Predicted protein targets (top 10)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | MGLL | Q99685 | 2/20 | 0.44 |
| ▸ | ALDH1A1 | P00352 | 6/20 | 0.43 |
| ▸ | MAPT | P10636 | 5/20 | 0.43 |
| ▸ | KMT2A | Q03164 | 2/20 | 0.43 |
| ▸ | GAA | P10253 | 1/20 | 0.43 |
| ▸ | MEN1 | O00255 | 1/20 | 0.43 |
| ▸ | HTT | P42858 | 1/20 | 0.39 |
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.38 |
| ▸ | LMNA | P02545 | 1/20 | 0.38 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.38 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL15875894 | 0.81 | MGLL (0.64) | MGLLALDH1A1KMT2AMEN1HTT | |
| SCHEMBL485546 | 0.81 | MGLL (0.64) | MGLLALDH1A1KMT2AMEN1HTT | |
| SCHEMBL94891 | 0.81 | MGLL (0.64) | MGLLALDH1A1KMT2AMEN1HTT | |
| SCHEMBL18859867 | 0.79 | MGLL (0.54) | MGLLALDH1A1KMT2AGAAMEN1 | |
| SCHEMBL18538548 | 0.78 | MGLL (0.58) | MGLLALDH1A1MAPTKMT2AGAA | |
| SCHEMBL24541383 | 0.76 | MGLL (0.70) | MGLLALDH1A1MAPTKMT2AMEN1 | |
| SCHEMBL24753819 | 0.76 | MGLL (0.61) | MGLLALDH1A1KMT2AMEN1HTT | |
| SCHEMBL487831 | 0.74 | MGLL (0.58) | MGLLALDH1A1KMT2AMEN1HTT | |
| SCHEMBL26452127 | 0.74 | MGLL (0.54) | MGLLALDH1A1KMT2AMEN1HTT | |
| SCHEMBL8766700 | 0.73 | MGLL (0.53) | MGLLALDH1A1KMT2AMEN1HTT |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 10 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-11008420-B2 | Resin composition, prepreg, metal foil-clad laminate, resin composite sheet, and printed wiring board | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2021-05-18 | — | — | US | disclosed |
| US-20210032404-A1 | RESIN COMPOSITION, PREPREG, METAL FOIL-CLAD LAMINATE, RESIN COMPOSITE SHEET, AND PRINTED WIRING BOARD | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2021-02-04 | — | — | US | disclosed |
| EP-3290480-B1 | RESIN COMPOSITION, PREPREG, LAMINATE AND MULTILAYER PRINTED WIRING BOARD | SHOWA DENKO MATERIALS CO LTD (JP) | 2020-12-09 | — | — | EP | disclosed |
| US-20180134842-A1 | RESIN COMPOSITION, PREPREG, LAMINATE AND MULTILAYER PRINTED WIRING BOARD | RESONAC CORPORATION (JP) | 2018-05-17 | — | — | US | disclosed |
| US-20180127547-A1 | THERMOSETTING RESIN COMPOSITION, PREPREG, LAMINATE AND MULTILAYER PRINTED WIRING BOARD | RESONAC CORPORATION (JP) | 2018-05-10 | — | — | US | disclosed |
| EP-3290480-A1 | RESIN COMPOSITION, PREPREG, LAMINATE AND MULTILAYER PRINTED WIRING BOARD | Hitachi Chemical Company, Ltd. (JP) | 2018-03-07 | — | — | EP | disclosed |
| US-9828466-B2 | Polyphenylene ether derivative having N-substituted maleimide group, and heat curable resin composition, resin varnish, prepreg, metal-clad laminate, and multilayer printed wiring board using same | HITACHI CHEMICAL COMPANY, LTD (JP) | 2017-11-28 | — | — | US | disclosed |
| US-9828466-B2 | Polyphenylene ether derivative having N-substituted maleimide group, and heat curable resin composition, resin varnish, prepreg, metal-clad laminate, and multilayer printed wiring board using same | HITACHI CHEMICAL COMPANY, LTD (JP) | 2017-11-28 | — | — | US | disclosed |
| US-20170051109-A1 | POLYPHENYLENE ETHER DERIVATIVE HAVING N-SUBSTITUTED MALEIMIDE GROUP, AND HEAT CURABLE RESIN COMPOSITION, RESIN VARNISH, PREPREG, METAL-CLAD LAMINATE, AND MULTILAYER PRINTED WIRING BOARD USING SAME | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2017-02-23 | — | — | US | disclosed |
| US-20170051109-A1 | POLYPHENYLENE ETHER DERIVATIVE HAVING N-SUBSTITUTED MALEIMIDE GROUP, AND HEAT CURABLE RESIN COMPOSITION, RESIN VARNISH, PREPREG, METAL-CLAD LAMINATE, AND MULTILAYER PRINTED WIRING BOARD USING SAME | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2017-02-23 | — | — | US | disclosed |