |
| JP-H04202353-A | RESIN COMPOSITION FOR VIBRATION DAMPING MATERIAL | NIPPON SYNTHETIC CHEM IND CO LTD:THE | 1992-07-23 | — | — | JP | disclosed |
Patent text — is the patent's own abstract consistent with the prediction?
For each of this compound's patents that has machine-readable text (5 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.
| Patent | Title | Text reads most about | Predicted target · text-rank |
|---|---|---|---|
| US-12565608-B2 | Thermally conductive resin composition | ITGAM, RAE1, FCGR1A | GAA 4416/4885RCE1 1917/4885CYP2D6 3947/4885 |
| US-12539539-B2 | Silver particles, method for producing silver particles, paste composition, semiconductor device, and electrical and/or electronic components | DNMT3A, RPA1, BET1 | GAA 2002/4885RCE1 4797/4885CYP2D6 2966/4885 |
| US-12583966-B2 | Curable resin, cured product thereof, resin composition, and method for producing curable resin | ARL1, ASH2L, SEM1 | GAA 2568/4885RCE1 1806/4885CYP2D6 4024/4885 |
| US-12606723-B2 | Thermosetting resin composition, semiconductor device and electrical/electronic component | RPS3A, SEM1, DAP3 | GAA 2583/4885RCE1 3977/4885CYP2D6 3878/4885 |
| US-12544830-B2 | Method for producing silver particles, thermosetting resin composition, semiconductor device, and electrical and/or electronic components | RPL37A, RPL39, RPL36A | GAA 1556/4885RCE1 4408/4885CYP2D6 4575/4885 |
“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.