SCHEMBL18535693

SCHEMBL18535693

CCOCOc1ccc(-c2ccc(OCC3CO3)cc2)cc1

nearest known ligand 0.55

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 4/20 0.55
TP53 P04637 3/20 0.55
TSHR P16473 3/20 0.55
MEN1 O00255 3/20 0.55
KMT2A Q03164 3/20 0.55
MAPT P10636 2/20 0.55
HPGD P15428 2/20 0.55
HIF1A Q16665 2/20 0.55
CYP1A2 P05177 1/20 0.55
PPARG P37231 1/20 0.55
TDP1 Q9NUW8 1/20 0.54
PKM P14618 2/20 0.51
LMNA P02545 1/20 0.51
GAA P10253 1/20 0.51
SMN1; SMN2 Q16637 2/20 0.49
CYP3A4 P08684 1/20 0.49
GLA P06280 1/20 0.42
FGFR1 P11362 1/20 0.36
SRC P12931 1/20 0.36
NQO1 P15559 1/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL25020811 1.00 ALDH1A1 (0.55) ALDH1A1TP53TSHRMEN1KMT2A
Ether SCHEMBL11032952 0.93 ALDH1A1 (0.58) ALDH1A1TP53TSHRMEN1KMT2A
SCHEMBL19380679 0.93 ALDH1A1 (0.50) ALDH1A1TP53TSHRMEN1KMT2A
SCHEMBL20727163 0.90 ALDH1A1 (0.55) ALDH1A1TP53TSHRMEN1KMT2A
SCHEMBL14063036 0.88 TDP1 (0.63) ALDH1A1TP53TSHRMEN1KMT2A
SCHEMBL20244536 0.88 PKM (0.49) ALDH1A1TP53TSHRMEN1KMT2A
SCHEMBL22604498 0.88 ALDH1A1 (0.53) ALDH1A1TP53TSHRMEN1KMT2A
SCHEMBL23196479 0.87 ALDH1A1 (0.56) ALDH1A1TP53TSHRMEN1KMT2A
SCHEMBL20727256 0.86 ALDH1A1 (0.51) ALDH1A1TP53TSHRMEN1KMT2A
SCHEMBL12677367 0.86 ALDH1A1 (0.51) ALDH1A1TP53TSHRMEN1KMT2A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3173453-B1 WAFER LAMINATE AND MAKING METHOD SHINETSU CHEMICAL CO (JP) 2020-09-30 EP disclosed
EP-3467069-B1 SEMICONDUCTOR DEVICE, METHOD FOR PRODUCING THE SAME, AND LAMINATE SHINETSU CHEMICAL CO (JP) 2020-04-29 EP disclosed
EP-3382742-B1 SEMICONDUCTOR DEVICE, MAKING METHOD, AND LAMINATE SHINETSU CHEMICAL CO (JP) 2019-09-25 EP disclosed
EP-3309824-B1 WAFER LAMINATE AND METHOD OF PRODUCING THE SAME SHINETSU CHEMICAL CO (JP) 2019-06-05 EP disclosed
EP-2657963-B1 Wafer-trilayer adhesive layer-support composite, wafer support with trilayer adhesive layer for use in wafer processing, trilayer adhesive layer for use in wafer processing, method of manufacturing said composite and method of manufacturing a thin wafer using said composite SHINETSU CHEMICAL CO (JP) 2017-09-06 EP disclosed
EP-3173453-A1 WAFER LAMINATE AND MAKING METHOD Shin-Etsu Chemical Co., Ltd. (JP) 2017-05-31 EP disclosed
EP-3159924-A1 WAFER PROCESSING LAMINATE, TEMPORARY ADHESIVE MATERIAL FOR WAFER PROCESSING, AND METHOD FOR MANUFACTURING THIN WAFER Shin-Etsu Chemical Co., Ltd. (JP) 2017-04-26 EP disclosed
EP-3133641-A1 WAFER PROCESSING BONDING ARRANGEMENT, WAFER LAMINATE, AND THIN WAFER MANUFACTURING METHOD Shin-Etsu Chemical Co., Ltd. (JP) 2017-02-22 EP disclosed